main
Ray tps62160qdsgrq1: specified limits as data (metadata.characteristics, 39 rows from the datasheet) a5ce64d 25d ago

TPS62160QDSGRQ1

Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)

TPS62160QDSGRQ1 from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGND power_in Power ground node; must be soldered to ground plane and exposed thermal pad for adequate dissipation and mechanical reliability.
2 VIN power_in Power supply input; rated for operating voltages from 3V to 17V per device specifications.
3 EN input Enable logic input; high level activates converter operation, low level triggers shutdown mode.
4 AGND power_in Analog ground reference point for feedback divider network and internal control circuitry.
5 FB input Feedback voltage input for adjustable output versions; internally compared to 0.8V reference.
6 VOS input Output voltage sense input; supplies feedback signal to internal compensation network.
7 SW output Switching node output driven by internal high and low-side MOSFETs; connects to external inductor.
8 PG output Open-drain power good output indicating output voltage regulation status; goes high impedance when device is disabled.
9 Exposed Thermal Pad power_in Thermal dissipation interface connected to AGND; must be soldered to PCB ground plane for adequate heat removal.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Pin voltage range VIN VIN -0.3 20 V 4
Pin voltage range EN, SW -0.3 V 4
Pin voltage range FB, PG, VOS -0.3 7 V 4
Power Good sink current PG 10 mA 4
Operating junction temperature range TJ -40 125 °C 4
Storage temperature range Tstg -65 150 °C 4
Supply voltage VIN 3 17 V 4
Output voltage range VOUT 0.9 6 V 4
Operating junction temperature range TJ -40 125 °C 4
Input voltage range VIN 3 17 V 5
Operating quiescent current IQ 17 30 µA EN = High, IOUT = 0 mA, Device not switching 5
Shutdown current ISD 1.8 25 µA EN = Low 5
Undervoltage lockout threshold, falling input voltage VUVLO 2.6 2.7 2.82 V Falling input voltage 5
High level input threshold voltage (EN) VEN_H 0.9 V 5
Low level input threshold voltage (EN) VEN_L 0.3 V 5
Input leakage current (EN) ILKG_EN 0.01 1 µA EN = VIN or GND 5
Power Good threshold voltage, rising VTH_PG 92 95 98 %VOUT Rising (%VOUT) 5
Power Good threshold voltage, falling VTH_PG 87 90 93 %VOUT Falling (%VOUT) 5
Power Good output low VOL_PG 0.07 0.3 V IPG = –2 mA 5
Input leakage current (PG) ILKG_PG 1 400 nA VPG = 1.8 V 5
High-side MOSFET ON-resistance RDS(ON) 300 600 mΩ VIN ≥ 6 V 5
Low-side MOSFET ON-resistance RDS(ON) 120 200 mΩ VIN ≥ 6 V 5
High-side MOSFET forward current limit ILIMF 1.45 1.95 2.45 A VIN = 12 V, TA = 25°C 5
Pin leakage current (FB) ILKG_FB 5 400 nA VFB = 1.2 V 5
Output voltage range 0.9 6 V VIN ≥ VOUT 5
Feedback voltage accuracy, PWM mode -3 3 % PWM Mode operation, VIN ≥ VOUT + 1 V 5
Feedback voltage accuracy, Power Save Mode -3 4 % VOUT Power Save Mode operation, COUT = 2x22 µF 5
DC output voltage load regulation 0.05 %/A VIN = 12 V, VOUT = 3.3 V, PWM Mode operation 5
DC output voltage line regulation 0.02 %/V 3 V ≤ VIN ≤ 17 V, VOUT = 3.3 V, IOUT = 0.5 A, PWM Mode operation 5
Undervoltage lockout hysteresis 180 mV Hysteresis 5
High-side MOSFET ON-resistance, VIN = 3 V RDS(ON) 430 mΩ VIN = 3 V 5
Low-side MOSFET ON-resistance, VIN = 3 V RDS(ON) 165 mΩ VIN = 3 V 5
Internal reference voltage VREF 0.8 V 5
Thermal shutdown temperature TSD 160 °C 5
Thermal shutdown hysteresis 20 °C 5
Junction-to-ambient thermal resistance (DSG) RθJA 61.8 °C/W 4
Junction-to-case (top) thermal resistance (DSG) RθJC(top) 61.3 °C/W 4
Junction-to-board thermal resistance (DSG) RθJB 15.5 °C/W 4
Junction-to-case (bottom) thermal resistance (DSG) RθJC(bot) 8.6 °C/W 4

CAD (KiCad official)

  • Symbol: TPS62160QDSGRQ1
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: tps62160qdsgrq1-etched.step / tps62160qdsgrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps62160qdsgrq1.step / tps62160qdsgrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 8426ddbeb039e891, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF