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Contents

README

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TPS54373PWPR

Texas Instruments · DC-DC Converters · HTSSOP-20

TPS54373PWPR from Texas Instruments, in a HTSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AGND power_in Analog ground and return for the compensation network/output divider, slow-start capacitor, VBIAS capacitor, RT resistor and SYNC pin; connect the PowerPAD to AGND.
2 VSENSE input Error amplifier inverting input, connected to the output voltage through the compensation network/output divider; absolute maximum range is −0.3 V to 4 V.
3 COMP output Error amplifier output; the frequency compensation network is connected from COMP to VSENSE.
4 PWRGD output Open-drain power-good output that is high when VSENSE ≥ 90% Vref and low otherwise, and is also low when SS/ENA is low or internal shutdown is active; sink current is limited to 10 mA.
5 BOOT power_out Bootstrap output; a 0.022 µF to 0.1 µF low-ESR capacitor connected from BOOT to PH generates the floating drive for the high-side FET driver.
6 PH output Phase output at the junction of the internal high-side and low-side power MOSFETs and the output inductor; absolute maximum range is −0.6 V to 10 V.
7 PH output Phase output at the junction of the internal high-side and low-side power MOSFETs and the output inductor; absolute maximum range is −0.6 V to 10 V.
8 PH output Phase output at the junction of the internal high-side and low-side power MOSFETs and the output inductor; absolute maximum range is −0.6 V to 10 V.
9 PH output Phase output at the junction of the internal high-side and low-side power MOSFETs and the output inductor; absolute maximum range is −0.6 V to 10 V.
10 PH output Phase output at the junction of the internal high-side and low-side power MOSFETs and the output inductor; absolute maximum range is −0.6 V to 10 V.
11 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas and use a single-point connection to AGND.
12 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas and use a single-point connection to AGND.
13 PGND power_in Power ground and high-current return for the low-side driver and power MOSFET; connect with large copper areas and use a single-point connection to AGND.
14 VIN power_in Input supply for the power MOSFET switches and internal bias regulator, operating over 3 V to 6 V; bypass to PGND close to the package with a low-ESR 10 µF ceramic capacitor.
15 VIN power_in Input supply for the power MOSFET switches and internal bias regulator, operating over 3 V to 6 V; bypass to PGND close to the package with a low-ESR 10 µF ceramic capacitor.
16 VIN power_in Input supply for the power MOSFET switches and internal bias regulator, operating over 3 V to 6 V; bypass to PGND close to the package with a low-ESR 10 µF ceramic capacitor.
17 VBIAS power_out Internal bias regulator output supplying internal circuitry; bypass to AGND with a low-ESR 0.1 µF to 1.0 µF ceramic capacitor.
18 SS/ENA bidirectional Dual-function slow-start/enable pin: logic input to enable or disable operation (enable threshold 1.20 V typical) and capacitor input to set start-up time; sink current is limited to 10 mA.
19 SYNC input Synchronization input that locks to an external oscillator or selects between two internally set switching frequencies; when synchronizing, a resistor must be connected to RT.
20 RT input Frequency-setting resistor input; a resistor from RT to AGND sets the switching frequency, and when SYNC is used the RT value should set a frequency at or slightly below the external oscillator frequency.
21 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-20
Category Power Management (PMIC)
Pins 21

CAD (KiCad official)

  • Symbol: TPS54373PWPR
  • Footprint: Package_SO:TSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP2.15x3.35mm
  • 3D model: HTSSOP-20, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.2 mm nominal TSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps54373pwpr-etched.step / tps54373pwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps54373pwpr.step / tps54373pwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (23 pp, sha256 03b0dd9230ab25f0, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF