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TPS65261-1RHBR

Texas Instruments · DC-DC Converters · VQFN-32-EP(5x5)

TPS65261-1RHBR from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN3 input Enable for buck3; float to enable, and a resistor divider can set the buck3 input undervoltage lockout.
2 PGOOD output Open-drain output that asserts low if any buck output is out of regulation due to thermal shutdown, overcurrent, undervoltage or ENx shutdown.
3 RESET output Open-drain power failure output signal.
4 MODE input When high, provides an automatic power-up/power-down sequence according to the states of EN1, EN2 and EN3.
5 V7V power_out Internal LDO output for the gate driver and internal controller; connect a 10-µF capacitor from this pin to power ground.
6 FB2 input Feedback Kelvin sensing pin for the buck2 output voltage; connect to the buck2 resistor divider.
7 COMP2 passive Error amplifier output and loop compensation pin for buck2; connect a series resistor and capacitor.
8 SS2 passive Soft-start and tracking input for buck2 with an internal 5-µA pullup; soft-start time is set by a capacitor to ground.
9 BST2 power_out Bootstrap supply for the buck2 high-side gate driver; connect a capacitor (recommend 47 nF) from BST2 to LX2.
10 LX2 output Buck2 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN2 voltage.
11 PGND2 power_in Power ground for buck2; place as close as practical to the negative terminal of the VIN2 input ceramic capacitor.
12 PVIN2 power_in Input power supply for buck2; place as close as practical to the positive terminal of an input ceramic capacitor (suggested 10 µF).
13 PVIN3 power_in Input power supply for buck3; place as close as practical to the positive terminal of an input ceramic capacitor (suggested 10 µF).
14 PGND3 power_in Power ground for buck3; place as close as practical to the negative terminal of the VIN3 input ceramic capacitor.
15 LX3 output Buck3 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN3 voltage.
16 BST3 power_out Bootstrap supply for the buck3 high-side gate driver; connect a capacitor (recommend 47 nF) from BST3 to LX3.
17 SS3 passive Soft-start and tracking input for buck3 with an internal 5-µA pullup; soft-start time is set by a capacitor to ground.
18 COMP3 passive Error amplifier output and loop compensation pin for buck3; connect a series resistor and capacitor.
19 FB3 input Feedback Kelvin sensing pin for the buck3 output voltage; connect to the buck3 resistor divider.
20 ROSC passive Oscillator frequency programming pin; an external resistor sets the switching frequency between 250 kHz and 2 MHz.
21 AGND power_in Analog ground common to the buck controllers and analog circuits; route separately from high-current power grounds to the negative terminal of the VIN bypass capacitor.
22 FB1 input Feedback Kelvin sensing pin for the buck1 output voltage; connect to the buck1 resistor divider.
23 COMP1 passive Error amplifier output and loop compensation pin for buck1; connect a series resistor and capacitor.
24 SS1 passive Soft-start and tracking input for buck1 with an internal 5-µA pullup; soft-start time is set by a capacitor to ground.
25 BST1 power_out Bootstrap supply for the buck1 high-side gate driver; connect a capacitor (recommend 47 nF) from BST1 to LX1.
26 LX1 output Buck1 switching node to the inductor and bootstrap capacitor; swings from a diode drop below ground up to the PVIN1 voltage.
27 PGND1 power_in Power ground for buck1; place as close as practical to the negative terminal of the VIN1 input ceramic capacitor.
28 PVIN1 power_in Input power supply for buck1; place as close as practical to the positive terminal of an input ceramic capacitor (suggested 10 µF).
29 VIN power_in Buck controller power supply input; recommended operating range is 4.5 V to 18 V.
30 VDIV input Input voltage threshold for power failure detection of the input voltage.
31 EN1 input Enable for buck1; float to enable, and a resistor divider can set the buck1 input undervoltage lockout.
32 EN2 input Enable for buck2; float to enable, and a resistor divider can set the buck2 input undervoltage lockout.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-32-EP(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
PVIN1, PVIN2, PVIN3, VIN input voltage -0.3 20 V 5
LX1, LX2, LX3 switch node voltage -1 20 V Maximum withstand voltage transient < 20 ns 5
BST1, BST2, BST3 boot voltage -0.3 7 V referenced to LX1, LX2, LX3 pins respectively 5
EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV voltage -0.3 7 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3, ROSC voltage -0.3 3.6 V 5
AGND, PGND1, PGND2, PGND3 voltage -0.3 0.3 V 5
Operating junction temperature TJ -40 125 °C 5
Storage temperature range Tstg -55 150 °C 5
PVIN1, PVIN2, PVIN3, VIN input voltage range 4.5 18 V 5
LX1, LX2, LX3 switch node voltage -0.8 18 V Maximum withstand voltage transient < 20 ns 5
BST1, BST2, BST3 boot voltage -0.1 6.8 V referenced to LX1, LX2, LX3 pins respectively 5
EN1, EN2, EN3, PGOOD, V7V, MODE, RESET, VDIV voltage -0.1 6.3 V 5
FB1, FB2, FB3, COMP1, COMP2, COMP3, SS1, SS2, SS3, ROSC voltage -0.1 3 V 5
Operating ambient temperature TA -40 85 °C Operating junction temperature 5
Operating junction temperature TJ -40 125 °C 5
VIN input voltage range 4.5 18 V 6
VIN undervoltage lockout, rising UVLO 4 4.25 4.5 V VIN rising 6
VIN undervoltage lockout, falling UVLO 3.5 3.75 4 V VIN falling 6
V7V LDO output voltage V7V 6 6.3 6.6 V V7V load current = 0 A 6
Feedback voltage VFB 0.596 0.6 0.605 V VCOMP = 1.2 V, TJ = 25°C 6
Feedback voltage VFB 0.594 0.6 0.606 V VCOMP = 1.2 V, TJ = -40°C to 125°C 6
Soft start charging current ISSX 4.3 5 6 µA 6
Buck1 peak inductor current limit ILIMIT1 4.33 5.1 6.02 A 6
Buck2/3 peak inductor current limit ILIMIT2/3 2.6 3.1 3.73 A 6
VDIV threshold VDIVth 1.18 1.23 1.26 V 7
RESET deglitch on the falling edge Tdeglitch_F 12 14 16 cycles 7
Switching frequency FSW 560 600 640 kHz ROSC = 73.2 kΩ 7
Switching frequency range FSW_range 250 2000 kHz 7
Junction-to-ambient thermal resistance RθJA 31.6 °C/W RHB (32 pins) 5
Junction-to-case (top) thermal resistance RθJC(top) 23.4 °C/W RHB (32 pins) 5
Junction-to-board thermal resistance RθJB 6.1 °C/W RHB (32 pins) 5
Junction-to-top characterization parameter ψJT 0.2 °C/W RHB (32 pins) 5
Junction-to-board characterization parameter ψJB 6.1 °C/W RHB (32 pins) 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 0.9 °C/W RHB (32 pins) 5

CAD (KiCad official)

  • Symbol: TPS65261-1RHBR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps65261-1rhbr-etched.step / tps65261-1rhbr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps65261-1rhbr.step / tps65261-1rhbr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (47 pp, sha256 1f24f24dc34c30ef, retrieved 2026-11-06, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF