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TPS27SA08CPWPR

Texas Instruments · Power Distribution Switches · HTSSOP-16

TPS27SA08CPWPR from Texas Instruments, in a HTSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Device ground pin; with a ground protection network (DGND/RGND) the device ground is offset from the microcontroller ground.
2 SNS output Analog sense output that carries a current proportional to load current, supply voltage, or device temperature (selected by SEL1/SEL2) or the fault level ISNSFH; it has an internal clamp at VSNSclamp (5.9 V typ) and must be terminated to GND through 1 kΩ if unused.
3 LATCH input Sets the fault-handling behavior to latched or automatic retry, with VIL max 0.8 V and VIH min 2 V; leave floating or tie to GND through RPROT for auto-retry.
4 EN input Active-high switch control input with VIL max 0.8 V, VIH min 2 V, and an internal 1 MΩ pull-down; the recommended input voltage range is -1 V to 5.5 V.
5 ST output Open-drain, active-low switch diagnostic feedback that is high-impedance without fault and pulled low on fault, with VOL max 0.4 V at 1 mA.
6 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
7 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
8 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
9 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
10 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
11 VOUT output Switch output; all six VOUT pins (6 to 11) must be shorted together on the PCB and routed symmetrically to the power FET.
12 NC unconnected No internal connection.
13 NC unconnected No internal connection.
14 SEL1 input Diagnostic select 1 that chooses between VBB and TJ sensing; if unused, leave floating or tie to GND through RPROT, which leaves only load diagnostics available.
15 SEL2 input Diagnostic select 2; when held at 0 V the VBB measurement diagnostic is unavailable, and if unused it should be tied to GND through RPROT.
16 DIA_EN input Active-high diagnostic enable; when unused, analog sensing, open-load and short-to-supply diagnostics are unavailable, and it should be left floating or tied to GND through RPROT.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-16
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Max continuous supply voltage VBB 36 V 6
Max supply voltage, long transient VTR1 40 V duration < 300ms 6
Max transient voltage at supply input, VBB to IC GND VTR2 54 V 6
Reverse supply voltage VRev -36 V VREV ≤ 3 min, GND network 6
Enable pin voltage VEN -1 7 V 6
LATCH pin voltage VLATCH -1 7 V 6
Status pin voltage VST -1 7 V 6
Diagnostic enable pin voltage VDIA_EN -1 7 V 6
Sense pin voltage VSNS -1 7 V 6
Select pin voltage VSEL1, VSEL2 -1 7 V 6
Reverse current flowing into GND IGND -50 mA VBB < 0V 6
Max junction temperature TJ 150 °C 6
Storage temperature Tstg -65 150 °C 6
Nominal supply voltage (recommended) VBB 8 36 V 6
Enable voltage (recommended) VEN -1 5.5 V 6
LATCH voltage (recommended) VLATCH -1 5.5 V 6
Diagnostic enable voltage (recommended) VDIA_EN -1 5.5 V 6
Select voltage (recommended) VSEL1, VSEL2 -1 5.5 V 6
Status voltage (recommended) VST 0 5.5 V 7
Sense voltage (recommended) VSNS -1 V 7
Continuous load current IMAX 0 10 A TA = 70°C 7
VDS clamp voltage VClamp 40 58 V 7
VBB undervoltage lockout falling VUVLOF 2.5 3 V 7
VBB undervoltage lockout rising VUVLOR 2.5 3 V 7
Output leakage current, 25°C IOUT_OFF 0.01 0.5 µA VBB = 24V, TJ = 25°C, VEN = VDIA_EN = 0V, VOUT = 0V 7
Current in diagnostic mode IDIA 3 6 mA VBB = 24V, ISNS = 0mA, VEN = 0V, VDIA_EN = 5V, VOUT = 0V 7
Quiescent current IQ 2.4 5.2 mA VBB = 24V, VEN = 5V, VDIA_EN = 0V, IOUT = 0A, VSELX = 0V 7
Current sense accuracy at 8A ISNSI -5 5 % VEN = VDIA_EN = 5V, VSEL1 = VSEL2 = 0V, IOUT = 8A 8
Current sense accuracy at 3A ISNSI -5 5 % VEN = VDIA_EN = 5V, VSEL1 = VSEL2 = 0V, IOUT = 3A 8
Current sense accuracy at 780mA ISNSI -5 5 % VEN = VDIA_EN = 5V, VSEL1 = VSEL2 = 0V, IOUT = 780mA 8
Current sense accuracy at 300mA ISNSI -12 12 % VEN = VDIA_EN = 5V, VSEL1 = VSEL2 = 0V, IOUT = 300mA 8
Current sense accuracy at 100mA ISNSI -42 42 % VEN = VDIA_EN = 5V, VSEL1 = VSEL2 = 0V, IOUT = 100mA 8
ISNS fault high level ISNSFH 6 6.9 7.6 mA VDIA_EN = 5V, VSEL1 = 0V, VSEL2 = 0 8
ISNS leakage current ISNSleak 0 1 µA VDIA_EN = 0V 8
Current limit threshold, current-limit loop on ICL 17 22.2 27.8 A TJ = -40°C 8
Current limit threshold, current-limit loop on ICL 15 20 25 A TJ = 25°C 8
Current limit threshold, current-limit loop on ICL 12.8 16 20 A TJ = 125°C 9
Open-load detection voltage VOL 2 2.5 4 V VEN = 0V, VDIA_EN = 5V 9
OL and STB indication time, switch disabled, from EN falling edge tOL1 300 500 700 µs VEN = 5V to 0V, VDIA_EN = 5V, VSELx = 00, IOUT = 0mA, VOUT = 4V 9
Retry time, fault shutdown to switch re-enable tRETRY 1 2 3 ms thermal shutdown, current limit and energy limit 9
EN input voltage low level VIL, EN 0.8 V 9
EN input voltage high level VIH, EN 2 V 无 GND 网络二极管 9
DIA_EN input voltage low level VIL, DIA_EN 0.8 V 无 GND 网络二极管 9
DIA_EN input voltage high level VIH, DIA_EN 2 V 无 GND 网络二极管 9
SELx input voltage low level VIL, SELx 0.8 V 无 GND 网络二极管 9
SELx input voltage high level VIH, SELx 2 V 9
LATCH input voltage low level VIL, LATCH 0.8 V 无 GND 网络二极管 9
LATCH input voltage high level VIH, LATCH 2 V 无 GND 网络二极管 9
ST output voltage low level VOL, ST 0.4 V IST = 1mA 10
Turn-on delay time tDR 20 70 100 µs VBB = 24V, RL = 8Ω 10
Turn-off delay time tDF 20 50 125 µs VBB = 24V, RL = 8Ω 10
VOUT rising slew rate SRR 0.1 0.35 0.8 V/µs VBB = 24V, VOUT 20% to 80%, RL = 8Ω 10
VOUT falling slew rate SRF 0.2 0.5 0.9 V/µs VBB = 24V, VOUT 80% to 20%, RL = 8Ω 10
Turn-on time tON 39 100 180 µs VBB = 24V, RL = 8Ω 10
Turn-off time tOFF 39 90 180 µs VBB = 24V, RL = 8Ω 10
Turn-on and turn-off matching tON - tOFF -80 0 80 µs 200µs enable pulse 10
Junction-to-ambient thermal resistance RθJA 32.8 °C/W JESD51-5/JESD51-7, 4-layer PCB 7
Junction-to-case (top) thermal resistance RθJC(top) 30.7 °C/W JESD51-5/JESD51-7, 4-layer PCB 7
Junction-to-board thermal resistance RθJB 9.3 °C/W JESD51-5/JESD51-7, 4-layer PCB 7
Junction-to-case (bottom) thermal resistance RθJC(bot) 1 °C/W JESD51-5/JESD51-7, 4-layer PCB 7

CAD (KiCad official)

  • Symbol: TPS27SA08CPWPR
  • Footprint: Package_SO:TSSOP-16-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-16 (KiCad packages3D, STEP)
  • 3D model files: tps27sa08cpwpr-etched.step / tps27sa08cpwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps27sa08cpwpr.step / tps27sa08cpwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (51 pp, sha256 a180e810c723eaed, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF