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Contents

README

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TPA6133A2RTJR

Texas Instruments · Audio Amplifiers · QFN-20-EP(4x4)

TPA6133A2RTJR from Texas Instruments, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LEFTINM input Left channel negative differential input; impedance must be matched to LEFTINP.
2 LEFTINP input Left channel positive differential input; impedance must be matched to LEFTINM.
3 GND power_in Analog ground; must be connected to common supply GND.
4 RIGHTINP input Right channel positive differential input; impedance must be matched to RIGHTINM.
5 RIGHTINM input Right channel negative differential input; impedance must be matched to RIGHTINP.
6 SD input Shutdown control; active low logic, 5V tolerant input.
7 TEST2 input Factory test pin; pull up to VDD supply.
8 TEST1 input Factory test pin; pull up to VDD supply.
9 GND power_in Analog ground; must be connected to common supply GND.
10 GND power_in Analog ground; must be connected to common supply GND.
11 HPRIGHT output Right channel headphone amplifier output; connect to right terminal of headphone jack.
12 VDD power_in Analog power supply; must be decoupled with 1-μF capacitor to pin 13.
13 GND power_in Analog ground; recommended for decoupling pin 12 VDD.
14 HPLEFT output Left channel headphone amplifier output; connect to left terminal of headphone jack.
15 CPVSS power_out Negative supply generated by charge pump; decouple to pin 19 or GND plane with 1-μF capacitor.
16 CPVSS power_out Negative supply generated by charge pump; decouple to pin 19 or GND plane with 1-μF capacitor.
17 CPN passive Charge pump flying capacitor negative terminal; connect one side of flying capacitor.
18 CPP passive Charge pump flying capacitor positive terminal; connect one side of flying capacitor.
19 GND power_in Charge pump ground; must be connected to common supply GND and decoupled to pin 20.
20 VDD power_in Charge pump voltage supply; must be decoupled with 1-μF capacitor to pin 19.
21 Thermal pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package QFN-20-EP(4x4)
Category Amplifiers/Comparators
Pins 21

CAD (KiCad official)

  • Symbol: TPA6133A2RTJR
  • Footprint: Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
  • 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: tpa6133a2rtjr-etched.step / tpa6133a2rtjr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa6133a2rtjr.step / tpa6133a2rtjr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (28 pp, sha256 747d0105fa5e6e34, retrieved 2026-10-01, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF