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TPA3112D1QPWPRQ1

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Texas Instruments Audio Power OpAmps, HTSSOP-28-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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TPA3112D1QPWPRQ1

Texas Instruments · Audio Power OpAmps · HTSSOP-28-EP

TPA3112D1QPWPRQ1 from Texas Instruments, in a HTSSOP-28-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SD input Shutdown logic input for the audio amp: LOW sets outputs Hi-Z and HIGH enables outputs, with TTL levels referenced to AVCC.
2 FAULT output Open-drain output that reports short-circuit or DC-detect fault status, voltage compliant to AVCC; tie to SD for short-circuit auto-recovery.
3 GND power_in Connect to local ground.
4 GND power_in Connect to local ground.
5 GAIN0 input Gain select least significant bit, TTL logic levels with compliance to AVCC.
6 GAIN1 input Gain select most significant bit, TTL logic levels with compliance to AVCC.
7 AVCC power_in Analog supply.
8 AGND power_in Analog supply ground; connect to the thermal pad.
9 GVDD power_out High-side FET gate drive supply, nominal 7 V; may also supply the PLIMIT divider; add a 1-µF cap to ground.
10 PLIMIT input Power limit level adjust; connect directly to GVDD for no power limiting; add a 1-µF cap to ground.
11 INN input Negative audio input, biased at 3 V.
12 INP input Positive audio input, biased at 3 V.
13 NC unconnected Not connected.
14 AVCC power_in Connect AVCC supply to this pin.
15 PVCC power_in Power supply for H-bridge; PVCC pins are also connected internally.
16 PVCC power_in Power supply for H-bridge; PVCC pins are also connected internally.
17 BSP bidirectional Bootstrap I/O for the positive high-side FET.
18 OUTP output Class-D H-bridge positive output.
19 PGND power_in Power ground for the H-bridges.
20 OUTP output Class-D H-bridge positive output.
21 BSP bidirectional Bootstrap I/O for the positive high-side FET.
22 BSN bidirectional Bootstrap I/O for the negative high-side FET.
23 OUTN output Class-D H-bridge negative output.
24 PGND power_in Power ground for the H-bridges.
25 OUTN output Class-D H-bridge negative output.
26 BSN bidirectional Bootstrap I/O for the negative high-side FET.
27 PVCC power_in Power supply for H-bridge; PVCC pins are also connected internally.
28 PVCC power_in Power supply for H-bridge; PVCC pins are also connected internally.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-28-EP
Category Operational Amplifier/Comparator
Pins 29

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper noise on the power supply leads. For higher frequency transients due to parasitic circuit elements such as bond wire and copper trace inductances as well as lead frame capacitance, a good quality low 21

CAD (KiCad official)

  • Symbol: TPA3112D1QPWPRQ1
  • Footprint: Package_SO:TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.85x6.7mm
  • 3D model: HTSSOP-28-EP (KiCad packages3D, STEP)
  • 3D model files: tpa3112d1qpwprq1-etched.step / tpa3112d1qpwprq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa3112d1qpwprq1.step / tpa3112d1qpwprq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (33 pp, sha256 338d0c37e5667689, retrieved 2026-10-28, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF