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Contents

README

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TPS55340RTET

Texas Instruments · DC-DC Converters · WQFN-16-EP(3x3)

TPS55340RTET from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW passive Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
2 VIN power_in Input supply pin to the IC; connect to a supply voltage between 2.9 V and 32 V, which may differ from the boost power stage input.
3 EN input Enable pin; when the voltage on this pin falls below the enable threshold for more than 1 ms, the IC turns off.
4 SS passive Soft-start programming pin; a capacitor between SS and AGND programs the soft-start timing.
5 SYNC input Switching frequency synchronization pin; an external clock signal can set the switching frequency between 200 kHz and 1.0 MHz, otherwise tie to AGND.
6 AGND power_in Signal ground of the IC.
7 COMP output Output of the transconductance error amplifier; an external RC network connected to this pin compensates the regulator feedback loop.
8 FB input Error amplifier input and feedback pin for positive voltage regulation; connect to the center tap of a resistor divider to program the output voltage.
9 FREQ passive Switching frequency program pin; an external resistor connected between FREQ and AGND sets the switching frequency.
10 NC unconnected Reserved pin that must be connected to ground (TI recommends connecting NC to AGND).
11 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
12 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
13 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
14 NC unconnected Reserved pin that must be connected to ground (TI recommends connecting NC to AGND).
15 SW passive Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
16 SW passive Drain of the internal power MOSFET switch; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
17 PowerPAD power_in Exposed thermal pad; should be soldered to AGND, and thermal vias to an internal ground plane are recommended for improved power dissipation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS55340RTET
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps55340rtet-etched.step / tps55340rtet-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps55340rtet.step / tps55340rtet.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 05e4069b78ee3f03, retrieved 2026-09-24, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF