component
TPS2066DGNR
Public Made by Adomby adom
Texas Instruments Power Distribution Switches, MSOP-8-EP. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS2066DGNR
Texas Instruments · Power Distribution Switches · MSOP-8-EP
TPS2066DGNR from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Device ground return. Also thermally tied to the exposed PowerPAD, which must be soldered to a GND copper plane to meet the specified thermal impedance. |
| 2 | IN | power_in | Input supply for both power-switch channels. Operating range 2.7 V to 5.5 V. Bypass with a low-ESR ceramic capacitor (typ. 0.1 μF or greater) close to the pin. |
| 3 | EN1 | input | Channel-1 enable input; active-HIGH on TPS2066 (logic high turns on IN→OUT1 power switch). CMOS-compatible logic level referenced to GND. |
| 4 | EN2 | input | Channel-2 enable input; active-HIGH on TPS2066 (logic high turns on IN→OUT2 power switch). CMOS-compatible logic level referenced to GND. |
| 5 | OC2 | output | Channel-2 overcurrent flag. Open-drain, active-LOW output that asserts when the OUT2 switch enters current-limit or thermal-shutdown. Requires an external pull-up resistor to a logic supply. |
| 6 | OUT2 | power_out | Power-switch output for channel 2 (from IN through internal 70 mΩ high-side MOSFET). Rated 1 A continuous with current limit typ. 1.5 A (1.1 A min / 1.9 A max). |
| 7 | OUT1 | power_out | Power-switch output for channel 1 (from IN through internal 70 mΩ high-side MOSFET). Rated 1 A continuous with current limit typ. 1.5 A (1.1 A min / 1.9 A max). |
| 8 | OC1 | output | Channel-1 overcurrent flag. Open-drain, active-LOW output that asserts when the OUT1 switch enters current-limit or thermal-shutdown. Requires an external pull-up resistor to a logic supply. |
| PAD | PowerPAD | power_in | Exposed thermal pad on the underside of the HVSSOP (DGN) package. Internally connected to GND and must be soldered to a GND copper area to achieve the specified thermal impedance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
Ordering variants
Same part, different packaging or reel option.
TPS2066DGNRTPS2066DGNRG4TPS2066DGNRDRTPS2066DGNRD
CAD (KiCad official)
- Symbol:
TPS2066DGNR - Footprint:
Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm - 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
tps2066dgnr-etched.step/tps2066dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps2066dgnr.step/tps2066dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (None pp, sha256
a6fcc7016ddc184f, retrieved 2026-08-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).