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Ray Publish 0.1.0 b0b9f2c 29d ago

TPS2066TDGNRQ1

Texas Instruments · Power Distribution Switches · MSOP-8-EP

TPS2066TDGNRQ1 from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference for the device; all voltages are referenced to GND, and the exposed PowerPAD should be connected to this pin.
2 IN power_in Input voltage supply for the power switches, recommended 2.7 V to 5.5 V, with a 0.01-μF to 0.1-μF ceramic bypass capacitor to GND placed close to the device; the UVLO turns the switch off below approximately 2 V.
3 EN1 input Enable input for power switch IN-OUT1 where logic high turns the switch on; VIH minimum is 2 V and VIL maximum is 0.8 V for 2.7 V ≤ VI(IN) ≤ 5.5 V, with an input voltage range of 0 V to 5.5 V.
4 EN2 input Enable input for power switch IN-OUT2 where logic high turns the switch on; VIH minimum is 2 V and VIL maximum is 0.8 V for 2.7 V ≤ VI(IN) ≤ 5.5 V, with an input voltage range of 0 V to 5.5 V.
5 OC2 output Open-drain overcurrent output for IN-OUT2, active low, asserted after a 4 to 15 ms (typical 8 ms) deglitch on overcurrent or overtemperature, with output low voltage of 0.4 V maximum at 5 mA.
6 OUT2 output Power-switch output for IN-OUT2, with continuous output current rated 0 to 1 A and the switch entering constant-current mode when the overcurrent trip threshold is reached.
7 OUT1 output Power-switch output for IN-OUT1, with continuous output current rated 0 to 1 A and the switch entering constant-current mode when the overcurrent trip threshold is reached.
8 OC1 output Open-drain overcurrent output for IN-OUT1, active low, asserted after a 4 to 15 ms (typical 8 ms) deglitch on overcurrent or overtemperature, with output low voltage of 0.4 V maximum at 5 mA.
9 PowerPAD power_in Exposed thermal pad internally connected to GND that heat-sinks the part to the circuit board traces and should be connected to the GND pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-8-EP
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: TPS2066TDGNRQ1
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: tps2066tdgnrq1-etched.step / tps2066tdgnrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps2066tdgnrq1.step / tps2066tdgnrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 40d36ba01a386d39, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF