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Contents

README

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TPH1R204PL1

TOSHIBA · MOSFETs · SOP-8

TPH1R204PL1 from TOSHIBA, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Source passive MOSFET source terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
2 Source passive MOSFET source terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
3 Source passive MOSFET source terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
4 Gate input MOSFET gate terminal; the gate-source voltage absolute maximum rating (VGSS) is ±20 V.
5 Drain passive MOSFET drain terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
6 Drain passive MOSFET drain terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
7 Drain passive MOSFET drain terminal; the drain-source voltage rating (VDSS) of the device is 40 V.
8 Drain passive MOSFET drain terminal; the drain-source voltage rating (VDSS) of the device is 40 V.

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package SOP-8
Category Triode/MOS Tube/Transistor
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDSS 40 V 2
Gate-source voltage VGSS -20 20 V 2
Drain current (DC) ID 150 A Tc = 25°C 2
Drain current (DC) silicon limit ID 270 A Silicon limit 2
Drain current (pulsed) IDP 500 A t = 100 µs 2
Power dissipation PD 3 W (Note 1), (Note 2) 2
Power dissipation PD 0.96 W (Note 1) 2
Single-pulse avalanche energy EAS 125 mJ Note 5: VDD = 32 V, Tch = 25°C (initial), L = 0.0067 mH, IAS = 120 A 2
Single-pulse avalanche current IAS 120 A Note 5: VDD = 32 V, Tch = 25°C (initial), L = 0.0067 mH, IAS = 120 A 2
Channel temperature Tch 175 °C 2
Storage temperature Tstg -55 175 °C 2
Channel-to-case thermal resistance Rth(ch-c) 0.88 /W Tc = 25°C 2
Channel-to-ambient thermal resistance Rth(ch-a) 50 /W Ta = 25°C, Note 3: glass-epoxy board (a) 2
Channel-to-ambient thermal resistance Rth(ch-a) 156 /W Ta = 25°C, Note 4: glass-epoxy board (b) 2
Gate leakage current IGSS -0.1 0.1 µA VGS = ±20 V, VDS = 0 V 3
Drain cut-off current IDSS 10 µA VDS = 40 V, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSS 40 V ID = 10 mA, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSX 25 V ID = 10 mA, VGS = -20 V 3
Gate threshold voltage Vth 1.4 2.4 V VDS = 10 V, ID = 0.5 mA 3
Drain-source on-resistance RDS(ON) 1.5 2.1 mΩ VGS = 4.5 V, ID = 50 A 3
Drain-source on-resistance RDS(ON) 1 1.24 mΩ VGS = 10 V, ID = 50 A 3
Input capacitance Ciss 5500 7200 pF VDS = 20 V, VGS = 0 V, f = 1 MHz 3
Gate resistance rg 0.6 1.1 Ω 3
Reverse drain current (pulsed) IDRP 500 A t = 100 µs 4
Reverse transfer capacitance Crss 93 pF VDS = 20 V, VGS = 0 V, f = 1 MHz 3
Output capacitance Coss 1300 pF VDS = 20 V, VGS = 0 V, f = 1 MHz 3
Switching time (rise time) tr 13 ns VDD ≈ 20 V, VGS = 0 V/10 V, ID = 50 A, RL = 0.4 Ω, RGG = 4.7 Ω, RGS = 4.7 Ω, duty ≤ 1%, tw = 10 µs 3
Switching time (turn-on time) ton 33 ns VDD ≈ 20 V, VGS = 0 V/10 V, ID = 50 A, RL = 0.4 Ω, RGG = 4.7 Ω, RGS = 4.7 Ω, duty ≤ 1%, tw = 10 µs 3
Switching time (fall time) tf 10 ns VDD ≈ 20 V, VGS = 0 V/10 V, ID = 50 A, RL = 0.4 Ω, RGG = 4.7 Ω, RGS = 4.7 Ω, duty ≤ 1%, tw = 10 µs 3
Switching time (turn-off time) toff 58 ns VDD ≈ 20 V, VGS = 0 V/10 V, ID = 50 A, RL = 0.4 Ω, RGG = 4.7 Ω, RGS = 4.7 Ω, duty ≤ 1%, tw = 10 µs 3
Total gate charge (gate-source plus gate-drain) Qg 74 nC VDD ≈ 20 V, VGS = 10 V, ID = 50 A 3
Gate-source charge 1 Qgs1 34 nC VDD ≈ 20 V, VGS = 4.5 V, ID = 50 A 3
Gate-drain charge Qgd 16 nC VDD ≈ 20 V, VGS = 10 V, ID = 50 A 3
Gate switch charge QSW 17 nC 3
Output charge Qoss 56 nC VDS = 20 V, VGS = 0 V 3
Diode forward voltage VDSF -1.2 V IDR = 150 A, VGS = 0 V 4
Reverse recovery time trr 46 ns VR = 20 V, IDR = 37.5 A, VGS = 0 V, -dIDR/dt = 100 A/µs 4
Reverse recovery charge Qrr 46 nC VR = 20 V, IDR = 37.5 A, VGS = 0 V, -dIDR/dt = 100 A/µs 4

CAD (KiCad official)

  • Symbol: TPH1R204PL1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: tph1r204pl1-etched.step / tph1r204pl1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tph1r204pl1.step / tph1r204pl1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (9 pp, sha256 1e291f92997e37b5, retrieved 2026-11-04, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF