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Contents

README

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TPS62131RGTR

Texas Instruments · DC-DC Converters · QFN-16-EP(3x3)

TPS62131RGTR from Texas Instruments, in a QFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch node connected to internal MOSFET switches; connect inductor between SW and output capacitor.
2 SW output Switch node connected to internal MOSFET switches; connect inductor between SW and output capacitor.
3 SW output Switch node connected to internal MOSFET switches; connect inductor between SW and output capacitor.
4 PG output Open-drain power good output (High = VOUT ≥92% nominal, Low = VOUT below nominal regulation); requires external pullup resistor.
5 FB input Voltage feedback input for adjustable versions or connect to AGND on fixed output versions (TPS62131) for improved thermal performance.
6 AGND power_in Analog ground; must be connected directly to exposed thermal pad and common ground plane.
7 FSW input Switching frequency select input (Low ≈2.5 MHz, High ≈1.25 MHz for typical operation).
8 DEF input Output voltage define input (Low = nominal output, High = nominal output + 5%).
9 SS/TR input Soft-start/tracking input pin; external capacitor sets internal voltage reference rise time for controlled output voltage ramp.
10 AVIN power_in Supply voltage for control circuitry (3 to 17 V); must connect to same source as PVIN.
11 PVIN power_in Supply voltage for power stage (3 to 17 V); must connect to same source as AVIN.
12 PVIN power_in Supply voltage for power stage (3 to 17 V); must connect to same source as AVIN.
13 EN input Enable input (High = enabled, Low = disabled with shutdown current <2 µA); internal 400 kΩ pulldown resistor.
14 VOS input Output voltage sense pin for control loop feedback; provides regulation signal to internal compensation network.
15 PGND power_in Power ground; must be connected directly to exposed thermal pad and common ground plane.
16 PGND power_in Power ground; must be connected directly to exposed thermal pad and common ground plane.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS62131RGTR
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps62131rgtr-etched.step / tps62131rgtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps62131rgtr.step / tps62131rgtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 f9b1af285622c0cf, retrieved 2026-09-24, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF