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Contents

README

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TPS54140DGQR

Texas Instruments · DC-DC Converters · MSOP-10-EP

TPS54140DGQR from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOT output Bootstrap capacitor pin; requires 0.1μF ceramic capacitor to PH pin for gate-drive voltage; monitoring circuit forces high-side MOSFET off when boot voltage drops below 2.1V minimum threshold.
2 VIN power_in Input power supply pin accepting 3.5V to 42V DC voltage for step-down buck converter operation.
3 EN input Enable pin with internal 0.9μA pullup current source; pull below 1.2V threshold to disable or float to enable; adjust input UVLO with external resistor divider.
4 SS/TR input Slow-start and tracking pin; external capacitor (0.47nF to 0.47μF) controls output voltage rise time; voltage overrides internal 0.8V reference for ratiometric sequencing applications.
5 RT/CLK input Resistor timing and external clock input pin; connect resistor to ground to set switching frequency (100kHz to 2500kHz) or accept external clock (300kHz to 2200kHz) for synchronization.
6 PWRGD tri_state Open-drain power good output; asserts low when VSENSE voltage is outside 92% to 107% window, during thermal shutdown exceeding 182°C, UVLO, or EN pin pulled below 1.25V.
7 VSENSE input Inverting input node of transconductance error amplifier with 97μA/V gain; connect to resistor divider from output voltage for feedback comparison to internal 0.8V reference.
8 COMP output Error amplifier output and peak current comparator input pin; provides control signal to PWM comparator; connect frequency compensation network to ground from this node.
9 GND power_in Ground connection pin; must be electrically connected to exposed thermal pad and PCB ground plane using multiple vias for proper device operation and heat dissipation.
10 PH output High-side MOSFET source pin serving as switching node; connected to output inductor cathode and catch diode anode; voltage swings 0V to VIN with peak inductor current capability.
11 Thermal Pad passive Exposed thermal pad for heat dissipation; must be soldered to PCB and connected to ground plane via multiple vias for thermal performance.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-10-EP
Category Power Management (PMIC)
Pins 11

CAD (KiCad official)

  • Symbol: TPS54140DGQR
  • Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
  • 3D model: MSOP-10-EP (KiCad packages3D, STEP)
  • 3D model files: tps54140dgqr-etched.step / tps54140dgqr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps54140dgqr.step / tps54140dgqr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (55 pp, sha256 b1aa27b28e4a5124, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF