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TPS65266RHBT

Texas Instruments · DC-DC Converters · VQFN-32-EP(5x5)

TPS65266RHBT from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AGND power_in Analog ground pin; the datasheet gives no separate limits for this pin, and analog ground must be routed separately from high-current power grounds.
2 AGND power_in Analog ground pin; the datasheet gives no separate limits for this pin, and analog ground must be routed separately from high-current power grounds.
3 AGND power_in Analog ground pin; the datasheet gives no separate limits for this pin, and analog ground must be routed separately from high-current power grounds.
4 PGOOD output Open-drain power-good output that asserts low if a buck output is outside its regulation range due to thermal shutdown, overcurrent, undervoltage, or ENx low.
5 VINQ power_in Input voltage for the converter controller and reference bias (2.7 V to 6.5 V recommended); TI recommends a 1-µF capacitor from this pin to analog ground placed as near as possible to the pin.
6 FB2 input Kelvin-sensing feedback input for the buck2 output voltage, connected to the buck2 feedback resistor divider.
7 COMP2 passive Error-amplifier output and loop-compensation pin for buck2, compensated with a series resistor and capacitor in peak-current PWM mode.
8 SS2 passive Soft-start and tracking input for buck2 with an internal 5.5-µA pullup; the soft-start time is set by a capacitor from this pin to ground.
9 BST2 power_out Bootstrap supply for the buck2 high-side gate driver; connect a 47-nF (recommended) capacitor from BST2 to LX2.
10 LX2 output Switching node for buck2 connecting to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the VIN2 voltage.
11 PGND2 power_in Power ground for buck2, to be connected as close as practical to the negative terminal of the VIN2 input ceramic capacitor.
12 VIN2 power_in Input power supply for buck2, to be connected as close as practical to the positive terminal of an input ceramic capacitor (10 µF suggested).
13 VIN3 power_in Input power supply for buck3, to be connected as close as practical to the positive terminal of an input ceramic capacitor (10 µF suggested).
14 PGND3 power_in Power ground for buck3, to be connected as close as practical to the negative terminal of the VIN3 input ceramic capacitor.
15 LX3 output Switching node for buck3 connecting to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the VIN3 voltage.
16 BST3 power_out Bootstrap supply for the buck3 high-side gate driver; connect a 47-nF (recommended) capacitor from BST3 to LX3.
17 SS3 passive Soft-start and tracking input for buck3 with an internal 5.5-µA pullup; the soft-start time is set by a capacitor from this pin to ground.
18 COMP3 passive Error-amplifier output and loop-compensation pin for buck3, compensated with a series resistor and capacitor in peak-current PWM mode.
19 FB3 input Kelvin-sensing feedback input for the buck3 output voltage, connected to the buck3 feedback resistor divider.
20 ROSC passive Oscillator frequency programming pin; an external resistor connected here sets the switching frequency.
21 AGND power_in Analog ground common to the buck controllers and other analog circuits, to be routed separately from high-current power grounds to the negative terminal of the VINQ bypass capacitor.
22 FB1 input Kelvin-sensing feedback input for the buck1 output voltage, connected to the buck1 feedback resistor divider.
23 COMP1 passive Error-amplifier output and loop-compensation pin for buck1, compensated with a series resistor and capacitor in peak-current PWM mode.
24 SS1 passive Soft-start and tracking input for buck1 with an internal 5.5-µA pullup; the soft-start time is set by a capacitor from this pin to ground.
25 BST1 power_out Bootstrap supply for the buck1 high-side gate driver; connect a 47-nF (recommended) capacitor from BST1 to LX1.
26 LX1 output Switching node for buck1 connecting to the inductor and bootstrap capacitor, swinging from a diode drop below ground up to the VIN1 voltage.
27 PGND1 power_in Power ground for buck1, to be connected as close as practical to the negative terminal of the VIN1 input ceramic capacitor.
28 VIN1 power_in Input power supply for buck1, to be connected as close as practical to the positive terminal of an input ceramic capacitor (10 µF suggested).
29 EN1 input Enable for buck1; float to enable, and a resistor divider can be used to adjust its input undervoltage lockout.
30 EN2 input Enable for buck2; float to enable, and a resistor divider can be used to adjust its input undervoltage lockout.
31 EN3 input Enable for buck3; float to enable, and a resistor divider can be used to adjust its input undervoltage lockout.
32 GND power_in Ground pin.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN1, VIN2, VIN3, VINQ -0.3 7 V 5
LX1, LX2, LX3 -1 7 V maximum withstand voltage transient <20 ns 5
BST1, BST2, BST3 -0.3 7 V referenced to LX1, LX2, LX3 pins respectively 5
EN1, EN2, EN3, PGOOD -0.3 7 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3, ROSC -0.3 3.6 V 5
AGND, PGND1, PGND2, PGND3 -0.3 0.3 V 5
Operating junction temperature TJ -40 150 °C 5
Storage temperature Tstg -55 150 °C 5
VIN1, VIN2, VIN3, VINQ 2.7 6.5 V 5
LX1, LX2, LX3 -0.8 6.5 V maximum withstand voltage transient <20 ns 5
BST1, BST2, BST3 -0.1 6.5 V referenced to LX1, LX2, LX3 pins respectively 5
EN1, EN2, EN3, PGOOD -0.1 6.5 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3, ROSC -0.1 3 V 5
Operating junction temperature TJ -40 125 °C 5
Junction-to-ambient thermal resistance RθJA 34.2 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 27.5 °C/W 5
Junction-to-board thermal resistance RθJB 8.3 °C/W 5
Junction-to-top characterization parameter ψJT 0.4 °C/W 5
Junction-to-board characterization parameter ψJB 8.3 °C/W 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 2.8 °C/W 5
Input voltage range VIN 2.7 6.5 V 6
UVLO VIN undervoltage lockout UVLO 2.35 2.45 2.6 V VIN rising 6
UVLO VIN undervoltage lockout UVLO 2.15 2.25 2.35 V VIN falling 6
Soft-start charging current ISSX 4.5 5.5 6.5 µA 6
Buck1 peak inductor current limit ILIMIT1 3.9 4.6 5.3 A 6
Buck2/3 peak inductor current limit ILIMIT2/3 2.5 3.1 3.7 A 6
EN1/2/3 pullup current IENX1 1.8 2.1 2.4 µA ENx = 1 V 6
Feedback voltage VFB 0.594 0.6 0.606 V VCOMP = 1.2 V 6
Switching frequency FSW 920 1000 1080 kHz ROSC = 51.1 kΩ 7
Switching frequency range FSW_range 250 2400 kHz 7
Clock sync frequency range FSYNC 250 2400 kHz 7

CAD (KiCad official)

  • Symbol: TPS65266RHBT
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps65266rhbt-etched.step / tps65266rhbt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65266rhbt.step / tps65266rhbt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 76c5a2fb9d90a942, retrieved 2026-10-12, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF