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TPS53126RGET

Texas Instruments · DC-DC Controllers · VQFN-24(4x4)

TPS53126RGET from Texas Instruments, in a VQFN-24(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VO1 input Output voltage input for channel 1 on-time adjustment and output discharge, connected directly to the VO1 output voltage.
2 VFB1 input Channel 1 D-CAP2 feedback input, connected to the output voltage through a resistor divider.
3 GND power_in Signal ground, to be connected to PGND1, PGND2 and the system ground at a single point.
4 TEST1 output Test interface pin not used in application, to be connected directly to GND.
5 VFB2 input Channel 2 D-CAP2 feedback input, connected to the output voltage through a resistor divider.
6 VO2 input Output voltage input for channel 2 on-time adjustment and output discharge, connected directly to the VO2 output voltage.
7 EN2 input Channel 2 high-level enable pin; EN1 and EN2 are rated -0.1 V to 24 V in recommended operating conditions.
8 VBST2 power_in Boost supply input for the channel 2 high-side NFET driver, bypassed to SW2 with a high-quality 0.1 µF ceramic capacitor (external Schottky optional if forward drop is critical); VBST1/VBST2 are rated up to 5.5 V with respect to SWx.
9 DRVH2 output Channel 2 high-side MOSFET gate driver output, switching between SW2 (OFF) and VBST2 (ON).
10 SW2 bidirectional Channel 2 switch node for the high-side driver and current comparator; rated -1.8 V to 24 V in recommended operating conditions.
11 DRVL2 output Channel 2 low-side MOSFET gate driver output, PGND2-referenced, switching between PGND2 (OFF) and VREG5 (ON).
12 PGND2 power_in Channel 2 power ground for the low-side driver and current comparator, to be connected strongly to PGND1 and GND near the IC.
13 TRIP2 input Channel 2 over-current trip programming pin, connected to GND through a resistor to set the low-side RDS(on) current-limit threshold (TRIP1/TRIP2 rated -0.1 V to 0.3 V).
14 TEST2 input Frequency select pin: connect to GND for 350 kHz switching or to V5FILT for 700 kHz switching.
15 V5FILT power_in 5 V supply input for the control circuit (excluding MOSFET drivers), bypassed to GND with a minimum 1.0 µF high-quality ceramic capacitor; rated 4.5 V to 5.5 V and connected to VREG5 through an internal 10 Ω resistor.
16 VREG5 power_out Output of the 5 V linear regulator and supply for the MOSFET drivers, bypassed to GND with a minimum 4.7 µF high-quality ceramic capacitor; connected to V5FILT through an internal 10 Ω resistor.
17 VIN power_in Supply input for the 5 V linear regulator, operating from 4.5 V to 24 V.
18 TRIP1 input Channel 1 over-current trip programming pin, connected to GND through a resistor to set the low-side RDS(on) current-limit threshold.
19 PGND1 power_in Channel 1 power ground for the low-side driver and current comparator, to be connected strongly to PGND2 and GND near the IC.
20 DRVL1 output Channel 1 low-side MOSFET gate driver output, PGND1-referenced, switching between PGND1 (OFF) and VREG5 (ON).
21 SW1 bidirectional Channel 1 switch node for the high-side driver and current comparator; rated -1.8 V to 24 V in recommended operating conditions.
22 DRVH1 output Channel 1 high-side MOSFET gate driver output, switching between SW1 (OFF) and VBST1 (ON).
23 VBST1 power_in Boost supply input for the channel 1 high-side NFET driver, bypassed to SW1 with a high-quality 0.1 µF ceramic capacitor (external Schottky optional if forward drop is critical); VBST1/VBST2 are rated up to 5.5 V with respect to SWx.
24 EN1 input Channel 1 high-level enable pin; EN1 and EN2 are rated -0.1 V to 24 V in recommended operating conditions.
25 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package VQFN-24(4x4)
Category Power Management ICs
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply input voltage range VIN 4.5 24 V 4
V5FILT input voltage range V5FILT 4.5 5.5 V 4
VBST1, VBST2 voltage range VBST1, VBST2 -0.1 30 V 4
VBST1, VBST2 voltage range (wrt SWx) VBST1, VBST2 (wrt SWx) -0.1 5.5 V 4
VFB1, VFB2, VO1, VO2, TEST1, TEST2 input voltage range VFB1, VFB2, VO1, VO2, TEST1, TEST2 -0.1 5.5 V 4
TRIP1, TRIP2 input voltage range TRIP1, TRIP2 -0.1 0.3 V 4
EN1, EN2 input voltage range EN1, EN2 -0.1 24 V 4
SW1, SW2 input voltage range SW1, SW2 -1.8 24 V 4
DRVH1, DRVH2 output voltage range DRVH1, DRVH2 -0.1 30 V 4
DRVL1, DRVL2, VREG5 output voltage range DRVL1, DRVL2, VREG5 -0.1 5.5 V 4
PGND1, PGND2 voltage range PGND1, PGND2 -0.1 0.1 V 4
Operating free-air temperature (recommended) TA -40 85 °C 4
Operating junction temperature (recommended) TJ -40 125 °C 4
VIN, EN1, EN2 input voltage (absolute maximum) VIN, EN1, EN2 -0.3 26 V 4
VBST1, VBST2 input voltage (absolute maximum) VBST1, VBST2 -0.3 32 V 4
VBST1, VBST2 (wrt SWx) (absolute maximum) VBST1, VBST2 (wrt SWx) -0.3 6 V 4
V5FILT, VFB1, VFB2, TRIP1, TRIP2, VO1, VO2, TEST1, TEST2 input voltage (absolute maximum) V5FILT, VFB1, VFB2, TRIP1, TRIP2, VO1, VO2, TEST1, TEST2 -0.3 6 V 4
SW1, SW2 voltage (absolute maximum) SW1, SW2 -2 26 V 4
DRVH1, DRVH2 output voltage (absolute maximum) DRVH1, DRVH2 -1 32 V 4
DRVH1, DRVH2 (wrt SWx) output voltage (absolute maximum) DRVH1, DRVH2 (wrt SWx) -0.3 6 V 4
DRVL1, DRVL2, VREG5 output voltage (absolute maximum) DRVL1, DRVL2, VREG5 -0.3 6 V 4
PGND1, PGND2 voltage (absolute maximum) PGND1, PGND2 -0.3 0.3 V 4
Operating ambient temperature range (absolute maximum) TA -40 85 °C 4
Junction temperature range (absolute maximum) TJ -40 150 °C 4
VIN shutdown current... VIN supply current IIN 450 800 μA TA = 25°C, VREG5 tied to V5FLT, EN1 = EN2 = 5V, VFB1 = VFB2 = 0.8V, SW1 = SW2 = 0.5V 5
VIN shutdown current IVINSDN 30 60 μA TA = 25°C, No load, EN1 = EN2 = 0 V, VREG5 = ON 5
Bandgap initial regulation accuracy VBG -1 1 % TA = 25°C 5
VFBx threshold voltage (TEST2 = 0 V) VVFBTHLx 755 765 775 mV TA = 25°C, TEST2 = 0 V, SWinj = OFF 5
VFBx threshold voltage (TEST2 = 0 V) VVFBTHLx 752 778 mV TA = -40°C to 85°C, TEST2 = 0 V, SWinj = OFF 5
VFBx threshold voltage (TEST2 = V5FILT) VVFBTHHx 748 758 768 mV TA = 25°C, TEST2 = V5FILT, SWinj = OFF 5
VFBx threshold voltage (TEST2 = V5FILT) VVFBTHHx 745 771 mV TA = -40°C to 85°C, TEST2 = V5FILT, SWinj = OFF 5
VFB input current IVFB -0.1 -0.01 0.1 μA VFBx = 0.8 V, TA = 25°C 5
VO discharge resistance RDischg 40 80 Ω ENx = 0 V, VOx = 0.5 V, TA = 25°C 5
VREG5 output voltage VVREG5 4.6 5 5.2 V TA = 25°C, 5.5 V < VIN < 24 V, 0 < IVREG5 < 10 mA 5
DRVH resistance, source RDRVH 5.5 11 Ω Source, IDRVHx = -100 mA 5
DRVH resistance, sink RDRVH 2.5 5 Ω Sink, IDRVHx = 100 mA 5
DRVL resistance, source RDRVL 4 12 Ω Source, IDRVLx = -100 mA 5
DRVL resistance, sink RDRVL 2 4 Ω Sink, IDRVLx = 100 mA 5
Internal boot diode forward voltage VFBST 0.7 0.8 0.9 V VVREG5-VBSTx, IF = 10 mA, TA = 25°C 5
VBST leakage current IVBSTLK 0.1 1 μA VBSTx = 29 V, SWx = 24 V, TA = 25°C 5
Internal soft start time Tss 0.85 1.2 1.4 ms Internal soft start VFBx = 0.735 V 5
V5FILT UVLO threshold, wake up VUV5VFILT 3.7 4 4.3 V Wake up 5
V5FILT UVLO threshold, hysteresis VUV5VFILT 0.2 0.3 0.4 V Hysteresis 5
ENx H-level input voltage VENH 2 V 6
ENx L-level input voltage VENL 0.3 V 6
TRIP source current ITRIP 8.5 10 11.5 μA VTRIPx = 0.1 V, TA = 25°C 6
OCP compensation offset VOCLoff -15 0 15 mV VTRIPx-GND = 60 mV, TA = 25°C 6
OCP compensation offset VOCLoff -20 20 mV VTRIPx-GND = 60 mV 6
Current limit threshold setting range, VTRIPx-GND voltage VRtrip 30 300 mV 6
Output OVP trip threshold, OVP detect VOVP 110 115 120 % OVP detect 6
Output UVP trip threshold, UVP detect VUVP 65 70 75 % UVP detect 6
Dead time, DRVHx-low to DRVLx-on tD 20 50 80 ns DRVHx-low to DRVLx-on 6
Dead time, DRVLx-low to DRVHx-on tD 20 40 80 ns DRVLx-low to DRVHx-on 6
Output UVP delay time tUVPDEL 17 30 40 μs 6
Output UVP enable delay time tUVPEN 1.2 2 2.5 ms UVP enable delay 6
Junction-to-ambient thermal resistance (RGE) RθJA 35.4 °C/W 5
Junction-to-case (top) thermal resistance (RGE) RθJC(top) 39.1 °C/W 5
Junction-to-board thermal resistance (RGE) RθJB 13.6 °C/W 5
Junction-to-top characterization parameter (RGE) ψJT 0.5 °C/W 5
Junction-to-board characterization parameter (RGE) ψJB 13.6 °C/W 5

CAD (KiCad official)

  • Symbol: TPS53126RGET
  • Footprint: Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
  • 3D model: VQFN-24(4x4) (KiCad packages3D, STEP)
  • 3D model files: tps53126rget-etched.step / tps53126rget-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps53126rget.step / tps53126rget.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (34 pp, sha256 5312495eb8164c7c, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF