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docs tps2553ddbvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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tps2553ddbvr-etched.glb tps2553ddbvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
tps2553ddbvr-etched.step tps2553ddbvr: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
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TPS2553DDBVR

Texas Instruments · Power Distribution Switches · SOT-23-6

TPS2553DDBVR from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input voltage supply, 2.7 V to 6.5 V. Connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the IC as possible.
2 GND power_in Ground connection. Connect externally to the PowerPAD.
3 EN input Enable input. For TPS2553D a logic-high level turns on the power switch (active-high). V_IH ≥ 1.1 V, V_IL ≤ 0.66 V. Absolute maximum 6.5 V.
4 FAULT output Active-low open-drain fault output. Asserted during overcurrent, overtemperature, or reverse-voltage conditions. Requires an external pull-up resistor; continuous sink current up to 10 mA (25 mA absolute maximum).
5 ILIM passive External resistor sets current-limit threshold. Recommended R_ILIM range 15 kΩ ≤ R_ILIM ≤ 232 kΩ, corresponding to a programmable current limit of about 75 mA to 1700 mA (typ). ILIM source current is 0-1 mA (absolute max).
6 OUT power_out Power-switch output. Connects to load through the internal 85-mΩ (typ) high-side MOSFET. Add a downstream bypass capacitor (e.g., 120 µF for USB compliance).
PAD PowerPAD passive Exposed thermal pad, internally connected to GND. Used to heat-sink the part to the PCB traces. Must be connected externally to the GND pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category Power Management (PMIC)
Pins 7

Ordering variants

Same part, different packaging or reel option.

  • TPS2553DDBVR
  • TPS2553DDBVRDBVT

CAD (KiCad official)

  • Symbol: TPS2553DDBVR
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: tps2553ddbvr-etched.step / tps2553ddbvr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps2553ddbvr.step / tps2553ddbvr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (35 pp, sha256 46d2dd4cbec8c2ab, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF