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Contents

README

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TPS65261RHBR

Texas Instruments · DC-DC Converters · VQFN-32-EP(5x5)

TPS65261RHBR from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN3 input Enable pin for buck3; float to enable or configure input undervoltage lockout with external resistor divider; operating range -0.1V to 6.3V, typical rising threshold 1.26V
2 PGOOD output Open-drain power good output; asserts low when any buck output is out of regulation (±2.5%), thermal shutdown active, overcurrent condition exists, or enable pin low; max sink 1mA at 0.4V
3 RESET output Open-drain power failure output signal; asserts low when VDIV input drops below 1.23V threshold for power failure detection; deglitch time 12-16 cycles
4 MODE input Mode select input; when high, enables automatic power-up/power-down sequencing based on EN1/EN2/EN3 states; when low, enables independent enable pin control; operating range -0.1V to 6.3V
5 V7V power_out Internal LDO output supplying gate drivers and internal logic; 6.3V typical (6.0V to 6.6V range), maximum current 175mA; requires 10µF ceramic capacitor to power ground
6 FB2 input Feedback Kelvin sensing pin for buck2 output voltage regulation; connect to resistor divider network for output voltage setting; operating range -0.1V to 3V
7 COMP2 output Error amplifier output for buck2 loop compensation; transconductance 300µS; connect series R and C for control loop compensation in peak current mode; operating range -0.1V to 3V
8 SS2 input Soft-start and tracking input for buck2 with internal 5µA pullup current source; connect capacitor to ground to program soft-start time; operating range -0.1V to 3V
9 BST2 power_in Bootstrap supply for buck2 high-side gate driver; connect 47nF ceramic capacitor between BST2 and LX2 pins; operating range -0.3V to 7V referenced to LX2
10 LX2 output Buck2 switching node connected to external inductor and bootstrap capacitor; voltage swings from -0.8V (maximum withstand) to PVIN2 voltage (maximum 18V); high di/dt node requiring careful PCB layout
11 PGND2 power_in Buck2 power ground connection; connect as close as practical to negative terminal of PVIN2 input ceramic capacitor to minimize inductance
12 PVIN2 power_in Buck2 input power supply; operating range 4.5V to 18V; connect as close as practical to positive terminal of 10µF minimum input ceramic capacitor with clean voltage path
13 PVIN3 power_in Buck3 input power supply; operating range 4.5V to 18V; connect as close as practical to positive terminal of 10µF minimum input ceramic capacitor with clean voltage path
14 PGND3 power_in Buck3 power ground connection; connect as close as practical to negative terminal of PVIN3 input ceramic capacitor to minimize inductance
15 LX3 output Buck3 switching node connected to external inductor and bootstrap capacitor; voltage swings from -0.8V (maximum withstand) to PVIN3 voltage (maximum 18V); high di/dt node requiring careful PCB layout
16 BST3 power_in Bootstrap supply for buck3 high-side gate driver; connect 47nF ceramic capacitor between BST3 and LX3 pins; operating range -0.3V to 7V referenced to LX3
17 SS3 input Soft-start and tracking input for buck3 with internal 5µA pullup current source; connect capacitor to ground to program soft-start time; operating range -0.1V to 3V
18 COMP3 output Error amplifier output for buck3 loop compensation; transconductance 300µS; connect series R and C for control loop compensation in peak current mode; operating range -0.1V to 3V
19 FB3 input Feedback Kelvin sensing pin for buck3 output voltage regulation; connect to resistor divider network for output voltage setting; operating range -0.1V to 3V
20 ROSC input Oscillator frequency programmable pin; connect external resistor to ground to set switching frequency from 250kHz to 2MHz; operating range -0.1V to 3V
21 AGND power_in Analog ground for buck controllers and analog signal circuits; route separately from high current power grounds to negative terminal of VIN bypass capacitor to minimize noise coupling
22 FB1 input Feedback Kelvin sensing pin for buck1 output voltage regulation; connect to resistor divider network for output voltage setting; operating range -0.1V to 3V
23 COMP1 output Error amplifier output for buck1 loop compensation; transconductance 300µS; connect series R and C for control loop compensation in peak current mode; operating range -0.1V to 3V
24 SS1 input Soft-start and tracking input for buck1 with internal 5µA pullup current source; connect capacitor to ground to program soft-start time; operating range -0.1V to 3V
25 BST1 power_in Bootstrap supply for buck1 high-side gate driver; connect 47nF ceramic capacitor between BST1 and LX1 pins; operating range -0.3V to 7V referenced to LX1
26 LX1 output Buck1 switching node connected to external inductor and bootstrap capacitor; voltage swings from -0.8V (maximum withstand) to PVIN1 voltage (maximum 18V); high di/dt node requiring careful PCB layout and 180° phase shift from buck2/3 clocks
27 PGND1 power_in Buck1 power ground connection; connect as close as practical to negative terminal of PVIN1 input ceramic capacitor to minimize inductance
28 PVIN1 power_in Buck1 input power supply; operating range 4.5V to 18V; connect as close as practical to positive terminal of 10µF minimum input ceramic capacitor with clean voltage path
29 VIN power_in Buck controller power supply for internal logic and bias circuits; operating range 4.5V to 18V; UVLO thresholds: rising 4.25V typical, falling 3.75V typical, hysteresis 500mV
30 VDIV input Input voltage threshold for power failure detection; external resistor divider sets detection threshold to 1.23V typical; 1µA pullup current provides threshold hysteresis; operating range -0.1V to 6.3V
31 EN1 input Enable pin for buck1; float to enable or configure input undervoltage lockout with external resistor divider; operating range -0.1V to 6.3V, typical rising threshold 1.26V
32 EN2 input Enable pin for buck2; float to enable or configure input undervoltage lockout with external resistor divider; operating range -0.1V to 6.3V, typical rising threshold 1.26V
33 Thermal Pad passive Exposed thermal pad for junction-to-board heat dissipation; no internal electrical wire bond to die; must be soldered to PCB ground plane for optimal thermal performance

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Power Management (PMIC)
Pins 33

CAD (KiCad official)

  • Symbol: TPS65261RHBR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps65261rhbr-etched.step / tps65261rhbr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65261rhbr.step / tps65261rhbr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (48 pp, sha256 304396ee72bd117c, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF