Loads on click. Unloads only if this page sits in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads on click. Unloads only if this page sits in the background.

PCB Footprint

Open full view ↗
Loads on click. Unloads only if this page sits in the background.
Loads on click. Unloads only if this page sits in the background.
Download PDF
Contents

README

markdown

TPNCS20082DMR2G

TECH PUBLIC · Operational Amplifier · MSOP-8

TPNCS20082DMR2G from TECH PUBLIC, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUTA output Amplifier A output. Rail-to-rail output swing (VOL-VSS and VDD-VOH < 60mV @ RL=5kΩ to VDD/2). Short-circuit current ±20mA typical.
2 INA- input Amplifier A inverting input. High-impedance CMOS input; input bias current ~10pA typical. Common-mode range VSS-0.1V to VDD+0.1V.
3 INA+ input Amplifier A non-inverting input. High-impedance CMOS input; rail-to-rail input common-mode range (VSS-0.1V to VDD+0.1V).
4 VSS power_in Negative supply / ground. Single-supply operation ties this to GND; dual-supply operation can use ±0.9V to ±2.75V. Bypass with 0.1µF ceramic capacitor in dual-supply designs.
5 INB+ input Amplifier B non-inverting input. High-impedance CMOS input; rail-to-rail input common-mode range (VSS-0.1V to VDD+0.1V).
6 INB- input Amplifier B inverting input. High-impedance CMOS input; input bias current ~10pA typical.
7 OUTB output Amplifier B output. Rail-to-rail output swing; can drive up to 250pF capacitive load in unity-gain without oscillation.
8 VDD power_in Positive supply. Operates from +1.8V to +5.5V single-supply (or ±0.9V to ±2.75V dual-supply). Place a 0.1µF ceramic bypass capacitor close to this pin.

Key specifications

Parameter Value
Manufacturer TECH PUBLIC
Package MSOP-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • TPNCS20082DMR2G
  • TPNCS20082DMR2GDR2G

CAD (KiCad official)

  • Symbol: TPNCS20082DMR2G
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: tpncs20082dmr2g-etched.step / tpncs20082dmr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpncs20082dmr2g.step / tpncs20082dmr2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TECH PUBLIC datasheet (13 pp, sha256 cb437d99bdea21f8, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF