TPS16850VMAR - 9 V to 80 V, 20 A eFuse - provenance/tps16850vmar-lbr-input.kicad_mod

by adom

Texas Instruments TPS16850VMAR: 9 V to 80 V, 20 A stackable integrated hot-swap eFuse with a 3.5 mOhm FET, fast current monitor and auto-retry fault response, LQFN-CLIP-23 (VMA, 6.0 x 5.0 mm). KiCad symbol and footprint, Fusion and Altium libraries, datasheet-built 3D model and datasheet.

component ic power efuse hot-swap circuit-protection texas-instruments lqfn 48v

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John Lauer Component record TPS16850VMAR: files batch 1 6db00ed 19h ago

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(footprint "tps16850vmar"
  (version 20240108)
  (generator "adom-footprint")
  (layer "F.Cu")
  (descr "TI VMA0023A LQFN-CLIP-23, 6.0 x 5.0 mm, 1.5 mm max height; land pattern and stencil per TI SLVSHA1D p.55-56 (TPS1685x eFuse)")
  (tags "TPS1685 TPS16850 VMA0023A LQFN-CLIP QFN eFuse")
  (attr smd)
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    (layer "F.SilkS") (effects (font (size 1 1) (thickness 0.15))))
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    (layers "*.Cu") (property pad_prop_heatsink))
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  (pad "22" smd rect (at -2.1 -2.3125) (size 2.3 0.875) (layers "F.Cu") (solder_mask_margin -1.2) (solder_paste_margin -1.2))
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  (pad "7" smd rect (at -0.925 2.325) (size 1.65 0.85) (layers "F.Cu") (solder_mask_margin -1.2) (solder_paste_margin -1.2))
  (pad "7" smd rect (at -0.925 2.1) (size 1.55 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0))
  (pad "7" smd rect (at -1.6 2.475) (size 0.2 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0))
  (pad "7" smd rect (at -1.15 2.475) (size 0.2 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0))
  (pad "7" smd rect (at -0.7 2.475) (size 0.2 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0))
  (pad "7" smd rect (at -0.25 2.475) (size 0.2 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (solder_mask_margin 0))
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  (model "${KIPRJMOD}/tps16850vmar-etched.step"
    (offset (xyz 0 0 0)) (scale (xyz 1 1 1)) (rotate (xyz 0 0 0)))
)