component
TPA2005D1DRBR
Public Made by Adomby adom
Texas Instruments Audio Amplifiers, SON-8-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPA2005D1DRBR
Texas Instruments · Audio Amplifiers · SON-8-EP(3x3)
TPA2005D1DRBR from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Shutdown terminal, active low logic with input thresholds VIL=0 to 0.8 V and VIH=2 to VDD V. |
| 2 | NC | unconnected | No internal connection. |
| 3 | IN+ | input | Positive differential input with common mode voltage range 0.5 to VDD-0.8 V. |
| 4 | IN- | input | Negative differential input with common mode voltage range 0.5 to VDD-0.8 V. |
| 5 | VO+ | output | Positive BTL output with minimum load resistance 3.2 Ω at VDD 2.5-4.2 V or 6.4 Ω at VDD 4.2-5.5 V. |
| 6 | VDD | power_in | Power supply input, operating range 2.5 to 5.5 V, requires 0.1 µF decoupling capacitor within 2 mm. |
| 7 | GND | power_in | High-current ground with exposed thermal die pad connection to ground plane. |
| 8 | VO- | output | Negative BTL output with minimum load resistance 3.2 Ω at VDD 2.5-4.2 V or 6.4 Ω at VDD 4.2-5.5 V. |
| 9 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SON-8-EP(3x3) |
| Category | Amplifiers/Comparators |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPA2005D1DRBR - Footprint:
Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm - 3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
tpa2005d1drbr-etched.step/tpa2005d1drbr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa2005d1drbr.step/tpa2005d1drbr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (43 pp, sha256
f5d959414918bfe7, retrieved 2026-10-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPA2005D1DRBR
**Texas Instruments** · Audio Amplifiers · SON-8-EP(3x3)
TPA2005D1DRBR from Texas Instruments, in a SON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Shutdown terminal, active low logic with input thresholds VIL=0 to 0.8 V and VIH=2 to VDD V. |
| 2 | NC | unconnected | No internal connection. |
| 3 | IN+ | input | Positive differential input with common mode voltage range 0.5 to VDD-0.8 V. |
| 4 | IN- | input | Negative differential input with common mode voltage range 0.5 to VDD-0.8 V. |
| 5 | VO+ | output | Positive BTL output with minimum load resistance 3.2 Ω at VDD 2.5-4.2 V or 6.4 Ω at VDD 4.2-5.5 V. |
| 6 | VDD | power_in | Power supply input, operating range 2.5 to 5.5 V, requires 0.1 µF decoupling capacitor within 2 mm. |
| 7 | GND | power_in | High-current ground with exposed thermal die pad connection to ground plane. |
| 8 | VO- | output | Negative BTL output with minimum load resistance 3.2 Ω at VDD 2.5-4.2 V or 6.4 Ω at VDD 4.2-5.5 V. |
| 9 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SON-8-EP(3x3) |
| Category | Amplifiers/Comparators |
| Pins | 9 |
## CAD (KiCad official)
- Symbol: `TPA2005D1DRBR`
- Footprint: `Package_SON:WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm`
- 3D model: SON-8-EP(3x3) (KiCad packages3D, STEP)
- 3D model files: `tpa2005d1drbr-etched.step` / `tpa2005d1drbr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpa2005d1drbr.step` / `tpa2005d1drbr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tpa2005d1) (43 pp, sha256 `f5d959414918bfe7`, retrieved 2026-10-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpa2005d1drbr-datasheet.pdf)