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Ray Publish 0.1.0 5832df3 6d ago

TPA721DGNR

Texas Instruments · Audio Power OpAmps · HVSSOP-8-EP

TPA721DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input SHUTDOWN places the entire device in shutdown mode when held high, with VIH of 0.9 VDD minimum and VIL of 0.1 VDD maximum.
2 BYPASS input BYPASS is the tap to the voltage divider for internal mid-supply bias and should be connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier.
3 IN+ input IN+ is the noninverting input and is typically tied to the BYPASS terminal.
4 IN- input IN- is the inverting input and is typically used as the audio input terminal.
5 VO+ output VO+ is the positive BTL (bridge-tied load) output.
6 VDD power_in VDD is the supply voltage terminal, specified from 2.5 V to 5.5 V.
7 GND power_in GND is the ground connection.
8 VO- output VO- is the negative BTL (bridge-tied load) output.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8-EP
Category Operational Amplifier/Comparator
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 2.5 5.5 V 3
High-level voltage (SHUTDOWN) VIH 0.9 V printed as 0.9 VDD 3
Low-level voltage (SHUTDOWN) VIL 0.1 V printed as 0.1 VDD 3
Operating free-air temperature TA -40 85 °C 3
Supply voltage VDD 6 V 2
Input voltage VI -0.3 V printed as -0.3 V to VDD +0.3 V; upper limit not numeric 2
Operating free-air temperature range TA -40 85 °C 2
Operating junction temperature range TJ -40 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 2
Supply current IDD 1.25 2.5 mA VDD = 3.3 V, TA = 25°C; SHUTDOWN = 0 V, RF = 10 kΩ 3
Supply current, shutdown mode IDD(SD) 7 50 µA VDD = 3.3 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ 3
Supply current, shutdown mode IDD(SD) 50 100 µA VDD = 5 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ 3
Power dissipation rating, DGN package 2.14 W TA ≤ 25°C; DGN package; derating 17.1 mW/°C; footnote (1) PowerPAD board per SLMA002 3

CAD (KiCad official)

  • Symbol: TPA721DGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tpa721dgnr-etched.step / tpa721dgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa721dgnr.step / tpa721dgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (31 pp, sha256 0ae398855cbb6039, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF