component
TPD3S014DBVR
Public Made by Adomby adom
Texas Instruments Battery Management, SOT-23-6. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPD3S014DBVR
Texas Instruments · Battery Management · SOT-23-6
TPD3S014DBVR from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | EN | input | Enable input, active-high. Logic high (VIH >= 2 V) turns on the power switch; logic low (VIL <= 0.7 V) disables the switch. Rising threshold ~1.45 V typ with 0.13 V hysteresis. Absolute max -0.3 to 6 V. |
| 2 | GND | power_in | Device ground reference. |
| 3 | IN | power_in | Input voltage and power-switch drain (4.5 V to 5.5 V nominal, abs max 6 V). Connect a 0.1 µF or greater ceramic decoupling capacitor from IN to GND close to the IC. |
| 4 | OUT | power_out | Power-switch output; connect to load (USB VBUS). Current-limited to 0.85 A typ (TPD3S014). RDS(on) ~97 mΩ typ. Includes output discharge (RPD ~456 Ω) when disabled. |
| 5 | D1 | passive | USB data+ or USB data- ESD-protected line. TVS clamp to GND rated for ±12 kV contact / ±15 kV air-gap IEC 61000-4-2 discharge. Low differential capacitance (~0.02 pF) and 1.4 pF to GND to preserve USB signal integrity. |
| 6 | D2 | passive | USB data+ or USB data- ESD-protected line. TVS clamp to GND rated for ±12 kV contact / ±15 kV air-gap IEC 61000-4-2 discharge. Low differential capacitance (~0.02 pF) and 1.4 pF to GND to preserve USB signal integrity. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-6 |
| Category | PMIC |
| Pins | 6 |
Ordering variants
Same part, different packaging or reel option.
TPD3S014DBVRTPD3S014DBVRDBVT
CAD (KiCad official)
- Symbol:
TPD3S014DBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
tpd3s014dbvr-etched.step/tpd3s014dbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpd3s014dbvr.step/tpd3s014dbvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
f089f3aa2c4449f9, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).