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Ray Publish 0.1.0 5589be5 16d ago

TPH5900CNH

TOSHIBA · MOSFETs · SOP-8

TPH5900CNH from TOSHIBA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Source passive Source terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
2 Source passive Source terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
3 Source passive Source terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
4 Gate input Gate terminal of the MOSFET; the datasheet gives the gate-source voltage rating VGSS as ±20 V.
5 Drain passive Drain terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
6 Drain passive Drain terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
7 Drain passive Drain terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.
8 Drain passive Drain terminal of the N-channel MOSFET; the datasheet gives the drain-source voltage rating VDSS as 150 V for the device.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDSS 150 V 1
Gate-source voltage VGSS -20 20 V 1
Drain current (DC), silicon limit ID 18 A Silicon limit (Note 1, 2) 1
Drain current (DC), continuous ID 9 A Continuous (Note 1) 1
Drain current (pulsed) IDP 35 A t = 1 ms 1
Power dissipation PD 42 W Tc = 25 1
Power dissipation (glass-epoxy board a) PD 2.8 W t = 10 s (Note 3, Fig. 5.1) 1
Power dissipation (glass-epoxy board b) PD 1.6 W t = 10 s (Note 4, Fig. 5.2) 1
Single-pulse avalanche energy EAS 36 mJ Note 5: VDD = 60 V, Tch = 25, L = 630 µH, IAR = 9.0 A 1
Avalanche current IAR 9 A Note 5 1
Channel temperature Tch 150 °C 1
Storage temperature Tstg -55 150 °C 1
Channel-to-case thermal resistance Rth(ch-c) 2.97 °C/W Tc = 25 2
Channel-to-ambient thermal resistance (board a) Rth(ch-a) 44.6 °C/W t = 10 s (Note 3) 2
Channel-to-ambient thermal resistance (board b) Rth(ch-a) 78.1 °C/W t = 10 s (Note 4) 2
Gate leakage current IGSS -0.1 0.1 µA VGS = ±20 V, VDS = 0 V 3
Drain cut-off current IDSS 10 µA VDS = 150 V, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSS 150 V ID = 10 mA, VGS = 0 V 3
Drain-source breakdown voltage (VGS = -20 V) V(BR)DSX 105 V ID = 10 mA, VGS = -20 V 3
Gate threshold voltage Vth 2 4 V VDS = 10 V, ID = 0.2 mA 3
Drain-source on-resistance RDS(ON) 50 59 mΩ VGS = 10 V, ID = 4.5 A 3
Input capacitance Ciss 460 600 pF VDS = 75 V, VGS = 0 V, f = 1 MHz 3
Reverse transfer capacitance Crss 3 50 pF 3
Gate resistance rg 4 6 Ω 3
Reverse drain current (pulsed) IDRP 35 A 3
Diode forward voltage VDSF -1.2 V IDR = 9.0 A, VGS = 0 V 3

CAD (KiCad official)

  • Symbol: TPH5900CNH
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: tph5900cnh-etched.step / tph5900cnh-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tph5900cnh.step / tph5900cnh.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (9 pp, sha256 5947d79faab7a8b4, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF