component
TPS62067DSGR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-8-EP(2x2). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS62067DSGR
Texas Instruments · DC-DC Converters · WSON-8-EP(2x2)
TPS62067DSGR from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | GND supply pin for the output stage power switching circuit. |
| 2 | SW | output | Switch pin connected to internal MOSFET switches operating at 3MHz; connect external inductor between this terminal and output capacitor. |
| 3 | AGND | power_in | Analog GND supply pin for the control circuit. |
| 4 | FB | input | Feedback pin for internal regulation loop; connect external resistor divider to set output voltage (0.8V to VIN) or connect directly to output capacitor for fixed voltage option. |
| 5 | EN | input | Enable pin that controls device operation; low forces shutdown mode with <1μA standby current and output capacitor discharge, high enables normal operation. |
| 6 | PG | tri_state | Power Good open-drain output pin; provides logic low when feedback voltage below 90% nominal or when EN is low, logic high when feedback voltage above 95% nominal with 5μs internal delay. |
| 7 | AVIN | power_in | Analog VIN power supply pin for control circuit; must be connected to PVIN and input capacitor with 2.9V to 6V input range. |
| 8 | PVIN | power_in | VIN power supply pin for output stage; input voltage range 2.9V to 6V supporting up to 2A output current. |
| 9 | PowerPAD | power_in | Exposed thermal pad for device GND connection; must be soldered to PCB land pattern for proper thermal dissipation (RθJA 65.3°C/W) and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage AVIN, PVIN | -0.3 | 7 | V | 4 | |||
| Voltage EN, MODE, PG, FB | -0.3 | V | 4 | ||||
| Voltage SW | -0.3 | 7 | V | 4 | |||
| Current (sink) into PG | 1 | mA | 4 | ||||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Supply voltage AVIN, PVIN | 2.9 | 6 | V | 4 | |||
| Output current capability | 2000 | mA | 4 | ||||
| Output voltage range for adjustable voltage | 0.8 | V | 4 | ||||
| Effective inductance | L | 0.7 | 1 | 1.6 | µH | 4 | |
| Effective output capacitance | COUT | 4.5 | 10 | 22 | µF | 4 | |
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Junction-to-ambient thermal resistance | RθJA | 65.3 | °C/W | 4 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 74.2 | °C/W | 4 | |||
| Junction-to-board thermal resistance | RθJB | 35.4 | °C/W | 4 | |||
| Junction-to-top characterization parameter | ψJT | 2.2 | °C/W | 4 | |||
| Junction-to-board characterization parameter | ψJB | 36 | °C/W | 4 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 12.8 | °C/W | 4 | |||
| Input voltage range | VIN | 2.9 | 6 | V | 5 | ||
| Operating quiescent current | IQ | 18 | µA | IOUT = 0 mA, device operating in PFM mode and device not switching | 5 | ||
| Shutdown current | ISD | 0.1 | 1 | µA | EN = GND, current into AVIN and PVIN | 5 | |
| Undervoltage lockout threshold (falling) | VUVLO | 1.73 | 1.78 | 1.83 | V | Falling | 5 |
| Undervoltage lockout threshold (rising) | VUVLO | 1.9 | 1.95 | 1.99 | V | Rising | 5 |
| High level input voltage | VIH | 1 | 6 | V | 2.9 V ≤ VIN ≤ 6 V | 5 | |
| Low level input voltage | VIL | 0 | 0.4 | V | 2.9 V ≤ VIN ≤ 6 V | 5 | |
| Input bias current | IIN | 0.01 | 1 | µA | EN, mode tied to GND or AVIN | 5 | |
| Power good threshold voltage (rising feedback voltage) | VTHPG | 93 | 95 | 98 | % | Rising feedback voltage | 5 |
| Power good threshold voltage (falling feedback voltage) | VTHPG | 87 | 90 | 92 | % | Falling feedback voltage | 5 |
| Output low voltage | VOL | 0.3 | V | IOUT = –1mA; must be limited by external pullup resistor | 5 | ||
| Leakage current into PG pin | ILKG | 100 | nA | V(PG) = 3.6V | 5 | ||
| Internal power good delay time | tPGDL | 5 | µs | 5 | |||
| High-side MOSFET on-resistance | RDS(on) | 120 | 180 | mΩ | VIN = 3.6 V | 5 | |
| High-side MOSFET on-resistance | RDS(on) | 95 | 150 | mΩ | VIN = 5 V | 5 | |
| Low-side MOSFET on-resistance | RDS(on) | 90 | 130 | mΩ | VIN = 3.6 V | 5 | |
| Low-side MOSFET on-resistance | RDS(on) | 75 | 100 | mΩ | VIN = 5 V | 5 | |
| Forward current limit MOSFET (high-side and low-side) | ILIMF | 2300 | 2750 | 3300 | mA | 2.9 V ≤ VIN ≤ 6 V | 5 |
| Thermal shutdown | TSD | 150 | °C | Increasing junction temperature | 5 | ||
| Thermal shutdown hysteresis | 10 | °C | Decreasing junction temperature | 5 | |||
| Oscillator frequency | fSW | 2.6 | 3 | 3.4 | MHz | 2.9 V ≤ VIN ≤ 6 V | 5 |
| Reference voltage | Vref | 600 | mV | 5 | |||
| Feedback voltage PWM mode | VFB(PWM) | -1.5 | 0 | 1.5 | % | PWM operation, MODE = VIN, 2.9 V ≤ VIN ≤ 6 V, 0 mA load | 5 |
| Feedback voltage PFM mode (voltage positioning) | VFB(PFM) | 1 | % | Device in PFM mode, voltage positioning active | 5 | ||
| Load regulation | VFB | -0.5 | %/A | 5 | |||
| Line regulation | 0 | %/V | 5 | ||||
| Internal discharge resistor | R(Discharge) | 75 | 200 | 1450 | Ω | Activated with EN = GND, 2.9 V ≤ VIN ≤ 6 V, 0.8 ≤ VOUT ≤ 3.6 V | 5 |
| Start-up time | tSTART | 500 | µs | Time from active EN to reach 95% of VOUT | 5 |
CAD (KiCad official)
- Symbol:
TPS62067DSGR - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps62067dsgr-etched.step/tps62067dsgr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62067dsgr.step/tps62067dsgr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (30 pp, sha256
f9812a26ed207003, retrieved 2026-09-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).