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TPS2066DGNR
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Texas Instruments Power Distribution Switches, MSOP-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+54@@ -0,0 +1,54 @@+# TPS2066DGNR++**Texas Instruments** · Power Distribution Switches · MSOP-8-EP++TPS2066DGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | GND | power_in | Device ground return. Also thermally tied to the exposed PowerPAD, which must be soldered to a GND copper plane to meet the specified thermal impedance. |+| 2 | IN | power_in | Input supply for both power-switch channels. Operating range 2.7 V to 5.5 V. Bypass with a low-ESR ceramic capacitor (typ. 0.1 μF or greater) close to the pin. |+| 3 | EN1 | input | Channel-1 enable input; active-HIGH on TPS2066 (logic high turns on IN→OUT1 power switch). CMOS-compatible logic level referenced to GND. |+| 4 | EN2 | input | Channel-2 enable input; active-HIGH on TPS2066 (logic high turns on IN→OUT2 power switch). CMOS-compatible logic level referenced to GND. |+| 5 | OC2 | output | Channel-2 overcurrent flag. Open-drain, active-LOW output that asserts when the OUT2 switch enters current-limit or thermal-shutdown. Requires an external pull-up resistor to a logic supply. |+| 6 | OUT2 | power_out | Power-switch output for channel 2 (from IN through internal 70 mΩ high-side MOSFET). Rated 1 A continuous with current limit typ. 1.5 A (1.1 A min / 1.9 A max). |+| 7 | OUT1 | power_out | Power-switch output for channel 1 (from IN through internal 70 mΩ high-side MOSFET). Rated 1 A continuous with current limit typ. 1.5 A (1.1 A min / 1.9 A max). |+| 8 | OC1 | output | Channel-1 overcurrent flag. Open-drain, active-LOW output that asserts when the OUT1 switch enters current-limit or thermal-shutdown. Requires an external pull-up resistor to a logic supply. |+| PAD | PowerPAD | power_in | Exposed thermal pad on the underside of the HVSSOP (DGN) package. Internally connected to GND and must be soldered to a GND copper area to achieve the specified thermal impedance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | MSOP-8-EP |+| Category | Power Management (PMIC) |+| Pins | 9 |++## Ordering variants++Same part, different packaging or reel option.++- `TPS2066DGNR`+- `TPS2066DGNRG4`+- `TPS2066DGNRDR`+- `TPS2066DGNRD`++## CAD (KiCad official)++- Symbol: `TPS2066DGNR`+- Footprint: `Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm`+- 3D model: MSOP-8-EP (KiCad packages3D, STEP)++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps2065) (None pp, sha256 `a6fcc7016ddc184f`, retrieved 2026-08-17, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tps2066dgnr-datasheet.pdf)
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