TPS54360BDDAR

{
 "schema": "adom.pads/1",
 "slug": "tps54360bddar",
 "footprint": "TI_SO-PowerPAD-8",
 "generated_from": {
  "footprint": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.78,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "TI_SO-PowerPAD-8@sha256:251b438f7e2e0404"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 0,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "BOOT",
   "type": "passive",
   "description": "Bootstrap capacitor node for the high-side MOSFET gate driver. A bootstrap capacitor is required between BOOT and SW. If the voltage on this capacitor falls below the minimum required to operate the high-side MOSFET, the output is switched off until the capacitor is refreshed. BOOT-SW max 8 V; BOOT abs max 73 V.",
   "is_pin1": true,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "VIN",
   "type": "power_in",
   "description": "Input supply voltage, 4.5 V to 60 V operating range (65 V absolute max). Bypass with a low-ESR ceramic capacitor placed close to the pin.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "EN",
   "type": "input",
   "description": "Enable pin with internal pull-up current source. Pull below 1.2 V to disable; float to enable. Adjust the input undervoltage lockout with two resistors. Abs max 8.4 V; typical enable threshold 1.2 V.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "RT/CLK",
   "type": "bidirectional",
   "description": "Resistor Timing and External Clock input. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency (100 kHz to 2.5 MHz). If pulled above the PLL upper threshold (~2 V) the pin becomes a synchronization input to the internal PLL. Abs max 3.6 V.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "FB",
   "type": "input",
   "description": "Inverting input of the transconductance (gm) error amplifier. Connect the output feedback divider from VOUT to FB and GND (0.8 V ±1% internal reference).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "COMP",
   "type": "output",
   "description": "Error amplifier output and input to the output switch current (PWM) comparator. Connect the frequency compensation network (Type-II RC) between COMP and GND. Abs max 3 V.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. Must be electrically connected to the exposed thermal pad on the PCB for proper operation.",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "rect",
   "at": [
    2.78,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.91,
    0.61
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "SW",
   "type": "power_out",
   "description": "Source of the internal high-side power MOSFET and switching node of the converter. Connect to the output inductor and catch diode. Abs max −0.6 V to 65 V (−2 V for 10-ns transients).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    -0.6025,
    -0.775
   ],
   "rot": 0.0,
   "size": [
    1.205,
    1.55
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "9",
   "name": "PAD",
   "type": "power_in",
   "description": "Exposed thermal PowerPAD on the package bottom. Must be electrically connected to GND (pin 7) on the PCB for proper electrical and thermal operation. Provides the primary heat-sink path (Rθ J-C(bot) = 3.6 °C/W).",
   "is_pin1": false,
   "source": {
    "geometry": "TI_SO-PowerPAD-8.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}