component
TPS55340RTET
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+54@@ -0,0 +1,54 @@+# TPS55340RTET++**Texas Instruments** · DC-DC Converters · WQFN-16-EP(3x3)++TPS55340RTET from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | SW | passive | Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer. |+| 2 | VIN | power_in | Input supply pin to the IC; connect to a supply voltage between 2.9 V and 32 V, which may differ from the boost power stage input. |+| 3 | EN | input | Enable pin; when the voltage on this pin falls below the enable threshold for more than 1 ms, the IC turns off. |+| 4 | SS | passive | Soft-start programming pin; a capacitor between SS and AGND programs the soft-start timing. |+| 5 | SYNC | input | Switching frequency synchronization pin; an external clock signal can set the switching frequency between 200 kHz and 1.0 MHz, otherwise tie to AGND. |+| 6 | AGND | power_in | Signal ground of the IC. |+| 7 | COMP | output | Output of the transconductance error amplifier; an external RC network connected to this pin compensates the regulator feedback loop. |+| 8 | FB | input | Error amplifier input and feedback pin for positive voltage regulation; connect to the center tap of a resistor divider to program the output voltage. |+| 9 | FREQ | passive | Switching frequency program pin; an external resistor connected between FREQ and AGND sets the switching frequency. |+| 10 | NC | unconnected | Reserved pin that must be connected to ground (TI recommends connecting NC to AGND). |+| 11 | PGND | power_in | Power ground of the IC; connected to the source of the internal power MOSFET switch. |+| 12 | PGND | power_in | Power ground of the IC; connected to the source of the internal power MOSFET switch. |+| 13 | PGND | power_in | Power ground of the IC; connected to the source of the internal power MOSFET switch. |+| 14 | NC | unconnected | Reserved pin that must be connected to ground (TI recommends connecting NC to AGND). |+| 15 | SW | passive | Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer. |+| 16 | SW | passive | Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer. |+| 17 | PowerPAD | power_in | Exposed thermal pad; should be soldered to AGND, and thermal vias to an internal ground plane are recommended for improved power dissipation. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | WQFN-16-EP(3x3) |+| Category | Power Management (PMIC) |+| Pins | 17 |++## CAD (KiCad official)++- Symbol: `TPS55340RTET`+- Footprint: `Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm`+- 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)+- 3D model files: `tps55340rtet-etched.step` / `tps55340rtet-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps55340rtet.step` / `tps55340rtet.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps55340) (45 pp, sha256 `05e4069b78ee3f03`, retrieved 2026-09-24, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tps55340rtet-datasheet.pdf)
page.jsonadded+198@@ -0,0 +1,198 @@+{+ "slug": "tps55340rtet",+ "version": "0.1.0",+ "type": "component",+ "description": "Texas Instruments DC-DC Converters, WQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.",+ "tags": [+ "component",+ "power management (pmic)",+ "tps55340rtet",+ "factory-2.0.0",+ "extractor-text"+ ],+ "dependencies": {},+ "hero": {+ "type": "image",+ "path": "docs/hero.png"+ },+ "files": [+ "page.json",+ "README.md",+ "tps55340rtet.kicad_sym",+ "tps55340rtet.kicad_mod",+ "tps55340rtet.glb",+ "tps55340rtet.step",+ "tps55340rtet.lbr",+ "docs/hero.png",+ "docs/tps55340rtet-datasheet.pdf",+ "viewers/symbol.html",+ "viewers/footprint.html"+ ],+ "component": {+ "mpn": "TPS55340RTET",+ "manufacturer": "Texas Instruments",+ "package": "WQFN-16-EP(3x3)",+ "pin_count": 17,+ "category": "Power Management (PMIC)",+ "subcategory": "DC-DC Converters",+ "datasheet": "https://www.ti.com/cn/lit/gpn/tps55340",+ "parts": {+ "symbol": "tps55340rtet.kicad_sym",+ "footprint": "tps55340rtet.kicad_mod",+ "model_3d": "tps55340rtet-etched.glb",+ "model_3d_plain": "tps55340rtet.glb",+ "model_3d_step": "tps55340rtet-etched.step",+ "model_3d_step_plain": "tps55340rtet.step",+ "lbr": "tps55340rtet.lbr"+ },+ "distributor_links": {+ "lcsc": "C2876389"+ },+ "pins": [+ {+ "number": "1",+ "name": "SW",+ "type": "passive",+ "description": "Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer."+ },+ {+ "number": "2",+ "name": "VIN",+ "type": "power_in",+ "description": "Input supply pin to the IC; connect to a supply voltage between 2.9 V and 32 V, which may differ from the boost power stage input."+ },+ {+ "number": "3",+ "name": "EN",+ "type": "input",+ "description": "Enable pin; when the voltage on this pin falls below the enable threshold for more than 1 ms, the IC turns off."+ },+ {+ "number": "4",+ "name": "SS",+ "type": "passive",+ "description": "Soft-start programming pin; a capacitor between SS and AGND programs the soft-start timing."+ },+ {+ "number": "5",+ "name": "SYNC",+ "type": "input",+ "description": "Switching frequency synchronization pin; an external clock signal can set the switching frequency between 200 kHz and 1.0 MHz, otherwise tie to AGND."+ },+ {+ "number": "6",+ "name": "AGND",+ "type": "power_in",+ "description": "Signal ground of the IC."+ },+ {+ "number": "7",+ "name": "COMP",+ "type": "output",+ "description": "Output of the transconductance error amplifier; an external RC network connected to this pin compensates the regulator feedback loop."+ },+ {+ "number": "8",+ "name": "FB",+ "type": "input",+ "description": "Error amplifier input and feedback pin for positive voltage regulation; connect to the center tap of a resistor divider to program the output voltage."+ },+ {+ "number": "9",+ "name": "FREQ",+ "type": "passive",+ "description": "Switching frequency program pin; an external resistor connected between FREQ and AGND sets the switching frequency."+ },+ {+ "number": "10",+ "name": "NC",+ "type": "unconnected",+ "description": "Reserved pin that must be connected to ground (TI recommends connecting NC to AGND)."+ },+ {+ "number": "11",+ "name": "PGND",+ "type": "power_in",+ "description": "Power ground of the IC; connected to the source of the internal power MOSFET switch."+ },+ {+ "number": "12",+ "name": "PGND",+ "type": "power_in",+ "description": "Power ground of the IC; connected to the source of the internal power MOSFET switch."+ },+ {+ "number": "13",+ "name": "PGND",+ "type": "power_in",+ "description": "Power ground of the IC; connected to the source of the internal power MOSFET switch."+ },+ {+ "number": "14",+ "name": "NC",+ "type": "unconnected",+ "description": "Reserved pin that must be connected to ground (TI recommends connecting NC to AGND)."+ },+ {+ "number": "15",+ "name": "SW",+ "type": "passive",+ "description": "Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer."+ },+ {+ "number": "16",+ "name": "SW",+ "type": "passive",+ "description": "Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer."+ },+ {+ "number": "17",+ "name": "PowerPAD",+ "type": "power_in",+ "description": "Exposed thermal pad; should be soldered to AGND, and thermal vias to an internal ground plane are recommended for improved power dissipation."+ }+ ],+ "provenance": {+ "extractor": "extract_pins 0.2",+ "factory_chain": {+ "factory": "2.0.0",+ "extractor": "extract_pins 0.2",+ "primary_model": "claude-haiku-4-5-20251001",+ "primary_mode": "text",+ "consensus_model": "claude-sonnet-5",+ "consensus": "agreed",+ "guards": "pin_guards 0.1: passed",+ "guard_notes": [+ "exposed pad 17 added from the footprint",+ "dropped thermal pad ['EP'] absent from footprint"+ ],+ "pages_sent": 45,+ "cost_usd": 0.4739,+ "at": "2026-09-24T08:55:18"+ },+ "datasheet": {+ "url": "https://www.ti.com/cn/lit/gpn/tps55340",+ "pages": 45,+ "sha256": "05e4069b78ee3f03",+ "source_tier": "lcsc"+ },+ "cad": "KiCad official (CC-BY-SA 4.0)",+ "pins": {+ "total": 17,+ "described": 17,+ "cites_pages": true,+ "refuses_to_fabricate": true+ }+ },+ "viewers": {+ "symbol": "viewers/symbol.html",+ "footprint": "viewers/footprint.html"+ }+ },+ "visibility": "public",+ "org": "adom",+ "author": {+ "name": "Ray",+ "email": "[email protected]"+ }+}