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TPS59632QRHBRQ1

Texas Instruments · AC-DC Controllers And Regulators · QFN-32(5x5)

TPS59632QRHBRQ1 from Texas Instruments, in a QFN-32(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SDA bidirectional I2C digital data line, with recommended input voltage limited to -0.1 V to 3.5 V.
2 VDD power_in 3.3-V digital power input that must be bypassed to GND with at least 1 µF; supply range is 3.1 V to 3.5 V.
3 PGOOD output Open-drain power good output that can be configured to go low when the current reaches 70% of the OCP setting value.
4 PWM3 output PWM control for the external driver at 5-V logic level; the controller forces the 3-state level when needed.
5 PWM2 output PWM control for the external driver at 5-V logic level; the controller forces the 3-state level when needed.
6 PWM1 output PWM control for the external driver at 5-V logic level; the controller forces the 3-state level when needed.
7 SKIP output Active high sets forced continuous conduction mode and active low sets skip mode for the synchronous buck MOSFETs; it must connect to the matching driver pin.
8 EN input Enable input with 100-ns de-bounce; when low the regulator enters low-power mode and retains start-up settings.
9 O-USR input Voltage divider to VREG; a resistor to GND selects the pulse-truncation and OSR level, and the voltage at this pin selects the USR level.
10 FREQ-P input A resistor to GND sets the per-phase switching frequency and a resistor to VREF must keep the pin voltage above 0.8 V.
11 RAMP input Voltage divider to VREF; a resistor to GND sets the ramp setting voltage and can override the factory ramp setting.
12 OCP-I bidirectional Voltage divider to IMON whose ratio sets the IMON gain; a resistor to GND selects 1 of 8 OCP levels per phase, latched at start-up.
13 IMON output Analog current monitor output following VIMON = Σ VISENSE × (1 + RIMON / ROCP).
14 VINTF power_in Input voltage to power the I2C interface logic, supplied from 1.7 V to 3.5 V; it can be tied to VDD if 3.3-V logic is needed.
15 SLEWA input Voltage sets the 3 LSBs of the I2C address and the resistance to GND selects 1 of 8 slew rates, both latched at start-up.
16 VBAT power_in 10-kΩ resistor to VBAT provides input-voltage information to the on-time circuits; VBAT must not exceed 28 V.
17 CSP1 input Positive current sense input; tie to 3.3 V to disable the phase, with CSP3, CSP2, CSP1 disabled in that order.
18 CSN1 input Negative current sense input that includes a secondary OVP comparator and the soft-stop pulldown transistor.
19 CSN2 input Negative current sense input connected to the most negative node of the current sense resistor or inductor DCR network.
20 CSP2 input Positive current sense input; tie to 3.3 V to disable the phase, with CSP3, CSP2, CSP1 disabled in that order.
21 CSP3 input Positive current sense input; tie to 3.3 V to disable the phase, with CSP3, CSP2, CSP1 disabled in that order.
22 CSN3 input Negative current sense input connected to the most negative node of the current sense resistor or inductor DCR network.
23 GFB input Voltage sense return that ties to GND on the PCB through a 10-Ω resistor when the µP is not populated.
24 VFB input Voltage sense line tied to the VOUT sense point, with resistance between VFB and GFB greater than 1 MΩ.
25 DROOP output Error amplifier output; a resistor pair from VREF to COMP to DROOP sets the droop gain.
26 COMP input Error amplifier summing node; RCOMP from VREF and RDROOP to DROOP set the droop gain.
27 VREF power_out 1.7-V, 500-µA reference that must be bypassed to GND with a 0.22-µF ceramic capacitor.
28 V5A power_in 5-V power input for analog circuits from 4.5 V to 5.5 V, bypassed to GND with at least 1 µF ceramic capacitor.
29 GND power_in Analog circuit reference that must be tied to a quiet point on the ground plane.
30 NC unconnected No connect; leave floating.
31 SCL input I2C digital clock line.
32 NC unconnected No connect; leave floating.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-32(5x5)
Category Power Management (PMIC)
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage V5A V5A -0.3 6 V 5
Input voltage VDD, O-USR, RAMP, OCP-I, VFB, CSP1, CSP2, CSP3, CSN1, CSN2, CSN3, VINTF, SDA, SCL, FREQ-P, SLEWA, EN, NC VDD, O-USR, RAMP, OCP-I, VFB, CSP1, CSP2, CSP3, CSN1, CSN2, CSN3, VINTF, SDA, SCL, FREQ-P, SLEWA, EN, NC -0.3 3.6 V 5
Input voltage VBAT VBAT -0.3 30 V 5
Input voltage COMP COMP -0.3 3.6 V 5
Input voltage GFB GFB -0.2 0.2 V 5
Output voltage PGOOD, IMON, VREF, DROOP PGOOD, IMON, VREF, DROOP -0.3 3.6 V 5
Output voltage PWM3, PWM2, PWM1, SKIP PWM3, PWM2, PWM1, SKIP -0.3 6 V 5
Junction temperature range TJ -40 150 °C 5
Storage temperature Tstg -55 150 °C 5
Recommended input voltage V5A V5A -0.1 5.5 V 5
Recommended input voltage VDD, O-USR, RAMP, OCP-I, VFB, CSP1, CSP2, CSP3, CSN1, CSN2, CSN3, VINTF, SDA, SCL, FREQ-P, SLEWA, EN, NC VDD, O-USR, RAMP, OCP-I, VFB, CSP1, CSP2, CSP3, CSN1, CSN2, CSN3, VINTF, SDA, SCL, FREQ-P, SLEWA, EN, NC -0.1 3.5 V 5
Recommended input voltage VBAT VBAT -0.1 28 V 5
Recommended input voltage COMP COMP -0.1 3.5 V 5
Recommended input voltage GFB GFB -0.1 0.1 V 5
Recommended output voltage PGOOD, IMON, VREF, DROOP PGOOD, IMON, VREF, DROOP -0.1 3.5 V 5
Recommended output voltage PWM3, PWM2, PWM1, SKIP PWM3, PWM2, PWM1, SKIP -0.1 5.5 V 5
Operating junction temperature TJ -40 125 °C 5
Junction-to-ambient thermal resistance RθJA 37.2 °C/W 6
Junction-to-case (top) thermal resistance RθJCtop 31.9 °C/W 6
Junction-to-board thermal resistance RθJB 8.1 °C/W 6
Junction-to-case (bottom) thermal resistance RθJCbot 2.2 °C/W 6
V5A supply current, 3-phase IV5-3P 3.6 6 mA VVDAC < VVFB < (VVDAC + 100 mV), EN = HI 6
VDD supply current, 3-phase IVDD-3P 0.2 0.8 mA VVDAC < VVFB < (VVDAC + 100 mV), EN = HI; digital buses idle 6
V5A supply current, 1-phase IV5-1P 3.5 6 mA VDAC < VFB < (VVDAC + 100 mV) EN = HI 6
VDD supply current, 1-phase IVDD-1P 0.2 0.8 mA VDAC < VFB < (VVDAC + 100 mV), EN = HI; digital buses idle 6
V5A standby current IV5STBY 125 200 µA EN = LO 6
VDD standby current IVDDSTBY 23 40 µA EN = LO 6
V5A UVLO OK threshold VUVLOH 4.2 4.4 4.52 V VVFB < 200 mV. Ramp up; VVDD > 3 V; EN = HI; Switching begins. 6
V5A UVLO fault threshold VUVLOL 4 4.2 4.35 V Ramp down; EN = HI; VVDD > 3 V; VVFB = 100 mV. Switching stops 6
VDD UVLO OK threshold V3UVLOH 2.5 2.8 3 V VVFB < 200 mV. Ramp up; VV5A > 4.5 V; EN = HI; Switching begins. 6
VDD UVLO fault threshold V3UVLOL 2.4 2.6 2.8 V Ramp down; EN = HI; V5A > 4.5 V; VFB = 100 mV. Switching stops. 6
VFB tolerance VDAC1 -9 9 mV 1.36 V ≤ VVFB ≤ 1.52 V, IOUT = 0 A 6
VFB tolerance VDAC2 -8 8 mV 1.0 V ≤ VVFB ≤ 1.35 V; IOUT = 0 A 6
VFB tolerance VDAC3 -7 7 mV 0.5 V ≤ VVFB ≤ 0.99 V; IOUT = 0 A 6
VREF output VVREF 1.66 1.7 1.74 V 4.5 V ≤ VV5A ≤ 5.5 V, IVREF = 0 A 6
VREF output source VVREFSRC -4 -3 mV 0 A ≤ IREF ≤ 500 µA, HP-2 6
Current sense pin input bias current ICS -500 0.2 500 nA CSPx and CSNx 7
Internal current sense gain ACSINT 5.8 6 6.2 V/V Gain from CSPx, CSNx to PWM comparator, RSKIP = Open 7
Internal current share tolerance IBAL_TOL -3 3 % VDAC = 1.70 V, VCSP1, VCSN1 = VCSP2, VCSN2 = VCSP3, VCSN3 = VOCPP_MIN 7
OVP fixed voltage VOVPH 1.6 1.7 1.8 V VCSN1 > VOVPH for 1 µs 8
Soft-stop transistor resistance RSFTSTP 100 200 Ω Connected to CSN1 8
PGOOD high threshold VPGDH 185 245 mV Measured at the VFB pin with respect to VID code, device latches OFF 8
PGOOD low threshold VPGDL -348 -280 mV Measured at the VFB pin with respect to VID code, device latches OFF 8
PWMx / SKIP output low voltage VP-S_L 0.15 0.3 V ILOAD = ± 1 mA 8
PWMx / SKIP 3-state voltage VPW-SKLK 1.6 1.7 1.8 V ILOAD = ± 100 µA 8
SDA pulldown resistance RVRTTL 4 15 Ω SDA, V = 0.31 V 8
PGOOD pulldown resistance RVRPG 36 50 Ω PGOOD, V = 0.31 V 8
Logic leakage current IVRTTLK -2 0.2 2 µA SDA, SCL = 1.8 V, PGOOD = 3.3 V 8
I2C low-level input voltage VIL,I2C 0.6 V SCL, SDA, VINTF = 1.8 V 8
I2C high-level input voltage VIH,I2C 1.2 V SCL, SDA, VINTF = 1.8 V 8
I/O leakage, EN IENH 24 40 µA VEN = 1.8 V 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 5 7 9 mV ROCP-I = 20 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 7 10 13 mV ROCP-I = 24 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 10 14 18 mV ROCP-I = 30 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 15 19 23 mV ROCP-I = 39 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 21 25 29 mV ROCP-I = 56 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 28 32 36 mV ROCP-I = 75 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 36 40 44 mV ROCP-I = 100 kΩ +/- 1% 8
OCP voltage (valley current limit at CSPx, CSNx) VOCP 45 49 53 mV ROCP-I = 150 kΩ +/- 1% 8

CAD (KiCad official)

  • Symbol: TPS59632QRHBRQ1
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32(5x5) (KiCad packages3D, STEP)
  • 3D model files: tps59632qrhbrq1-etched.step / tps59632qrhbrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps59632qrhbrq1.step / tps59632qrhbrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (53 pp, sha256 11f0d28d915f2217, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF