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TPS22962DNYR

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Texas Instruments Power Distribution Switches, WSON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)tps22962dnyrfactory-2.0.0extractor-text

Verified TPS22962DNYR

by Ray · last 5 Nov 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

5 Nov 2026RayPublished by the parts factory: tier mfr, 9 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: TPS22962DNYR · WSON-8-EP(3x3) · 9 pins
  • ✓copper: 9 copper pads, none touching another net
  • ✓datasheet: all 9 pin names found in the 28-page datasheet
  • ✓distributor: lcsc C2653787, digikey 296-40718-2-ND, mouser 595-TPS22962DNYR
  • ✓family: WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-zyw2izpn/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 9 pins = 9 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 9 pins agree
  • ✓symbol_text: no pin names collide
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ tps22962dnyr.kicad_sym✓ tps22962dnyr.kicad_mod✓ tps22962dnyr.step
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TPS22962DNYR

Texas Instruments · Power Distribution Switches · WSON-8-EP(3x3)

TPS22962DNYR from Texas Instruments, in a WSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Switch input; place ceramic bypass capacitor(s) between this pin and GND, with VIN range 0.8 V to VBIAS.
2 VIN power_in Switch input; place ceramic bypass capacitor(s) between this pin and GND, with VIN range 0.8 V to VBIAS.
3 VBIAS input Bias voltage and power supply to the device, specified from 2.5 V to 5.5 V.
4 ON input Active high switch control input with VIH of 1.2 V to 5.5 V and VIL of 0 V to 0.5 V; do not leave floating.
5 GND power_in Ground reference for the device.
6 VOUT output Switch output; place ceramic bypass capacitor(s) between this pin and GND, with VOUT range 0 V to VIN.
7 VOUT output Switch output; place ceramic bypass capacitor(s) between this pin and GND, with VOUT range 0 V to VIN.
8 VOUT output Switch output; place ceramic bypass capacitor(s) between this pin and GND, with VOUT range 0 V to VIN.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(3x3)
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN Input voltage range VIN -0.3 6 V 3
VBIAS Bias voltage range VBIAS -0.3 6 V 3
VOUT Output voltage range VOUT -0.3 6 V 3
VON ON pin voltage range VON -0.3 6 V 3
Maximum Continuous Switch Current IMAX 10 A TA = 70°C 3
Maximum Pulsed Switch Current IPLS 12 A pulse < 300 µs, 2% duty cycle 3
Maximum junction temperature TJ 125 °C 3
Storage temperature range TSTG -65 150 °C 3
VIN Input voltage range VIN 0.8 V upper limit is VBIAS 4
VBIAS Bias voltage range VBIAS 2.5 5.5 V 4
VON ON voltage range VON 0 5.5 V 4
High-level voltage, ON VIH, ON 1.2 5.5 V VBIAS = 2.5 V to 5.5 V 4
Low-level voltage, ON VIL, ON 0 0.5 V VBIAS = 2.5 V to 5.5 V 4
Operating free-air temperature range TA -40 105 °C 4
VBIAS quiescent current IQ, VBIAS 20.4 26 µA OUT = 0, VIN = VBIAS, VON = 5.0 V, -40°C to 85°C, VBIAS = 5.0 V 5
VBIAS quiescent current IQ, VBIAS 27 µA OUT = 0, VIN = VBIAS, VON = 5.0 V, -40°C to 105°C, VBIAS = 5.0 V 5
VBIAS shutdown current ISD, VBIAS 1.1 1.5 µA VON = 0 V, VOUT = 0 V, -40°C to 85°C, VBIAS = 5.0 V 5
VBIAS shutdown current ISD, VBIAS 1.6 µA VON = 0 V, VOUT = 0 V, -40°C to 105°C, VBIAS = 5.0 V 5
VIN shutdown current ISD, VIN 0.5 µA ON = 0 V, VOUT = 0 V, VIN = 5.0 V, -40°C to 105°C, VBIAS = 5.0 V 5
ON pin leakage current ION 0.1 µA VON = 5.5 V, -40°C to 105°C 5
On-state resistance RON 5.8 mΩ IOUT = -200 mA, VBIAS = 5.0 V, VIN = 5.0 V, -40°C to 105°C 5
Output pulldown resistance RPD 224 233 Ω VIN = 5.0 V, VON = 0 V, VOUT = 1 V, -40°C to 105°C 5
VBIAS quiescent current IQ, VBIAS 9.9 12.5 µA OUT = 0, VIN = VBIAS, VON = 5.0 V, -40°C to 85°C, VBIAS = 2.5 V 6
VBIAS quiescent current IQ, VBIAS 12.7 µA OUT = 0, VIN = VBIAS, VON = 5.0 V, -40°C to 105°C, VBIAS = 2.5 V 6
VBIAS shutdown current ISD, VBIAS 0.5 0.65 µA VON = 0 V, VOUT = 0 V, -40°C to 85°C, VBIAS = 2.5 V 6
VBIAS shutdown current ISD, VBIAS 0.7 µA VON = 0 V, VOUT = 0 V, -40°C to 105°C, VBIAS = 2.5 V 6
VIN shutdown current ISD, VIN 0.5 µA ON = 0 V, VOUT = 0 V, VIN = 2.5 V, -40°C to 105°C, VBIAS = 2.5 V 6
On-state resistance RON 6.2 mΩ IOUT = -200 mA, VBIAS = 2.5 V, VIN = 2.5 V, -40°C to 105°C 6
On-state resistance RON 6 mΩ IOUT = -200 mA, VBIAS = 2.5 V, VIN = 1.8 V, -40°C to 105°C 6
On-state resistance RON 5.9 mΩ IOUT = -200 mA, VBIAS = 2.5 V, VIN = 1.05 V, -40°C to 105°C 6
Output pulldown resistance RPD 224 233 Ω VIN = 2.5 V, VON = 0 V, VOUT = 1 V, -40°C to 105°C, VBIAS = 2.5 V 6
On-state resistance RON 5.6 mΩ IOUT = -200 mA, VBIAS = 5.0 V, VIN = 5.0 V, -40°C to 85°C 5
On-state resistance RON 5.8 mΩ IOUT = -200 mA, VBIAS = 2.5 V, VIN = 1.8 V, -40°C to 85°C 6
On-state resistance RON 5.7 mΩ IOUT = -200 mA, VBIAS = 2.5 V, VIN = 1.05 V, -40°C to 85°C 6
Junction-to-ambient thermal resistance RθJA 44.6 °C/W 4
Junction-to-case (top) thermal resistance RθJCtop 44.4 °C/W 4
Junction-to-board thermal resistance RθJB 17.6 °C/W 4
Junction-to-top characterization parameter ψJT 0.4 °C/W 4
Junction-to-board characterization parameter ψJB 17.4 °C/W 4
Junction-to-case (bottom) thermal resistance RθJCbot 1.1 °C/W 4

CAD (KiCad official)

  • Symbol: TPS22962DNYR
  • Footprint: Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm
  • 3D model: WSON-8-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps22962dnyr-etched.step / tps22962dnyr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps22962dnyr.step / tps22962dnyr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 18d885300734d7ed, retrieved 2026-11-05, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF