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Contents

README

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TPS61023DRLR

Texas Instruments · DC-DC Converters · SOT-563

TPS61023DRLR from Texas Instruments, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB input Voltage feedback input for the adjustable output voltage, which is set within the 2.2 V to 5.5 V output voltage setting range.
2 EN input Enable logic input: a logic-high voltage enables the device, and a logic-low voltage disables it and puts it into shutdown mode.
3 VIN power_in IC power supply input; the input voltage range is 0.5 V to 5.5 V, with an absolute maximum rating of 7 V on this terminal.
4 GND power_in Ground pin of the IC.
5 SW power_out Switch pin of the converter, connected to the drain of the internal low-side MOSFET and the source of the internal high-side MOSFET; absolute maximum rating is -0.7 V to 7 V (8 V for a 10-ns spike, 9 V for a 1-ns spike).
6 VOUT power_out Boost converter output; the output voltage setting range is 2.2 V to 5.5 V, with an absolute maximum rating of 7 V on this terminal.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-563
Category Power Management (PMIC)
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range VIN 0.5 5.5 V 4
Output voltage setting range VOUT 2.2 5.5 V 4
Effective inductance range L 0.37 1 2.9 µH 4
Effective input capacitance range CIN 1 4.7 µF 4
Effective output capacitance range COUT 4 10 1000 µF 4
Operating junction temperature TJ -40 125 °C 4
Voltage range at terminals VIN, EN, FB, SW, VOUT -0.3 7 V 4
SW spike -0.7 8 V SW spike at 10ns 4
SW spike -0.7 9 V SW spike at 1ns 4
Operating junction temperature TJ -40 150 °C 4
Storage temperature Tstg -65 150 °C 4
Input voltage range VIN 0.5 5.5 V 5
Under-voltage lockout threshold, VIN rising VIN_UVLO 1.7 1.8 V VIN rising 5
Under-voltage lockout threshold, VIN falling VIN_UVLO 0.4 0.5 V VIN falling 5
Quiescent current into VIN pin IQ 0.9 3 µA IC enabled, No load, No switching, VIN = 1.8 V to 5.5 V, VFB = VREF + 0.1 V, TJ up to 85°C 5
Quiescent current into VOUT pin IQ 20 30 µA IC enabled, No load, No switching, VOUT = 2.2 V to 5.5 V, VFB = VREF + 0.1 V, TJ up to 85°C 5
Output voltage setting range VOUT 2.2 5.5 V 5
Reference voltage at the FB pin VREF 580 595 610 mV PWM mode 5
Reference voltage at the FB pin VREF 585 601 mV PFM mode 5
Output over-voltage protection threshold VOVP 5.5 5.7 6 V VOUT rising 5
Leakage current at FB pin IFB_LKG 4 20 nA TJ = 25°C 5
Leakage current into VOUT pin IVOUT_LKG 1 3 µA IC disabled, VIN = 0 V, VSW = 0 V, VOUT = 5.5 V, TJ = 25°C 5
Shutdown current into VIN and SW pin ISD 0.1 0.2 µA IC disabled, VIN = VSW = 3.6 V, TJ = 25°C 5
Minimum on time tON_min 40 96 130 ns 5
Minimum off time tOFF_min 80 120 ns 5
Valley current limit ILIM_SW 2.7 3.7 A VIN = 3.6 V, VOUT = 5.0 V 5
Pre-charge current ILIM_CHG 200 350 mA VIN = 1.8 - 5.5 V, VOUT < 0.4 V 5
Pre-charge current ILIM_CHG 750 1200 mA VIN = 2.4 V, VOUT = 2.15 V 5
EN logic low threshold VEN_L 0.35 0.42 0.45 V VIN > 1.8 V or VOUT > 2.2 V 5
EN logic high threshold VEN_H 1.2 V VIN > 1.8 V or VOUT > 2.2 V 5
Over-voltage protection hysteresis VOVP_HYS 0.1 V 5
Leakage current at FB pin IFB_LKG 6 nA TJ = 125°C 5
Soft startup time tSS 700 μs From active EN to VOUT regulation. VIN = 2.5 V, VOUT = 5.0 V, COUT_EFF = 10μF, IOUT = 0 5
High-side MOSFET on resistance RDS(on) 68 mΩ VOUT = 5.0 V 5
Low-side MOSFET on resistance RDS(on) 47 mΩ VOUT = 5.0 V 5
Switching frequency fSW 1 MHz VIN = 3.6 V, VOUT = 5.0 V, PWM mode 5
Switching frequency fSW 0.5 MHz VIN = 1.0 V, VOUT = 5.0 V, PWM mode 5
Thermal shutdown threshold TSD 150 °C TJ rising 5
Thermal shutdown hysteresis TSD_HYS 20 °C TJ falling below TSD 5
Junction-to-ambient thermal resistance (first thermal column) RθJA 142.7 °C/W 4
Junction-to-ambient thermal resistance (second thermal column) RθJA 91.4 °C/W 4
Junction-to-case thermal resistance RθJC 55.7 °C/W 4
Junction-to-board thermal resistance RθJB 31 °C/W 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper For better thermal performance, TI suggest to make copper polygon connected with each pin bigger. 18

CAD (KiCad official)

  • Symbol: TPS61023DRLR
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: tps61023drlr-etched.step / tps61023drlr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps61023drlr.step / tps61023drlr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 7e18c6542dc5e1de, retrieved 2026-10-19, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF