component
TPA6135A2RTER
Public Made by Adomby adom
Texas Instruments Audio Amplifiers, WQFN-16-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPA6135A2RTER
Texas Instruments · Audio Amplifiers · WQFN-16-EP(3x3)
TPA6135A2RTER from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | INL- | input | Inverting left input for differential signals; serves as the left input for single-ended signals. |
| 2 | INL+ | input | Non-inverting left input for differential signals; connect to ground for single-ended input applications. |
| 3 | INR+ | input | Non-inverting right input for differential signals; connect to ground for single-ended input applications. |
| 4 | INR- | input | Inverting right input for differential signals; serves as the right input for single-ended signals. |
| 5 | OUTR | output | Right headphone amplifier output; connect to the right terminal of the headphone jack. |
| 6 | HI-Z | input | Output impedance select; set to logic LOW for normal operation and to logic HIGH for high output impedance. |
| 7 | GAIN | input | Gain select; set to logic LOW for a gain of 0 dB and to logic HIGH for a gain of 6 dB. |
| 8 | HPVSS | power_out | Charge pump output and negative power supply for the output amplifiers; connect a 1 µF capacitor to GND. |
| 9 | CPN | passive | Charge pump negative flying capacitor node; connect to the negative side of the 1 µF capacitor between CPP and CPN. |
| 10 | PGND | power_in | Power ground; connect supply decoupling capacitors for VDD, HPVDD and HPVSS to PGND. |
| 11 | CPP | passive | Charge pump positive flying capacitor node; connect to the positive side of the 1 µF capacitor between CPP and CPN. |
| 12 | HPVDD | power_in | Positive power supply for the headphone amplifiers; connect a 2.2 µF capacitor to it and do not connect it to VDD or an external supply. |
| 13 | EN | input | Amplifier enable; connect to logic LOW to shut down the device and to logic HIGH to activate it. |
| 14 | VDD | power_in | Positive power supply for the TPA6135A2. |
| 15 | SGND | power_in | Amplifier reference voltage; connect to the ground terminal of the headphone jack, and do not connect more than ±0.3 V to it. |
| 16 | OUTL | output | Left headphone amplifier output; connect to the left terminal of the headphone jack. |
| 17 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WQFN-16-EP(3x3) |
| Category | Amplifiers/Comparators |
| Pins | 17 |
CAD (KiCad official)
- Symbol:
TPA6135A2RTER - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
tpa6135a2rter-etched.step/tpa6135a2rter-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa6135a2rter.step/tpa6135a2rter.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (28 pp, sha256
c95820fc5af82861, retrieved 2026-10-08, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).