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TPA6111A2DGNR

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Texas Instruments Audio Power OpAmps, HVSSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentoperational amplifier-comparatortpa6111a2dgnrfactory-2.0.0extractor-text

Verified TPA6111A2DGNR

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 9 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: TPA6111A2DGNR · HVSSOP-8-EP · 9 pins
  • ✓copper: 9 copper pads, none touching another net
  • ✓datasheet: all 9 pin names found in the 35-page datasheet
  • ✓distributor: lcsc C544894, digikey 296-46366-2-ND, mouser 595-TPA6111A2DGNR
  • ✓family: HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-zpz0t5b5/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • ✓package_fit: height and body within the datasheet's package drawing (datasheet p.26)
  • ✓pads: 9 pins = 9 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 9 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ tpa6111a2dgnr.kicad_sym✓ tpa6111a2dgnr.kicad_mod✓ tpa6111a2dgnr.step
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Ray Publish 0.1.0 77cedc2 7d ago

TPA6111A2DGNR

Texas Instruments · Audio Power OpAmps · HVSSOP-8-EP

TPA6111A2DGNR from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VO1 output VO1 is the audio output for channel 1.
2 IN1- input IN1- is the inverting input for channel 1.
3 BYPASS passive BYPASS is the tap to the voltage divider for the internal mid-supply bias and should connect to a 0.1-µF to 1-µF low ESR capacitor for best performance.
4 GND power_in GND is the ground connection.
5 SHUTDOWN input SHUTDOWN puts the device in a low quiescent current mode when held high.
6 IN2- input IN2- is the inverting input for channel 2.
7 VO2 output VO2 is the audio output for channel 2.
8 VDD power_in VDD is the supply voltage terminal.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8-EP
Category Operational Amplifier/Comparator
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 6 V over operating free-air temperature range 3
Operating junction temperature TJ -40 150 °C 3
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 3
Storage temperature Tstg -65 150 °C 3
Electrostatic discharge, human-body model (HBM) V(ESD) -2000 2000 V Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 4
Electrostatic discharge, charged-device model (CDM) V(ESD) -1500 1500 V Charged-device model (CDM), per JEDEC specification JESD22-C101 4
Supply voltage VDD 2.5 5.5 V 4
Operating free-air temperature TA -40 85 °C 4
Output offset voltage VOO 10 mV 4
Power supply rejection ratio PSRR 70 dB VDD = 3.2 V to 3.4 V 4
Supply current IDD 1.5 3 mA SHUTDOWN (pin 5) = 0 V 4
Supply current in shutdown mode IDD(SD) 1 10 µA SHUTDOWN (pin 5) = VDD 4
Input impedance Zi 1 MΩ 4
Output power (each channel) PO 60 mW THD ≤ 0.1%, f = 1 kHz, VDD = 3.3 V, RL = 16 Ω 4
Total harmonic distortion + noise THD+N 0.4 % PO = 40 mW, 20 Hz, 20 kHz, VDD = 3.3 V, RL = 16 Ω 4
Maximum output power bandwidth BOM 20 kHz BW G = 20 dB, THD < 5% 4
Supply ripple rejection 71 dB f = 1 kHz, C(BYP) = 0.47 µF, VDD = 3.3 V 4
Channel/channel output separation 89 dB f = 1 kHz, PO = 40 mW, VDD = 3.3 V 4
Signal-to-noise ratio SNR 100 dB PO = 50 mW, AV = 1, VDD = 3.3 V 4
Output offset voltage VOO 10 mV 5
Power supply rejection ratio PSRR 70 dB VDD = 4.9 V to 5.1 V 5
Supply current IDD 1.6 3.2 mA SHUTDOWN (pin 5) = 0 V 5
Supply current in shutdown mode IDD(SD) 1 10 µA SHUTDOWN (pin 5) = VDD 5
High-level input current (SHUTDOWN) /IIH/ 1 µA VDD = 5.5 V, VI = VDD 5
Low-level input current (SHUTDOWN) /IIL/ 1 µA VDD = 5.5 V, VI = 0 V 5
Input impedance Zi 1 MΩ 5
Output power (each channel) PO 150 mW THD ≤ 0.1%, f = 1 kHz, VDD = 5 V, RL = 6 Ω 5
Total harmonic distortion + noise THD+N 0.6 % PO = 100 mW, 20 Hz, 20 kHz, VDD = 5 V, RL = 6 Ω 5
Maximum output power bandwidth BOM 20 kHz BW G = 20 dB, THD < 5%, VDD = 5 V, RL = 6 Ω 5
Supply ripple rejection ratio 61 dB f = 1 kHz, C(BYP) = 0.47 µF, VDD = 5 V, RL = 6 Ω 5
Channel/channel output separation 90 dB f = 1 kHz, PO = 100 mW, VDD = 5 V, RL = 6 Ω 5
Signal-to-noise ratio SNR 100 dB PO = 100 mW, AV = 1, VDD = 5 V, RL = 6 Ω 5
Output power (each channel) PO 35 mW THD ≤ 0.1%, f = 1 kHz, VDD = 3.3 V, RL = 32 Ω 5
Total harmonic distortion + noise THD+N 0.4 % PO = 40 mW, 20 Hz, 20 kHz, VDD = 3.3 V, RL = 32 Ω 5
Supply ripple rejection 71 dB f = 1 kHz, C(BYP) = 0.47 µF, VDD = 3.3 V, RL = 32 Ω 5
Channel/channel output separation 75 dB f = 1 kHz, PO = 25 mW, VDD = 3.3 V, RL = 32 Ω 5
Output power (each channel) PO 90 mW THD ≤ 0.1%, f = 1 kHz, VDD = 5 V, RL = 32 Ω 5
Total harmonic distortion + noise THD+N 2 % PO = 20 mW, 20 Hz, 20 kHz, VDD = 5 V, RL = 32 Ω 5
Supply ripple rejection 61 dB f = 1 kHz, C(BYP) = 0.47 µF, VDD = 5 V, RL = 32 Ω 5
Channel/channel output separation 98 dB f = 1 kHz, PO = 65 mW, VDD = 5 V, RL = 32 Ω 5
Signal-to-noise ratio SNR 104 dB PO = 90 mW, AV = 1, VDD = 5 V, RL = 32 Ω 5
Junction-to-ambient thermal resistance RθJA 55.9 °C/W DGN (MSOP) 8 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 47.3 °C/W DGN (MSOP) 8 pins 4
Junction-to-board thermal resistance RθJB 36.4 °C/W DGN (MSOP) 8 pins 4
Junction-to-case (bottom) thermal resistance RθJC(bot) 9.2 °C/W DGN (MSOP) 8 pins 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PA6 PART NUMBER PACKAGE BODY SIZE (NOM) TPA6111A2 1

CAD (KiCad official)

  • Symbol: TPA6111A2DGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tpa6111a2dgnr-etched.step / tpa6111a2dgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa6111a2dgnr.step / tpa6111a2dgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (35 pp, sha256 4ee6bd1bccad6f94, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF