component
TPS54331QDRQ1
Public Made by Adomby adom
Texas Instruments DC-DC Converters, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS54331QDRQ1
Texas Instruments · DC-DC Converters · SOIC-8
TPS54331QDRQ1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | passive | A 0.1 mF bootstrap capacitor is required between BOOT and PH, and if the voltage on this capacitor falls below the minimum requirement the high-side MOSFET is forced to switch off until the capacitor is refreshed. |
| 2 | VIN | power_in | Input supply voltage, 3.5 V to 28 V. |
| 3 | EN | input | Enable pin that must be pulled below 1.25 V to disable the device and may float to enable it, with programming the input undervoltage lockout using two resistors recommended. |
| 4 | SS | passive | Slow start pin where an external capacitor connected to this pin sets the output rise time. |
| 5 | VSENSE | input | Inverting node of the gm error amplifier. |
| 6 | COMP | passive | Error amplifier output and input to the PWM comparator, to which frequency compensation components must be connected. |
| 7 | GND | power_in | Ground. |
| 8 | PH | output | The source of the internal high-side power MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating input voltage on (VIN pin) | VIN | 3.5 | 28 | V | 3 | ||
| Ambient temperature | TA | -40 | 125 | °C | 3 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 3 | ||
| Input voltage, VIN pin | VIN | -0.3 | 30 | V | 2 | ||
| Input voltage, EN pin | EN | -0.3 | 6 | V | 2 | ||
| Input voltage, BOOT pin | BOOT | 38 | V | 2 | |||
| Input voltage, VSENSE pin | VSENSE | -0.3 | 3 | V | 2 | ||
| Input voltage, COMP pin | COMP | -0.3 | 3 | V | 2 | ||
| Input voltage, SS pin | SS | -0.3 | 3 | V | 2 | ||
| Voltage, BOOT-PH | BOOT-PH | 8 | V | 2 | |||
| Output voltage, PH pin | PH | -0.6 | 30 | V | 2 | ||
| PH transient voltage | PH | -5 | V | 10 ns transient from ground to negative peak | 2 | ||
| Source current, EN pin | EN | 100 | mA | 2 | |||
| Source current, BOOT pin | BOOT | 100 | mA | 2 | |||
| Source current, VSENSE pin | VSENSE | 10 | mA | 2 | |||
| Source current, PH pin | PH | 9 | A | 2 | |||
| Source current, VIN pin | VIN | 9 | A | 2 | |||
| Sink current, COMP pin | COMP | 100 | mA | 2 | |||
| Sink current, SS pin | SS | 200 | mA | 2 | |||
| Operating junction temperature | TJ | -40 | 150 | °C | 2 | ||
| Storage temperature | -65 | 150 | °C | 2 | |||
| ESD Human-Body Model (HBM) | 1000 | V | 2 | ||||
| ESD Charged-Device Model (CDM) | 1000 | V | 2 | ||||
| ESD Machine Model (MM) | 100 | V | 2 | ||||
| Shutdown supply current | 1 | 4 | mA | EN = 0V, VIN = 12V, -40°C to 85°C | 3 | ||
| Operating non-switching supply current | 110 | 190 | mA | VSENSE = 0.85 V | 3 | ||
| Enable threshold | 1.25 | 1.35 | V | Rising and Falling | 3 | ||
| Voltage reference | 0.772 | 0.8 | 0.828 | V | 3 | ||
| On resistance, high-side MOSFET | 115 | 200 | mΩ | BOOT-PH = 3 V, VIN = 3.5 V | 3 | ||
| On resistance, high-side MOSFET | 80 | 150 | mΩ | BOOT-PH = 6 V, VIN = 12 V | 3 | ||
| Error amplifier source/sink current | -7 | 7 | mA | V(COMP) = 1 V, 100 mV overdrive | 3 | ||
| Switching frequency | 456 | 570 | 684 | kHz | VIN = 12V, 25°C | 3 | |
| Minimum controllable on time | 105 | 130 | ns | VIN = 12V, 25°C | 3 | ||
| Maximum controllable duty ratio | 90 | 93 | % | BOOT-PH = 6 V | 3 | ||
| Current limit threshold | 3.5 | 5.8 | A | VIN = 12 V | 4 | ||
| Thermal impedance, junction to ambient (SOIC8) | 100 | °C/W | SOIC8 package, junction to ambient | 3 |
CAD (KiCad official)
- Symbol:
TPS54331QDRQ1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tps54331qdrq1-etched.step/tps54331qdrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps54331qdrq1.step/tps54331qdrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (29 pp, sha256
28af8346c58ce810, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).