component
TPS62172DSGR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS62172DSGR
Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)
TPS62172DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground for high-current switching path. |
| 2 | VIN | power_in | Supply voltage input with operating range 3 V to 17 V per Recommended Operating Conditions section 7.3. |
| 3 | EN | input | Enable input; high enables device operation, low disables with typical shutdown current of 1.5 µA and internal pull-down resistor of approximately 400 kΩ. |
| 4 | AGND | power_in | Analog ground reference that must be connected to exposed thermal pad. |
| 5 | FB | input | Voltage feedback input for adjustable versions; for fixed TPS62172 output version, internally pulled down and recommended to connect to AGND for improved thermal performance. |
| 6 | VOS | input | Output voltage sense input for internal control loop circuitry providing fast transient response and output regulation. |
| 7 | SW | output | Switch node connected to internal MOSFET switches; connect inductor between SW and output capacitor for DC-DC conversion. |
| 8 | PG | tri_state | Open-drain power good output indicator; high impedance when VOUT ready (≥92% nominal regulation), low when below regulation (≤87% nominal), can sink 2 mA and requires external pull-up resistor. |
| 9 | Exposed Thermal Pad | power_in | Electrical connection to AGND that must be soldered to printed circuit board for mechanical reliability and thermal dissipation; junction-to-board thermal resistance RθJB is 15.5 °C/W per section 7.4. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range | VIN | 3 | 17 | V | 5 | ||
| Operating quiescent current | IQ | 17 | 30 | µA | EN = High, IOUT = 0 mA, device not switching | 5 | |
| Operating quiescent current | IQ | 17 | 25 | µA | TJ = -40°C to +85°C | 5 | |
| Shutdown current | ISD | 1.5 | 25 | µA | EN = Low | 5 | |
| Shutdown current | ISD | 1.5 | 4 | µA | TJ = -40°C to +85°C | 5 | |
| Undervoltage lockout threshold | VUVLO | 2.6 | 2.7 | 2.82 | V | Falling input voltage | 5 |
| Undervoltage lockout hysteresis | 180 | mV | 5 | ||||
| Thermal shutdown temperature | TSD | 160 | °C | rising temperature | 5 | ||
| Thermal shutdown hysteresis | TSD | 20 | °C | falling temperature | 5 | ||
| High level input threshold voltage (EN) | VEN_H | 0.9 | V | 5 | |||
| Low level input threshold voltage (EN) | VEN_L | 0.3 | V | 5 | |||
| Input leakage current (EN) | ILKG_EN | 0.01 | 1 | µA | EN = VIN or GND | 5 | |
| Power good threshold voltage, rising | VTH_PG | 92 | 95 | 98 | %VOUT | Rising (%VOUT) | 5 |
| Power good threshold voltage, falling | VTH_PG | 87 | 90 | 93 | %VOUT | Falling (%VOUT) | 5 |
| Power good output low voltage | VOL_PG | 0.07 | 0.3 | V | IPG = –2 mA | 5 | |
| Input leakage current (PG) | ILKG_PG | 1 | 400 | nA | VPG = 1.8 V | 5 | |
| High-side MOSFET ON-resistance | RDS(ON) | 300 | 600 | mΩ | VIN ≥ 6 V | 5 | |
| High-side MOSFET ON-resistance | RDS(ON) | 430 | mΩ | VIN= 3 V | 5 | ||
| Low-side MOSFET ON-resistance | RDS(ON) | 120 | 200 | mΩ | VIN≥ 6 V | 5 | |
| Low-side MOSFET ON-resistance | RDS(ON) | 165 | mΩ | VIN = 3 V | 5 | ||
| High-side MOSFET forward current limit | ILIMF | 0.85 | 1.05 | 1.35 | A | VIN = 12 V, TJ= 25°C | 5 |
| Initial output voltage accuracy (PWM mode) | -3 | 3 | % | PWM mode operation, VIN ≥ VOUT + 1 V | 5 | ||
| Initial output voltage accuracy (power save mode) | -3.5 | 4 | % | Power save mode operation, COUT= 22 µF | 5 | ||
| DC output voltage load regulation | 0.05 | %/A | VIN = 12 V, VOUT = 3.3 V, PWM mode operation | 5 | |||
| DC output voltage line regulation | 0.02 | %/V | 3 V ≤ VIN ≤ 17 V, VOUT = 3.3 V, IOUT = 0.5 A, PWM mode operation | 5 | |||
| Pin voltage range VIN | VIN | -0.3 | 20 | V | 4 | ||
| Pin voltage range EN, SW (DC) | EN, SW | -0.3 | V | DC; printed maximum is VIN+0.3 | 4 | ||
| Pin voltage range SW (AC) | SW | -2 | 24.5 | V | less than 10ns | 4 | |
| Pin voltage range FB, PG, VOS | FB, PG, VOS | -0.3 | 7 | V | 4 | ||
| Power good sink current | PG | 10 | mA | 4 | |||
| Operating junction temperature (absolute maximum) | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Supply voltage | VIN | 3 | 17 | V | 4 | ||
| Output voltage (family range, adjustable spec) | VOUT | 0.9 | 6 | V | 4 | ||
| Operating junction temperature (recommended) | TJ | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 61.8 | °C/W | DSG (WSON) 8-pin | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 61.3 | °C/W | DSG (WSON) 8-pin | 4 | ||
| Junction-to-board thermal resistance | RθJB | 15.5 | °C/W | DSG (WSON) 8-pin | 4 | ||
| Junction-to-top characterization parameter | ψJT | 0.4 | °C/W | DSG (WSON) 8-pin | 4 | ||
| Junction-to-board characterization parameter | ψJB | 15.4 | °C/W | DSG (WSON) 8-pin | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 8.6 | °C/W | DSG (WSON) 8-pin | 4 |
CAD (KiCad official)
- Symbol:
TPS62172DSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps62172dsgr-etched.step/tps62172dsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62172dsgr.step/tps62172dsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (41 pp, sha256
57da0bfac3369922, retrieved 2026-09-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).