component
TPA721DGNR
Public Made by Adomby adom
Texas Instruments Audio Power OpAmps, HVSSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPA721DGNR
Texas Instruments · Audio Power OpAmps · HVSSOP-8-EP
TPA721DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | SHUTDOWN places the entire device in shutdown mode when held high, with VIH of 0.9 VDD minimum and VIL of 0.1 VDD maximum. |
| 2 | BYPASS | input | BYPASS is the tap to the voltage divider for internal mid-supply bias and should be connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier. |
| 3 | IN+ | input | IN+ is the noninverting input and is typically tied to the BYPASS terminal. |
| 4 | IN- | input | IN- is the inverting input and is typically used as the audio input terminal. |
| 5 | VO+ | output | VO+ is the positive BTL (bridge-tied load) output. |
| 6 | VDD | power_in | VDD is the supply voltage terminal, specified from 2.5 V to 5.5 V. |
| 7 | GND | power_in | GND is the ground connection. |
| 8 | VO- | output | VO- is the negative BTL (bridge-tied load) output. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Operational Amplifier/Comparator |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 2.5 | 5.5 | V | 3 | ||
| High-level voltage (SHUTDOWN) | VIH | 0.9 | V | printed as 0.9 VDD | 3 | ||
| Low-level voltage (SHUTDOWN) | VIL | 0.1 | V | printed as 0.1 VDD | 3 | ||
| Operating free-air temperature | TA | -40 | 85 | °C | 3 | ||
| Supply voltage | VDD | 6 | V | 2 | |||
| Input voltage | VI | -0.3 | V | printed as -0.3 V to VDD +0.3 V; upper limit not numeric | 2 | ||
| Operating free-air temperature range | TA | -40 | 85 | °C | 2 | ||
| Operating junction temperature range | TJ | -40 | 150 | °C | 2 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 2 | ||
| Lead temperature | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 2 | |||
| Supply current | IDD | 1.25 | 2.5 | mA | VDD = 3.3 V, TA = 25°C; SHUTDOWN = 0 V, RF = 10 kΩ | 3 | |
| Supply current, shutdown mode | IDD(SD) | 7 | 50 | µA | VDD = 3.3 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ | 3 | |
| Supply current, shutdown mode | IDD(SD) | 50 | 100 | µA | VDD = 5 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ | 3 | |
| Power dissipation rating, DGN package | 2.14 | W | TA ≤ 25°C; DGN package; derating 17.1 mW/°C; footnote (1) PowerPAD board per SLMA002 | 3 |
CAD (KiCad official)
- Symbol:
TPA721DGNR - Footprint:
Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm - 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tpa721dgnr-etched.step/tpa721dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa721dgnr.step/tpa721dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (31 pp, sha256
0ae398855cbb6039, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPA721DGNR
**Texas Instruments** · Audio Power OpAmps · HVSSOP-8-EP
TPA721DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | SHUTDOWN places the entire device in shutdown mode when held high, with VIH of 0.9 VDD minimum and VIL of 0.1 VDD maximum. |
| 2 | BYPASS | input | BYPASS is the tap to the voltage divider for internal mid-supply bias and should be connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier. |
| 3 | IN+ | input | IN+ is the noninverting input and is typically tied to the BYPASS terminal. |
| 4 | IN- | input | IN- is the inverting input and is typically used as the audio input terminal. |
| 5 | VO+ | output | VO+ is the positive BTL (bridge-tied load) output. |
| 6 | VDD | power_in | VDD is the supply voltage terminal, specified from 2.5 V to 5.5 V. |
| 7 | GND | power_in | GND is the ground connection. |
| 8 | VO- | output | VO- is the negative BTL (bridge-tied load) output. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Operational Amplifier/Comparator |
| Pins | 9 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD | 2.5 | | 5.5 | V | | 3 |
| High-level voltage (SHUTDOWN) | VIH | 0.9 | | | V | printed as 0.9 VDD | 3 |
| Low-level voltage (SHUTDOWN) | VIL | | | 0.1 | V | printed as 0.1 VDD | 3 |
| Operating free-air temperature | TA | -40 | | 85 | °C | | 3 |
| Supply voltage | VDD | | | 6 | V | | 2 |
| Input voltage | VI | -0.3 | | | V | printed as -0.3 V to VDD +0.3 V; upper limit not numeric | 2 |
| Operating free-air temperature range | TA | -40 | | 85 | °C | | 2 |
| Operating junction temperature range | TJ | -40 | | 150 | °C | | 2 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 2 |
| Lead temperature | | | | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 2 |
| Supply current | IDD | | 1.25 | 2.5 | mA | VDD = 3.3 V, TA = 25°C; SHUTDOWN = 0 V, RF = 10 kΩ | 3 |
| Supply current, shutdown mode | IDD(SD) | | 7 | 50 | µA | VDD = 3.3 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ | 3 |
| Supply current, shutdown mode | IDD(SD) | | 50 | 100 | µA | VDD = 5 V, TA = 25°C; SHUTDOWN = VDD, RF = 10 kΩ | 3 |
| Power dissipation rating, DGN package | | | | 2.14 | W | TA ≤ 25°C; DGN package; derating 17.1 mW/°C; footnote (1) PowerPAD board per SLMA002 | 3 |
## CAD (KiCad official)
- Symbol: `TPA721DGNR`
- Footprint: `Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm`
- 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tpa721dgnr-etched.step` / `tpa721dgnr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpa721dgnr.step` / `tpa721dgnr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tpa721) (31 pp, sha256 `0ae398855cbb6039`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpa721dgnr-datasheet.pdf)