TPS62751DSKR from Texas Instruments, in a SON-10-EP(2.5x2.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	PGND	power_in	Power GND pin for the N-MOSFET.
2	L	output	Switch pin connected to the internal MOSFET switches; the external inductor connects between this terminal and the output capacitor.
3	H/L	input	High enables the upper current limit threshold set by RSET_H and low enables the lower threshold set by RSET_L; this pin must be terminated.
4	EN	input	Enable pin: pulling low forces the device into shutdown mode and pulling high enables the device; this pin must be terminated.
5	FB	input	Feedback pin for the internal regulation loop; connect the external resistor divider to this pin, or connect it directly to the output capacitor for the fixed output voltage option.
6	AGND	power_in	Analog GND pin for the internal analog circuitry.
7	ISET_L	input	Sets the lower average input current limit by external resistor.
8	ISET_U	input	Sets the upper average input current limit by external resistor.
9	PVIN	power_in	VIN power supply pin for the output stage.
10	AVIN	power_in	VIN low-noise analog supply for the internal analog circuitry; this pin must be connected to PVIN.
11	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SON-10-EP(2.5x2.5)
Category	Power Management (PMIC)
Pins	11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage	VIN	2.9		6	V		2
Input Voltage Range	VIN	2.9		6	V		3
Operating Quiescent Current (TPS62751)	IQ			30	mA	IOUT = 0 mA, device not switching	3
Shutdown Current	ISD		0.2	3	μA	EN = GND	3
Undervoltage Lockout Threshold, Falling	VUVLO	2.4			V	Falling	3
Undervoltage Lockout Threshold, Rising	VUVLO	2.9			V	Rising	3
High Level Input Voltage	VIH	1			V	2.9 V ≤ VIN ≤ 6.0V	3
Low Level Input Voltage	VIL			0.4	V	2.9 V ≤ VIN ≤ 6.0 V	3
Input bias Current	IIN		0.01	1	μA	Pin tied to GND or VIN	3
High side MOSFET On-Resistance (H/L=HI)	RDS(ON)		130	290	mΩ	VIN = 5.0 V, VGS = 6.5 V	3
High side MOSFET On-Resistance (H/L=LO)	RDS(ON)		282	550	mΩ	VIN = 5.0 V, VGS = 6.5 V	3
Low Side MOSFET On-Resistance	RDS(ON)		58	125	mΩ	VIN = VGS = 5.0 V	3
Forward Current Limit High-Side and Low side	ILIMF	1200	1500	1800	mA	VIN = VGS = 5.0 V	3
Programmable Input current Range, ILIM_U selected	IIN(MAX)	300		1300	mA	ILIM_U selected, H/L = High	3
Programmable Input current Range, ILIM_L selected	IIN(MAX)	50		300	mA	ILIM_L selected, H/L = Low	3
Current limit accuracy		-10		10	%	ILIM_U selected	3
Thermal shutdown	TSD		150		°C	Increasing junction temperature	3
Thermal shutdown hysteresis	TSD		20		°C	Decreasing junction temperature	3
Oscillator Frequency	fSW	2	2.25	2.5	MHz	2.9 V ≤ VIN ≤ 6.0 V	3
Reference Voltage	Vref		600		mV		3
Feedback Voltage	VFB(PWM)	-1.5		1.5	%	PWM operation, 2.9 V ≤ VIN ≤ 6.0V	3
Internal discharge resistor	R(DIS_CH)	85	235	300	Ω	Activated with EN = GND	3
Output voltage range for adjustable voltage	VOUT	0.8			V	Upper limit 0.85 × VIN	2
Operating ambient temperature	TA	-40		85	°C		2
Operating virtual junction temperature	TJ	-40		125	°C		2
Input voltage range VIN, AVIN	VIN	-0.3		7	V	Respect to network ground	2
Voltage range at EN, H/L, FB		-0.3		7	V	VIN + 0.3, ≤7.0 V	2
Voltage on L, ILim_U, ILim_L		-0.3		7	V		2
ESD rating HBM				4	kV	Human body model	2
ESD rating CDM				1.5	kV	Charge device model	2
ESD rating machine model				200	V	Machine model	2
Maximum operating junction temperature	TJ	-40		125	°C		2
Storage temperature range	Tstg	-65		150	°C		2
Junction-to-ambient thermal resistance	RθJA		60.6		°C/W	DSK package, high-K board	2
Junction-to-case (top) thermal resistance	RθJP		6.3		°C/W	DSK package	2
Junction-to-case thermal resistance	RθJC		40		°C/W	DSK package	2

CAD (KiCad official)

Symbol: TPS62751DSKR
Footprint: Package_SON:WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
3D model: SON-10-EP(2.5x2.5) (KiCad packages3D, STEP)
3D model files: tps62751dskr-etched.step / tps62751dskr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps62751dskr.step / tps62751dskr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (32 pp, sha256 d102ff69b4937fbd, retrieved 2026-11-05, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

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TPS62751DSKR

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3D Model

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