# TPM2601C3

**TECH PUBLIC** · MOSFETs · SOT-323

TPM2601C3 from TECH PUBLIC, in a SOT-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the P-channel MOSFET; gate-source voltage VGS is rated ±10 V (absolute maximum). |
| 2 | S | passive | Source of the P-channel MOSFET; the datasheet gives no separate limit for this pin, and VGS is referenced to it. |
| 3 | D | passive | Drain of the P-channel MOSFET; rated for drain-source voltage VDS = -20 V, continuous drain current ID = -2.3 A, and pulsed drain current IDM = -5.0 A (tp = 10 µs). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TECH PUBLIC |
| Package | SOT-323 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -20 |  |  | V |  | 1 |
| Gate-Source Voltage | VGS | -10 |  | 10 | V |  | 1 |
| Continuous Drain Current | ID | -2.3 |  |  | A |  | 1 |
| Pulsed Drain Current | IDM | -5 |  |  | A | tp=10µs | 1 |
| Power Dissipation | PD |  |  | 0.29 | W |  | 1 |
| Junction Temperature | TJ |  |  | 125 | ℃ |  | 1 |
| Storage Temperature | Tstg | -50 |  | 150 | ℃ |  | 1 |
| Drain-Source Breakdown Voltage | VDSS | -20 | -20 |  | V | VGS = 0V, ID =-250µA | 2 |
| Gate-Source Leakage | IGSS | -100 |  | 100 | nA | VDS =0V, VGS =±8V | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | -1 | µA | VDS =-20V, VGS =0V | 2 |
| Gate-Source Threshold Voltage | VGS(th) | -0.45 | -0.7 |  | V | VDS =VGS, ID =-250µA | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 100 |  | mΩ | VGS =-4.5V, ID =-2.3A | 2 |
| Drain-Source On-State Resistance | RDS(on) |  | 125 |  | mΩ | VGS =-2.5V, ID =-1A | 2 |
| Thermal Resistance from Junction to Ambient | RθJA |  | 431 |  | ℃/W |  | 1 |

## CAD (KiCad official)

- Symbol: `TPM2601C3`
- Footprint: `Package_TO_SOT_SMD:SOT-323_SC-70`
- 3D model: SOT-323 (KiCad packages3D, STEP)
- 3D model files: `tpm2601c3-etched.step` / `tpm2601c3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpm2601c3.step` / `tpm2601c3.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TECH PUBLIC datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588917472108298240) (3 pp, sha256 `f0646af6412b9c9c`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tpm2601c3-datasheet.pdf)