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TPS2024IDRG4Q1
Public Made by Adomby adom
Texas Instruments Power Distribution Switches, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPS2024IDRG4Q1
Texas Instruments · Power Distribution Switches · SOIC-8
TPS2024IDRG4Q1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground connection for the device. |
| 2 | IN | power_in | Input voltage to the power switch, which operates from 2.7 V to 5.5 V. |
| 3 | IN | power_in | Input voltage to the power switch, which operates from 2.7 V to 5.5 V. |
| 4 | EN | input | Active-low logic enable that turns on the power switch when driven low and is compatible with TTL and CMOS logic levels. |
| 5 | OC | output | Open-drain overcurrent logic output that is asserted active-low during an overcurrent or overtemperature condition. |
| 6 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
| 7 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
| 8 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range | VI(IN) | 2.7 | 5.5 | V | 4 | ||
| Enable input voltage range | VI(EN) | 0 | 5.5 | V | 4 | ||
| Continuous output current TPS2024 | IO | 0 | 2 | A | TPS2024 | 4 | |
| Operating virtual junction temperature range | TJ | -40 | 125 | °C | 4 | ||
| Input voltage range (absolute maximum) | VI(IN) | -0.3 | 6 | V | with respect to GND | 4 | |
| Output voltage range (absolute maximum) | VO(OUT) | -0.3 | V | max printed as VI(IN) + 0.3 V | 4 | ||
| Input voltage range EN (absolute maximum) | VI(EN) | -0.3 | 6 | V | 4 | ||
| Operating virtual junction temperature range (absolute maximum) | TJ | -40 | 125 | °C | 4 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 4 | ||
| Human body model ESD protection | 2 | kV | Human body model | 4 | |||
| Machine model ESD protection | 200 | V | Machine model | 4 | |||
| Charged device model ESD protection | 750 | V | Charged device model (CDM) | 4 | |||
| Total power dissipation, package D | 725 | mW | TA ≤ 25°C; derating 5.8 mW/°C above TA = 25°C | 4 | |||
| Thermal resistance junction-to-ambient, SOIC | RθJA | 172 | °C/W | SOIC | 19 | ||
| Static drain-source on-state resistance | rDS(on) | 33 | 43.5 | 43.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 25°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 38 | 57.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 85°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 44 | 62.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 125°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 37 | 48.5 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 25°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 43 | 68.5 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 85°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 51 | 87 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 125°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 30 | 43.5 | mΩ | VI(IN) = 5 V, IO = 1 A, TJ = 25°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 43 | 62.5 | mΩ | VI(IN) = 5 V, IO = 1 A, TJ = 125°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 31 | 48.5 | mΩ | VI(IN) = 3.3 V, IO = 1 A, TJ = 25°C | 5 | |
| Static drain-source on-state resistance | rDS(on) | 48 | 87 | mΩ | VI(IN) = 3.3 V, IO = 1 A, TJ = 125°C | 5 | |
| High-level input voltage EN | VIH | 2 | V | 2.7 V ≤ VI(IN) ≤ 5.5 V, full range | 5 | ||
| Low-level input voltage EN | VIL | 0.8 | V | 4.5 V ≤ VI(IN) ≤ 5.5 V, full range | 5 | ||
| Low-level input voltage EN | VIL | 0.5 | V | 2.7 V ≤ VI(IN) ≤ 4.5 V, full range | 5 | ||
| Input current EN | II | -0.5 | 0.5 | mA | EN = 0 V or EN = VI(IN), full range | 5 | |
| Turnon time | ton | 20 | ms | CL = 100 mF, RL = 10 Ω, full range | 5 | ||
| Turnoff time | toff | 40 | ms | CL = 100 mF, RL = 10 Ω, full range | 5 | ||
| Short-circuit output current TPS2024 | IOS | 2 | 3 | 4.2 | A | VI = 5.5 V, OUT connected to GND, device enabled into short circuit, 25°C | 5 |
| Supply current, low-level output | 0.3 | 1 | mA | No load on OUT, EN = VI(IN), 25°C | 6 | ||
| Supply current, low-level output | 10 | mA | No load on OUT, EN = VI(IN), full range | 6 | |||
| Supply current, high-level output | 58 | 75 | mA | No load on OUT, EN = 0 V, 25°C | 6 | ||
| Supply current, high-level output | 100 | mA | No load on OUT, EN = 0 V, full range | 6 | |||
| Leakage current | 10 | mA | OUT connected to ground, EN = VI(IN), full range | 6 | |||
| Undervoltage lockout low-level input voltage | 2 | 2.5 | V | full range | 6 | ||
| Undervoltage lockout hysteresis | 100 | mV | 25°C | 6 | |||
| Overcurrent output low voltage | VOL(OC) | 0.4 | V | IO = 10 mA, full range | 6 | ||
| Overcurrent off-state current | 1 | mA | VO = 5 V, VO = 3.3 V, full range; specified by design | 6 |
CAD (KiCad official)
- Symbol:
TPS2024IDRG4Q1 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tps2024idrg4q1-etched.step/tps2024idrg4q1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps2024idrg4q1.step/tps2024idrg4q1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (28 pp, sha256
96c12f53a3191566, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPS2024IDRG4Q1
**Texas Instruments** · Power Distribution Switches · SOIC-8
TPS2024IDRG4Q1 from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground connection for the device. |
| 2 | IN | power_in | Input voltage to the power switch, which operates from 2.7 V to 5.5 V. |
| 3 | IN | power_in | Input voltage to the power switch, which operates from 2.7 V to 5.5 V. |
| 4 | EN | input | Active-low logic enable that turns on the power switch when driven low and is compatible with TTL and CMOS logic levels. |
| 5 | OC | output | Open-drain overcurrent logic output that is asserted active-low during an overcurrent or overtemperature condition. |
| 6 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
| 7 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
| 8 | OUT | power_out | Power-switch output of the high-side N-channel MOSFET, which has a maximum on-state resistance of 50 mΩ at VI(IN) = 5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range | VI(IN) | 2.7 | | 5.5 | V | | 4 |
| Enable input voltage range | VI(EN) | 0 | | 5.5 | V | | 4 |
| Continuous output current TPS2024 | IO | 0 | | 2 | A | TPS2024 | 4 |
| Operating virtual junction temperature range | TJ | -40 | | 125 | °C | | 4 |
| Input voltage range (absolute maximum) | VI(IN) | -0.3 | | 6 | V | with respect to GND | 4 |
| Output voltage range (absolute maximum) | VO(OUT) | -0.3 | | | V | max printed as VI(IN) + 0.3 V | 4 |
| Input voltage range EN (absolute maximum) | VI(EN) | -0.3 | | 6 | V | | 4 |
| Operating virtual junction temperature range (absolute maximum) | TJ | -40 | | 125 | °C | | 4 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 4 |
| Human body model ESD protection | | | | 2 | kV | Human body model | 4 |
| Machine model ESD protection | | | | 200 | V | Machine model | 4 |
| Charged device model ESD protection | | | | 750 | V | Charged device model (CDM) | 4 |
| Total power dissipation, package D | | | | 725 | mW | TA ≤ 25°C; derating 5.8 mW/°C above TA = 25°C | 4 |
| Thermal resistance junction-to-ambient, SOIC | RθJA | | 172 | | °C/W | SOIC | 19 |
| Static drain-source on-state resistance | rDS(on) | 33 | 43.5 | 43.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 25°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 38 | | 57.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 85°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 44 | | 62.5 | mΩ | VI(IN) = 5 V, IO = 1.8 A, TJ = 125°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 37 | | 48.5 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 25°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 43 | | 68.5 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 85°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 51 | | 87 | mΩ | VI(IN) = 3.3 V, IO = 1.8 A, TJ = 125°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 30 | | 43.5 | mΩ | VI(IN) = 5 V, IO = 1 A, TJ = 25°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 43 | | 62.5 | mΩ | VI(IN) = 5 V, IO = 1 A, TJ = 125°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 31 | | 48.5 | mΩ | VI(IN) = 3.3 V, IO = 1 A, TJ = 25°C | 5 |
| Static drain-source on-state resistance | rDS(on) | 48 | | 87 | mΩ | VI(IN) = 3.3 V, IO = 1 A, TJ = 125°C | 5 |
| High-level input voltage EN | VIH | 2 | | | V | 2.7 V ≤ VI(IN) ≤ 5.5 V, full range | 5 |
| Low-level input voltage EN | VIL | | | 0.8 | V | 4.5 V ≤ VI(IN) ≤ 5.5 V, full range | 5 |
| Low-level input voltage EN | VIL | | | 0.5 | V | 2.7 V ≤ VI(IN) ≤ 4.5 V, full range | 5 |
| Input current EN | II | -0.5 | | 0.5 | mA | EN = 0 V or EN = VI(IN), full range | 5 |
| Turnon time | ton | | | 20 | ms | CL = 100 mF, RL = 10 Ω, full range | 5 |
| Turnoff time | toff | | | 40 | ms | CL = 100 mF, RL = 10 Ω, full range | 5 |
| Short-circuit output current TPS2024 | IOS | 2 | 3 | 4.2 | A | VI = 5.5 V, OUT connected to GND, device enabled into short circuit, 25°C | 5 |
| Supply current, low-level output | | | 0.3 | 1 | mA | No load on OUT, EN = VI(IN), 25°C | 6 |
| Supply current, low-level output | | | | 10 | mA | No load on OUT, EN = VI(IN), full range | 6 |
| Supply current, high-level output | | | 58 | 75 | mA | No load on OUT, EN = 0 V, 25°C | 6 |
| Supply current, high-level output | | | | 100 | mA | No load on OUT, EN = 0 V, full range | 6 |
| Leakage current | | | | 10 | mA | OUT connected to ground, EN = VI(IN), full range | 6 |
| Undervoltage lockout low-level input voltage | | 2 | | 2.5 | V | full range | 6 |
| Undervoltage lockout hysteresis | | | 100 | | mV | 25°C | 6 |
| Overcurrent output low voltage | VOL(OC) | | | 0.4 | V | IO = 10 mA, full range | 6 |
| Overcurrent off-state current | | | | 1 | mA | VO = 5 V, VO = 3.3 V, full range; specified by design | 6 |
## CAD (KiCad official)
- Symbol: `TPS2024IDRG4Q1`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `tps2024idrg4q1-etched.step` / `tps2024idrg4q1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps2024idrg4q1.step` / `tps2024idrg4q1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tps2024-q1.pdf) (28 pp, sha256 `96c12f53a3191566`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tps2024idrg4q1-datasheet.pdf)