component
TPL710F33-5TR
Public Made by Adomby adom
3PEAK Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, SOT-23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPL710F33-5TR
3PEAK · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5
TPL710F33-5TR from 3PEAK, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input voltage pin, operating range 2.4 V to 6 V; bypass IN to GND with a 1 µF or greater capacitor. |
| 2 | GND | power_in | Ground reference pin; connect directly to the PCB ground plane. |
| 3 | EN | input | Active-high regulator enable: drive high to turn on and low to turn off (VIH min 1.2 V, VIL max 0.4 V); connect to IN for automatic startup. |
| 4 | NC | unconnected | No connection. |
| 5 | OUT | power_out | Regulated output voltage pin, up to 200 mA; bypass OUT to GND with a 2.2 µF or greater capacitor. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 3PEAK |
| Package | SOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 2.4 | 6 | V | 7 | ||
| Ground Pin Current | IGND | 1.4 | 8 | µA | IOUT = 0 mA, -40°C ≤ TJ ≤ +105°C | 7 | |
| Ground Pin Current | IGND | 30 | µA | IOUT = 0 mA, -40°C ≤ TJ ≤ +125°C | 7 | ||
| Ground Pin Current | IGND | 500 | µA | VIN = 5 V, IOUT = 200 mA | 7 | ||
| Shutdown Current | ISHDN | 0.1 | 3 | µA | EN = GND, -40°C ≤ TJ ≤ +105°C | 7 | |
| Shutdown Current | ISHDN | 5 | µA | EN = GND, -40°C ≤ TJ ≤ +125°C | 7 | ||
| EN Logic-input High Level (Enable) | VIH (EN) | 1.2 | V | 7 | |||
| EN Logic-input Low Level (Disable) | VIL (EN) | 0 | 0.4 | V | 7 | ||
| EN Pin Leakage Current | IEN | 20 | nA | EN = VIN | 7 | ||
| Output Voltage Accuracy | VOUT | -1 | 1 | % | IOUT = 30 mA, TJ = +25°C | 7 | |
| Output Voltage Accuracy | VOUT | -3 | 3 | % | IOUT = 30 mA, -40°C ≤ TJ ≤ +125°C | 7 | |
| Line Regulation | VREF_I | 3 | mV | VIN = VOUT (NOM) + 1 V to 6 V, or VIN ≥2.4V, IOUT = 1 mA | 7 | ||
| Load Regulation | 40 | mV | IOUT = 1 mA to 200 mA | 7 | |||
| Dropout Voltage | VDO | 40 | mV | IOUT | 7 | ||
| Dropout Voltage | VDO | 80 | mV | VIN = 0.98 × VOUT (NOM), IOUT = 100 mA | 7 | ||
| Dropout Voltage | VDO | 170 | mV | VIN = 0.98 × VOUT (NOM), IOUT = 200 mA | 8 | ||
| Output Current | IOUT | 0 | 200 | mA | VOUT in Regulation | 8 | |
| Output Current limit | ICL | 300 | 560 | 800 | mA | VOUT = 0.9 × VOUT (NOM) | 8 |
| Output Discharge Resistance | RDIS | 190 | Ω | VIN = VOUT (NOM) + 1 V, EN = GND | 8 | ||
| Power Supply Rejection Ratio | PSRR | 55 | dB | IOUT = 10 mA, f = 100 Hz, COUT = 2.2 µF | 8 | ||
| Power Supply Rejection Ratio | PSRR | 54 | dB | IOUT = 10 mA, f = 1 kHz, COUT = 2.2 µF | 8 | ||
| Power Supply Rejection Ratio | PSRR | 50 | dB | IOUT = 10 mA, f = 10 kHz, COUT = 2.2 µF | 8 | ||
| Power Supply Rejection Ratio | PSRR | 53 | dB | IOUT = 10 mA, f = 1 MHz, COUT = 2.2 µF | 8 | ||
| Output Noise Voltage | VN | 90 | µVRMS | IOUT = 10 mA, BW = 10Hz to 100 kHz | 8 | ||
| Start-up Time from EN | TSTR | 680 | µs | Assertion to 0.98 × VOUT (NOM), IOUT= 200 mA, COUT = 2.2 μF | 8 | ||
| UVLO VIN Rising | 1.8 | V | VIN Rising | 7 | |||
| UVLO Hysteresis | 200 | mV | Hysteresis | 7 | |||
| Thermal Shutdown Temperature | TSD | 165 | ºC | 8 | |||
| Thermal Shutdown Hysteresis | 15 | ºC | 8 | ||||
| VIN, VEN Input Voltage | VIN, VEN | -0.3 | 6.5 | V | Voltages with respect to GND | 6 | |
| VOUT Output Voltage | VOUT | -0.3 | 6.5 | V | Voltages with respect to GND | 6 | |
| TJ Junction Temperature Range | TJ | -40 | 150 | °C | 6 | ||
| TSTG Storage Temperature Range | TSTG | -65 | 150 | °C | 6 | ||
| TL Lead Temperature (Soldering 10 sec) | TL | 260 | °C | Soldering 10 sec | 6 | ||
| ESD Human Body Model | HBM | -4 | 4 | kV | ANSI/ESDA/JEDEC JS-001 | 6 | |
| ESD Charged Device Model | CDM | -1 | 1 | kV | ANSI/ESDA/JEDEC JS-002 | 6 | |
| VIN Input Voltage | VIN | 2.4 | 6 | V | 6 | ||
| VEN Enable Voltage | VEN | 0 | V | Maximum printed as VIN | 6 | ||
| VOUT Output Voltage | VOUT | 0 | 5 | V | 6 | ||
| IOUT Output Current | IOUT | 0 | 200 | mA | 6 | ||
| TJ Operating Junction Temperature Range | TJ | -40 | 125 | °C | 6 | ||
| Junction-to-ambient thermal resistance | θJA | 280 | °C/W | SOT23-5 package | 6 | ||
| Junction-to-case thermal resistance | θJC | 62 | °C/W | SOT23-5 package | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | bypass capacitor connection, the IN pin, and the GND pin of the system must be as small as possible. • It is recommended to use wide and thick copper to minimize I×R drop and heat dissipation. | 15 |
CAD (KiCad official)
- Symbol:
TPL710F33-5TR - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
tpl710f33-5tr-etched.step/tpl710f33-5tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpl710f33-5tr.step/tpl710f33-5tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: 3PEAK datasheet (22 pp, sha256
beafa4546969f4ab, retrieved 2026-11-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPL710F33-5TR
**3PEAK** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5
TPL710F33-5TR from 3PEAK, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Input voltage pin, operating range 2.4 V to 6 V; bypass IN to GND with a 1 µF or greater capacitor. |
| 2 | GND | power_in | Ground reference pin; connect directly to the PCB ground plane. |
| 3 | EN | input | Active-high regulator enable: drive high to turn on and low to turn off (VIH min 1.2 V, VIL max 0.4 V); connect to IN for automatic startup. |
| 4 | NC | unconnected | No connection. |
| 5 | OUT | power_out | Regulated output voltage pin, up to 200 mA; bypass OUT to GND with a 2.2 µF or greater capacitor. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | 3PEAK |
| Package | SOT-23-5 |
| Category | Power Management (PMIC) |
| Pins | 5 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage Range | VIN | 2.4 | | 6 | V | | 7 |
| Ground Pin Current | IGND | | 1.4 | 8 | µA | IOUT = 0 mA, -40°C ≤ TJ ≤ +105°C | 7 |
| Ground Pin Current | IGND | | | 30 | µA | IOUT = 0 mA, -40°C ≤ TJ ≤ +125°C | 7 |
| Ground Pin Current | IGND | | | 500 | µA | VIN = 5 V, IOUT = 200 mA | 7 |
| Shutdown Current | ISHDN | | 0.1 | 3 | µA | EN = GND, -40°C ≤ TJ ≤ +105°C | 7 |
| Shutdown Current | ISHDN | | | 5 | µA | EN = GND, -40°C ≤ TJ ≤ +125°C | 7 |
| EN Logic-input High Level (Enable) | VIH (EN) | 1.2 | | | V | | 7 |
| EN Logic-input Low Level (Disable) | VIL (EN) | 0 | | 0.4 | V | | 7 |
| EN Pin Leakage Current | IEN | | | 20 | nA | EN = VIN | 7 |
| Output Voltage Accuracy | VOUT | -1 | | 1 | % | IOUT = 30 mA, TJ = +25°C | 7 |
| Output Voltage Accuracy | VOUT | -3 | | 3 | % | IOUT = 30 mA, -40°C ≤ TJ ≤ +125°C | 7 |
| Line Regulation | VREF_I | | | 3 | mV | VIN = VOUT (NOM) + 1 V to 6 V, or VIN ≥2.4V, IOUT = 1 mA | 7 |
| Load Regulation | | | | 40 | mV | IOUT = 1 mA to 200 mA | 7 |
| Dropout Voltage | VDO | | | 40 | mV | IOUT | 7 |
| Dropout Voltage | VDO | | | 80 | mV | VIN = 0.98 × VOUT (NOM), IOUT = 100 mA | 7 |
| Dropout Voltage | VDO | | | 170 | mV | VIN = 0.98 × VOUT (NOM), IOUT = 200 mA | 8 |
| Output Current | IOUT | 0 | | 200 | mA | VOUT in Regulation | 8 |
| Output Current limit | ICL | 300 | 560 | 800 | mA | VOUT = 0.9 × VOUT (NOM) | 8 |
| Output Discharge Resistance | RDIS | | 190 | | Ω | VIN = VOUT (NOM) + 1 V, EN = GND | 8 |
| Power Supply Rejection Ratio | PSRR | | 55 | | dB | IOUT = 10 mA, f = 100 Hz, COUT = 2.2 µF | 8 |
| Power Supply Rejection Ratio | PSRR | | 54 | | dB | IOUT = 10 mA, f = 1 kHz, COUT = 2.2 µF | 8 |
| Power Supply Rejection Ratio | PSRR | | 50 | | dB | IOUT = 10 mA, f = 10 kHz, COUT = 2.2 µF | 8 |
| Power Supply Rejection Ratio | PSRR | | 53 | | dB | IOUT = 10 mA, f = 1 MHz, COUT = 2.2 µF | 8 |
| Output Noise Voltage | VN | | 90 | | µVRMS | IOUT = 10 mA, BW = 10Hz to 100 kHz | 8 |
| Start-up Time from EN | TSTR | | 680 | | µs | Assertion to 0.98 × VOUT (NOM), IOUT= 200 mA, COUT = 2.2 μF | 8 |
| UVLO VIN Rising | | | 1.8 | | V | VIN Rising | 7 |
| UVLO Hysteresis | | | 200 | | mV | Hysteresis | 7 |
| Thermal Shutdown Temperature | TSD | | 165 | | ºC | | 8 |
| Thermal Shutdown Hysteresis | | | 15 | | ºC | | 8 |
| VIN, VEN Input Voltage | VIN, VEN | -0.3 | | 6.5 | V | Voltages with respect to GND | 6 |
| VOUT Output Voltage | VOUT | -0.3 | | 6.5 | V | Voltages with respect to GND | 6 |
| TJ Junction Temperature Range | TJ | -40 | | 150 | °C | | 6 |
| TSTG Storage Temperature Range | TSTG | -65 | | 150 | °C | | 6 |
| TL Lead Temperature (Soldering 10 sec) | TL | | | 260 | °C | Soldering 10 sec | 6 |
| ESD Human Body Model | HBM | -4 | | 4 | kV | ANSI/ESDA/JEDEC JS-001 | 6 |
| ESD Charged Device Model | CDM | -1 | | 1 | kV | ANSI/ESDA/JEDEC JS-002 | 6 |
| VIN Input Voltage | VIN | 2.4 | | 6 | V | | 6 |
| VEN Enable Voltage | VEN | 0 | | | V | Maximum printed as VIN | 6 |
| VOUT Output Voltage | VOUT | 0 | | 5 | V | | 6 |
| IOUT Output Current | IOUT | 0 | | 200 | mA | | 6 |
| TJ Operating Junction Temperature Range | TJ | -40 | | 125 | °C | | 6 |
| Junction-to-ambient thermal resistance | θJA | | 280 | | °C/W | SOT23-5 package | 6 |
| Junction-to-case thermal resistance | θJC | | 62 | | °C/W | SOT23-5 package | 6 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | bypass capacitor connection, the IN pin, and the GND pin of the system must be as small as possible. • It is recommended to use wide and thick copper to minimize I×R drop and heat dissipation. | 15 |
## CAD (KiCad official)
- Symbol: `TPL710F33-5TR`
- Footprint: `Package_TO_SOT_SMD:SOT-23-5`
- 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files: `tpl710f33-5tr-etched.step` / `tpl710f33-5tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpl710f33-5tr.step` / `tpl710f33-5tr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [3PEAK datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756592407356432384) (22 pp, sha256 `beafa4546969f4ab`, retrieved 2026-11-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpl710f33-5tr-datasheet.pdf)