# TPD2EUSB30DRTR-ES

**ElecSuper** · ESD Protection Devices · SOT-723

TPD2EUSB30DRTR-ES from ElecSuper, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | passive | Connect to IO line; protected unidirectional TVS channel with 5.0 V reverse stand-off voltage and 0.5 pF typical IO-GND junction capacitance. |
| 2 | IO | passive | Connect to IO line; protected unidirectional TVS channel with 5.0 V reverse stand-off voltage and 0.5 pF typical IO-GND junction capacitance. |
| 3 | GND | power_in | Connect to GND, the common ground reference for both TVS channels. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ElecSuper |
| Package | SOT-723 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-off Voltage | VRWM |  |  | 5 | V |  | 3 |
| Reverse Breakdown Voltage | VBR | 6 |  |  | V | IT=1mA | 3 |
| Reverse Leakage Current | IR |  |  | 1 | uA | VRWM=5V | 3 |
| Clamping Voltage | VC |  | 8.5 | 10 | V | IPP=1A; tp=8/20us | 3 |
| Clamping Voltage | VC |  | 10 | 12 | V | IPP=3A; tp=8/20us | 3 |
| Junction Capacitance IO-GND | CJ |  | 0.5 | 0.8 | pF | VR=0V; f=1MHz | 3 |
| Junction Capacitance IO-IO | CJ |  | 0.25 | 0.4 | pF | VR=0V; f=1MHz | 3 |
| Peak pulse power | Ppk |  |  | 30 | W | tp=8/20us @25℃ | 2 |
| Peak pulse current | IPP |  |  | 3 | A | tp=8/20us @25℃ | 2 |
| ESD (IEC61000-4-2 air discharge) | VESD | -15 |  | 15 | kV | @25℃ | 2 |
| ESD (IEC61000-4-2 contact discharge) | VESD | -15 |  | 15 | kV | @25℃ | 2 |
| Junction temperature | TJ |  |  | 150 | ℃ |  | 2 |
| Operating temperature | TOP | -40 |  | 125 | ℃ |  | 2 |
| Storage temperature | TSTG | -55 |  | 150 | ℃ |  | 2 |
| Lead temperature | TL |  |  | 260 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `TPD2EUSB30DRTR-ES`
- Footprint: `Package_TO_SOT_SMD:SOT-723`
- 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tpd2eusb30drtr-es-etched.step` / `tpd2eusb30drtr-es-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpd2eusb30drtr-es.step` / `tpd2eusb30drtr-es.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ElecSuper datasheet](docs/tpd2eusb30drtr-es-datasheet.pdf) (7 pp, sha256 `7499726a7a1f9903`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tpd2eusb30drtr-es-datasheet.pdf)