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Contents

README

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TPS6213013AQRGTRQ1

Texas Instruments · DC-DC Converters · VQFN-16-EP(3x3)

TPS6213013AQRGTRQ1 from Texas Instruments, in a VQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW output Switch node connected to internal power MOSFETs; connect inductor between this node and output capacitor.
2 SW output Switch node connected to internal power MOSFETs; connect inductor between this node and output capacitor.
3 SW output Switch node connected to internal power MOSFETs; connect inductor between this node and output capacitor.
4 PG tri_state Open-drain power good output indicating output voltage regulation status (high = VOUT ready, low = VOUT below nominal regulation).
5 FB input Resistive voltage divider feedback input for adjustable versions; connect to AGND on fixed-voltage versions for improved thermal performance.
6 AGND power_in Analog ground; must connect directly to exposed thermal pad and common ground plane.
7 FSW input Switching frequency selection input (low = 2.5 MHz typical, high = 1.25 MHz typical).
8 DEF input Output voltage offset control input (low = nominal, high = nominal + 5%).
9 SS/TR input Soft-start/tracking pin with external capacitor for programmable output voltage rise time and tracking/sequencing.
10 AVIN power_in Control circuitry supply voltage (3 V to 17 V); must connect to same source as PVIN.
11 PVIN power_in Power stage supply voltage (3 V to 17 V); must connect to same source as AVIN.
12 PVIN power_in Power stage supply voltage (3 V to 17 V); must connect to same source as AVIN.
13 EN input Enable control input (high = enabled, low = disabled with approximately 1.5 µA shutdown current).
14 VOS input Output voltage sense pin and connection for the internal control loop circuitry.
15 PGND power_in Power ground; must connect directly to exposed thermal pad and common ground plane.
16 PGND power_in Power ground; must connect directly to exposed thermal pad and common ground plane.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS6213013AQRGTRQ1
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: VQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps6213013aqrgtrq1-etched.step / tps6213013aqrgtrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps6213013aqrgtrq1.step / tps6213013aqrgtrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 e132f3ce7dba7fa6, retrieved 2026-09-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF