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README

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TPS65632RTER

Texas Instruments · Power Management Specialized - PMIC · WQFN-16-EP(3x3)

TPS65632RTER from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SWP1 input Boost converter 1 (VPOS) switch pin; absolute maximum rating is -0.3 V to 5 V with respect to GND.
2 PGND1 power_in Boost converter 1 power ground, to be connected to AGND and PGND2 through the exposed thermal pad.
3 OUTP1 output Boost converter 1 (VPOS) output, factory-fixed at 4.6 V; absolute maximum rating is -0.3 V to 5 V.
4 FBS input Boost converter 1 output sense input, to be connected directly to the positive terminal of the main output capacitor for highest accuracy; if floating or grounded, VPOS is sensed through OUTP1.
5 SELP2 input AVDD output voltage select: AVDD = 7.7 V when SELP2 is low (or left floating) and 5.8 V when high; absolute maximum rating is -0.3 V to 5.5 V.
6 CT bidirectional Capacitor connection that sets the VNEG transition time, with τ = 300 kΩ (typical CT pin resistance) × C(CT); absolute maximum rating is -0.3 V to 3.6 V.
7 AGND power_in Analog ground, to which the CT capacitor ground must be connected directly and which must be tied to PGND1, PGND2 and the exposed pad.
8 EN input Boost converter 2 (AVDD) enable; logic high minimum 1.2 V, logic low maximum 0.4 V, absolute maximum rating 5.5 V.
9 CTRL input Enables the device when pulled high (disables when low) and programs VNEG by counting rising edges, with -4.0 V default and a -1.4 V to -5.4 V range; absolute maximum rating is 5.5 V.
10 OUTN output Inverting buck-boost converter output (VNEG), with absolute limits of -6.0 V to 0.3 V.
11 SWN bidirectional Inverting buck-boost converter switch pin, with absolute limits of -6.5 V to 4.8 V.
12 PVIN power_in Inverting buck-boost converter power-stage supply; absolute maximum rating is -0.3 V to 5 V, and the device input supply range is 2.9 V to 4.5 V.
13 OUTP2 output Boost converter 2 (AVDD) output; absolute maximum rating is -0.3 V to 8.5 V.
14 PGND2 power_in Boost converter 2 power ground, to be connected to AGND and PGND1 through the exposed thermal pad.
15 SWP2 input Boost converter 2 (AVDD) switch pin; absolute maximum rating is -0.3 V to 12 V.
16 AVIN power_in Supply voltage pin for the device; absolute maximum rating is -0.3 V to 5 V, and the input supply range is 2.9 V to 4.5 V.
17 EP power_in Exposed thermal pad, to be connected to AGND, PGND1 and PGND2 and soldered to the PCB for thermal and mechanical performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16-EP(3x3)
Category Power Management ICs
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
SWP1, OUTP1, FBS, PVIN, AVIN voltage -0.3 5 V 4
SWP2 voltage -0.3 12 V 4
OUTP2 voltage -0.3 8.5 V 4
OUTN voltage -6 0.3 V 4
SWN voltage -6.5 4.8 V 4
CTRL, EN, SELP2 voltage -0.3 5.5 V 4
CT voltage -0.3 3.6 V 4
Operating virtual junction temperature TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
Input supply voltage range VI 2.9 3.7 4.5 V 4
Operating junction temperature TJ -40 85 125 °C 4
Input voltage range VI 2.9 3.7 4.5 V 5
Shutdown current ISD 0.25 5 µA CTRL = GND, EN = GND, sum of current flowing into AVIN and PVIN 5
Under-voltage lockout threshold, falling VUVLO 1.8 2.1 V VI falling 5
Under-voltage lockout threshold, rising VUVLO 2.1 2.5 V VI rising 5
VPOS output voltage variation, 25°C to 85°C VPOS -0.5 0.5 % 25°C ≤ TA ≤ 85°C, No load 5
VPOS output voltage variation, -30°C to 85°C VPOS -0.8 0.8 % -30°C ≤ TA ≤ 85°C, No load 5
Switch current limit (boost 1) ISW1 0.8 1 1.4 A Inductor valley current 5
Short-circuit threshold in operation (VPOS falling) VSCP1 3.95 4.1 4.28 V VPOS falling 5
Output voltage sense threshold, increasing VT 200 300 550 mV V(OUTP1), V(FBS) increasing 5
Output voltage sense threshold, decreasing VT 100 200 450 mV V(OUTP1), V(FBS) decreasing 5
FBS pin pull-down resistance R(FBS) 2 4 6 MΩ 5
Discharge resistance (boost 1) RDCHG1 10 30 70 Ω CTRL = GND, I(SWP1) = 1mA 5
VNEG output voltage range VNEG -5.4 -1.4 V 5
VNEG output voltage accuracy, 25°C to 85°C VNEG -50 50 mV 25°C ≤ TA ≤ 85°C, no load 5
VNEG output voltage accuracy, -30°C to 85°C VNEG -60 60 mV -30°C ≤ TA ≤ 85°C, no load 5
SWN switch current limit ISW2 1.5 2.2 3 A VI = 2.9 V 5
Short circuit threshold in operation (voltage increase from nominal VNEG) VSCP2 300 500 700 mV Voltage increase from nominal VNEG 5
Short circuit threshold in start up VSCP2 180 200 230 mV start up 5
Discharge resistance (inverting buck-boost) RDCHG2 130 150 170 Ω CTRL = GND, I(SWN) = 1 mA 5
AVDD output voltage accuracy, 25°C to 85°C AVDD -1 1 % 25°C ≤ TA ≤ 85°C, no load 6
AVDD output voltage accuracy, -30°C to 85°C AVDD -1.3 1.3 % -30°C ≤ TA ≤ 85°C, no load 6
Switch current limit (boost 2) ILIM3 0.25 0.35 0.45 A Inductor valley current 6
Discharge resistance (boost 2) RDCHG3 10 30 70 Ω EN = GND, I(SWP2) = 1 mA 6
Logic input high level voltage VIH 1.2 V 6
Logic input low level voltage VIL 0.4 V 6
Pull-down resistance (CTRL interface) R 150 400 860 kΩ 6
CT pin resistance RCT 150 300 500 kΩ 6
Initialization time tINIT 300 400 µs 6
Data storage/accept time period tSTORE 30 80 µs 6
Shutdown time period tSDN 30 80 µs 6
Low-level pulse duration tLOW 2 10 25 µs 6
High-level pulse duration tHIGH 2 10 25 µs 6
Shutdown pulse duration tOFF 200 µs CTRL = low 6
Junction-to-ambient thermal resistance RθJA 42.9 °C/W 4
Junction-to-case (top) thermal resistance RθJC(top) 44 °C/W 4
Junction-to-board thermal resistance RθJB 14.2 °C/W 4
Junction-to-top characterization parameter ψJT 0.6 °C/W 4
Junction-to-board characterization parameter ψJB 14.1 °C/W 4
Junction-to-case (bottom) thermal resistance RθJC(bot) 3.3 °C/W 4

CAD (KiCad official)

  • Symbol: TPS65632RTER
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps65632rter-etched.step / tps65632rter-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65632rter.step / tps65632rter.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (27 pp, sha256 d873bac20b81c803, retrieved 2026-10-28, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF