component

TPS60502DGSR

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, VSSOP-10-0.5mm. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower supply chiptps60502dgsrfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 15d ago
viewers tps60502dgsr: viewers · Ray 15d ago
package.json Publish 0.1.0 · Ray 15d ago
page.json tps60502dgsr: specified limits as data (metadata.characteristics, 25 rows from the datasheet) · Ray 10d ago
README.md tps60502dgsr: specified limits as data (metadata.characteristics, 25 rows from the datasheet) · Ray 10d ago
tps60502dgsr-etched.glb tps60502dgsr: factory component page (tier=lcsc) · Ray 15d ago
tps60502dgsr-etched.step tps60502dgsr: factory component page (tier=lcsc) · Ray 15d ago
tps60502dgsr-hero.glb tps60502dgsr: hero GLB from the etched model (keeps the MPN mark) · Ray 15d ago
tps60502dgsr-hero.overlay.json Publish 0.1.0 · Ray 15d ago
tps60502dgsr.glb Publish 0.1.0 · Ray 15d ago
tps60502dgsr.kicad_mod Publish 0.1.0 · Ray 15d ago
tps60502dgsr.kicad_sym Publish 0.1.0 · Ray 15d ago
tps60502dgsr.lbr Publish 0.1.0 · Ray 15d ago
tps60502dgsr.step Publish 0.1.0 · Ray 15d ago

TPS60502DGSR

Texas Instruments · DC-DC Converters · VSSOP-10-0.5mm

TPS60502DGSR from Texas Instruments, in a VSSOP-10-0.5mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EN input Device-enable input: EN high disables the device and isolates input from output in shutdown, while EN low enables it.
2 PG output Open-drain power good output that goes high when OUT reaches about 97% of its nominal value and needs an external pullup.
3 C2F− passive Negative terminal of flying capacitor C2F.
4 C2F+ passive Positive terminal of flying capacitor C2F.
5 VIN power_in Supply input, connected to an input supply in the 1.8 V to 6.5 V range.
6 C1F+ passive Positive terminal of flying capacitor C1F.
7 OUT power_out Regulated 1.8 V output for this device variant, to be bypassed to GND with the output filter capacitor Co.
8 C1F− passive Negative terminal of flying capacitor C1F.
9 GND power_in Ground reference for the device.
10 FB input For the TPS60502 (fixed 1.8 V), connect directly to VO, the regulated output node.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VSSOP-10-0.5mm
Category Power Supply Chip
Pins 10

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VIN 1.8 6.5 V 5
Tolerance of output voltage (TPS60502) -4 4 % IOUT = 0 mA to 150 mA, COUT = 10 µF 5
Quiescent current (no-load input current) IQ 40 75 µA IOUT = 0 mA 5
Shutdown supply current IOUT(SD) 0.05 0.5 µA V(EN) = VIN 5
Internal switching frequency f(OSC) 600 800 1200 kHz 5
EN input leakage current Ilkg(SD) 0.01 0.1 µA V(EN) = 0 V or VIN 5
Short circuit current (start-up current) 100 300 mA VIN = 6.5 V, VOUT = 0 V 5
Power good delay time (rising) td,r 100 200 µs VOUT ramping positive 5
Power good delay time (falling) td,f 50 100 µs VOUT ramping negative 5
Power good leakage current Ilkg 0.01 0.1 µA VOUT = 3.3 V, V(PG) = 3.3 V 5
Input voltage at VIN (recommended) VIM 1.8 6.5 V 4
Output current at OUT (recommended) IOUT 250 mA 4
Operating junction temperature TJ -40 125 °C 4
Voltage at VIN, EN, PG to GND -0.3 7 V 4
Voltage at OUT, FB to GND -0.3 3.6 V 4
Voltage at C1F+, C1F−, C2F+, C2F− to GND -0.3 7 V 4
Output current at OUT 300 mA 4
Maximum junction temperature TJ 150 °C 4
Storage temperature Tstg -55 150 °C 4
Output voltage (TPS60502 nominal) VOUT 1.8 V IOUT ≤ 50 mA; VIN > 1.8 V; VIN − VOUT > 1 V 5
Junction-to-ambient thermal resistance (DGS) RθJA 157 °C/W 4
Junction-to-case (top) thermal resistance (DGS) RθJC(top) 53 °C/W 4
Junction-to-board thermal resistance (DGS) RθJB 76 °C/W 4
Junction-to-top characterization parameter (DGS) ψJT 5.5 °C/W 4
Junction-to-board characterization parameter (DGS) ψJB 75 °C/W 4

CAD (KiCad official)

  • Symbol: TPS60502DGSR
  • Footprint: Package_SO:MSOP-10_3x3mm_P0.5mm
  • 3D model: VSSOP-10-0.5mm (KiCad packages3D, STEP)
  • 3D model files: tps60502dgsr-etched.step / tps60502dgsr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps60502dgsr.step / tps60502dgsr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 1f029955b1a7942c, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF