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Ray Publish 0.1.0 5fc30e7 6d ago

TPA302D

Texas Instruments · Audio Power OpAmps · SOIC-8

TPA302D from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VO1 output Output of amplifier channel 1, which can swing to VDD - 1 V and drive 8-Ω or 32-Ω loads.
2 SHUTDOWN input Shutdown control that must be held low for normal operation; pulling it high mutes the outputs and drops supply current to about 0.6 µA, and it must never be left unconnected.
3 BYPASS passive Midrail (VDD/2) bypass node fed from an internal 25-kΩ source, where a 0.1-µF to 1-µF low-ESR capacitor CB sets the start-up rate and reduces midrail noise.
4 IN2 input Inverting input of amplifier channel 2, where the effective impedance at the inverting node should be kept between 5 kΩ and 20 kΩ.
5 VO2 output Output of amplifier channel 2, which can swing to VDD - 1 V and drive 8-Ω or 32-Ω loads.
6 VDD power_in Supply voltage input, specified for 2.7 V to 5.5 V with an absolute maximum of 6 V.
7 GND power_in Ground reference for the device; the datasheet states no electrical limit for this pin.
8 IN1 input Inverting input of amplifier channel 1, where the effective impedance at the inverting node should be kept between 5 kΩ and 20 kΩ.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-8
Category Operational Amplifier/Comparator
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD 6 V 2
Input voltage VI -0.3 V Printed as -0.3 V to VDD + 0.3 V 2
Operating junction temperature range TJ -40 150 °C 2
Storage temperature range Tstg -65 150 °C 2
Lead temperature 260 °C 1,6 mm (1/16 inch) from case for 10 seconds 2
Supply voltage VDD 2.7 5.5 V 2
Operating free-air temperature TA -40 85 °C 2
Power rating (D package) 731 mW TA ≤ 25°C 2
Power rating (D package) 460 mW TA = 70°C 2
Power rating (D package) 380 mW TA = 85°C 2
Supply current IDD 2.25 5 mA VDD = 3.3 V 2
Input offset voltage VIO 5 20 mV VDD = 3.3 V 2
Power supply rejection ratio PSRR 55 dB VDD = 3.2 V to 3.4 V 2
Quiescent current in shutdown IDD(SD) 0.6 20 µA VDD = 3.3 V 2
Supply current IDD 4 10 mA VDD = 5 V 3
Output offset voltage VOO 5 20 mV VDD = 5 V 3
Power supply rejection ratio PSRR 65 dB VDD = 4.9 V to 5.1 V 3
Quiescent current in shutdown IDD(SD) 0.6 µA VDD = 5 V 3
Derating factor above TA = 25°C 5.8 mW/°C D package, TA ≤ 25°C 2

CAD (KiCad official)

  • Symbol: TPA302D
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tpa302d-etched.step / tpa302d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa302d.step / tpa302d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 1de0c5e6f2ff2143, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF