component
TPD2EUSB30ADRTR-N
Public Made by Adomby adom
BORN ESD And Surge Protection (TVS/ESD), SOT-723. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
TPD2EUSB30ADRTR-N
BORN · ESD And Surge Protection (TVS/ESD) · SOT-723
TPD2EUSB30ADRTR-N from BORN, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | bidirectional | Protected I/O line with working peak reverse voltage VRWM of 5 V and junction capacitance to GND of 0.45 pF typical (0.6 pF max) per the datasheet electrical table. |
| 2 | I/O | bidirectional | Protected I/O line with working peak reverse voltage VRWM of 5 V; junction capacitance between I/O pins is 0.25 pF typical (0.35 pF max) per the datasheet electrical table. |
| 3 | GND | power_in | Ground reference pin to which the I/O junction capacitance is specified; the datasheet gives no further limits for this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOT-723 |
| Category | Circuit Protection |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 6 | V | IT = 1mA | 2 | ||
| Junction Capacitance between I/O pin and GND | CJ | 0.45 | 0.6 | pF | VDC = 0V, f = 1MHz | 2 | |
| Junction Capacitance between I/O pins | CO | 0.25 | 0.35 | pF | VDC = 0V, f = 1MHz | 2 | |
| Reverse Leakage Current | IR | 0.001 | 0.1 | uA | VRWM = 5V | 2 | |
| Clamping Voltage | VC | 12 | 14 | V | IPP = 4A, 8/20µs | 2 | |
| Operating Temperature Range | TJ | -55 | 125 | ℃ | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 2 | ||
| ESD per IEC 61000-4-2 (Contact) | VESD-Contact | 20 | KV | IEC 61000-4-2 contact discharge | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD-Air | 25 | KV | IEC 61000-4-2 air discharge | 2 | ||
| Lead Soldering Temperature | TL | 260 | ℃ | 10s | 2 | ||
| Reverse Working Voltage | VRWM | 5 | V | 2 | |||
| Peak Pulse Power (8/20µs) | PPP | 56 | W | 8/20µs | 2 | ||
| Peak Pulse Current (8/20µs) | IPP | 4 | A | 8/20µs | 2 |
CAD (KiCad official)
- Symbol:
TPD2EUSB30ADRTR-N - Footprint:
Package_TO_SOT_SMD:SOT-723 - 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tpd2eusb30adrtr-n-etched.step/tpd2eusb30adrtr-n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpd2eusb30adrtr-n.step/tpd2eusb30adrtr-n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BORN datasheet (4 pp, sha256
c02cafe8f621ea9f, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPD2EUSB30ADRTR-N
**BORN** · ESD And Surge Protection (TVS/ESD) · SOT-723
TPD2EUSB30ADRTR-N from BORN, in a SOT-723. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | bidirectional | Protected I/O line with working peak reverse voltage VRWM of 5 V and junction capacitance to GND of 0.45 pF typical (0.6 pF max) per the datasheet electrical table. |
| 2 | I/O | bidirectional | Protected I/O line with working peak reverse voltage VRWM of 5 V; junction capacitance between I/O pins is 0.25 pF typical (0.35 pF max) per the datasheet electrical table. |
| 3 | GND | power_in | Ground reference pin to which the I/O junction capacitance is specified; the datasheet gives no further limits for this pin. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOT-723 |
| Category | Circuit Protection |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 6 | | | V | IT = 1mA | 2 |
| Junction Capacitance between I/O pin and GND | CJ | | 0.45 | 0.6 | pF | VDC = 0V, f = 1MHz | 2 |
| Junction Capacitance between I/O pins | CO | | 0.25 | 0.35 | pF | VDC = 0V, f = 1MHz | 2 |
| Reverse Leakage Current | IR | | 0.001 | 0.1 | uA | VRWM = 5V | 2 |
| Clamping Voltage | VC | | 12 | 14 | V | IPP = 4A, 8/20µs | 2 |
| Operating Temperature Range | TJ | -55 | | 125 | ℃ | | 2 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD-Contact | | | 20 | KV | IEC 61000-4-2 contact discharge | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD-Air | | | 25 | KV | IEC 61000-4-2 air discharge | 2 |
| Lead Soldering Temperature | TL | | | 260 | ℃ | 10s | 2 |
| Reverse Working Voltage | VRWM | | | 5 | V | | 2 |
| Peak Pulse Power (8/20µs) | PPP | | | 56 | W | 8/20µs | 2 |
| Peak Pulse Current (8/20µs) | IPP | | | 4 | A | 8/20µs | 2 |
## CAD (KiCad official)
- Symbol: `TPD2EUSB30ADRTR-N`
- Footprint: `Package_TO_SOT_SMD:SOT-723`
- 3D model: SOT-723, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.5 mm nominal SOT-723 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tpd2eusb30adrtr-n-etched.step` / `tpd2eusb30adrtr-n-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpd2eusb30adrtr-n.step` / `tpd2eusb30adrtr-n.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [BORN datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590226329388937216) (4 pp, sha256 `c02cafe8f621ea9f`, retrieved 2026-10-20, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpd2eusb30adrtr-n-datasheet.pdf)