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Contents

README

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TPS62153RGTR

Texas Instruments · DC-DC Converters · QFN-16-EP(3x3)

TPS62153RGTR from Texas Instruments, in a QFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch node connected to internal MOSFET switches; connect the inductor between SW and output capacitor.
2 SW output Switch node connected to internal MOSFET switches; connect the inductor between SW and output capacitor.
3 SW output Switch node connected to internal MOSFET switches; connect the inductor between SW and output capacitor.
4 PG tri_state Output power good (high = VOUT ready, low = VOUT below nominal regulation); open drain requires pullup resistor.
5 FB input Voltage feedback pin; for fixed output voltage versions recommended to connect FB to AGND for improved thermal performance.
6 AGND power_in Analog ground; must be connected directly to the exposed thermal pad and common ground plane.
7 FSW input Switching frequency select (low is approximately 2.5 MHz, high is approximately 1.25 MHz for typical operation).
8 DEF input Output voltage scaling (low = nominal, high = nominal + 5%).
9 SS/TR input Soft-start/tracking pin; external capacitor connected to this pin sets the internal voltage reference rise time.
10 AVIN power_in Supply voltage for control circuitry; connect to same source as PVIN.
11 PVIN power_in Supply voltage for power stage; connect to same source as AVIN.
12 PVIN power_in Supply voltage for power stage; connect to same source as AVIN.
13 EN input Enable input (high = enabled, low = disabled).
14 VOS input Output voltage sense pin and connection for the control loop circuitry.
15 PGND power_in Power ground; must be connected directly to the exposed thermal pad and common ground plane.
16 PGND power_in Power ground; must be connected directly to the exposed thermal pad and common ground plane.
17 Exposed Thermal Pad power_in Exposed thermal pad connected to AGND, PGND, and common ground plane; must be soldered to achieve appropriate power dissipation and mechanical reliability.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS62153RGTR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps62153rgtr-etched.step / tps62153rgtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps62153rgtr.step / tps62153rgtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (44 pp, sha256 b146908d5c550566, retrieved 2026-09-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF