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Contents

README

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TPS55340RTER

Texas Instruments · DC-DC Converters · WQFN-16-EP(3x3)

TPS55340RTER from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SW passive Drain of the internal power MOSFET; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
2 VIN power_in Input supply pin to the IC; connect VIN to a supply voltage between 2.9 V and 32 V (may differ from the boost power stage input).
3 EN input Enable pin; when the voltage on this pin falls below the enable threshold for more than 1 ms, the IC turns off.
4 SS passive Soft-start programming pin; a capacitor between SS and AGND programs the soft-start timing.
5 SYNC input Switching frequency synchronization pin; an external clock can set the switching frequency between 200 kHz and 1.0 MHz, otherwise tie to AGND.
6 AGND power_in Signal ground of the IC.
7 COMP output Output of the transconductance error amplifier; an external RC network on this pin compensates the regulator feedback loop.
8 FB input Error amplifier input and feedback pin for positive voltage regulation; connect to the center tap of a resistor divider to program the output voltage.
9 FREQ passive Switching frequency program pin; an external resistor between FREQ and AGND sets the switching frequency.
10 NC unconnected Reserved pin that must be connected to ground.
11 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
12 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
13 PGND power_in Power ground of the IC; connected to the source of the internal power MOSFET switch.
14 NC unconnected Reserved pin that must be connected to ground.
15 SW passive Drain of the internal power MOSFET; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
16 SW passive Drain of the internal power MOSFET; connect to the switched side of the boost or SEPIC inductor or the flyback transformer.
17 PowerPAD power_in Exposed thermal pad; should be soldered to AGND, with thermal vias to the internal ground plane recommended for improved power dissipation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

CAD (KiCad official)

  • Symbol: TPS55340RTER
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps55340rter-etched.step / tps55340rter-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps55340rter.step / tps55340rter.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 05e4069b78ee3f03, retrieved 2026-09-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF