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Contents

README

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TP6033ELX

Shenzhen JingYang · Power Distribution Switches · SOT23-5

TP6033ELX from Shenzhen JingYang, in a SOT23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OUT power_out Switch output, the source of the output P-channel MOSFET; typically connected to the switched side of the load and must be connected together to the load.
2 GND power_in Ground pin, to be connected to a strong ground plane that also serves as the heat sink for the device.
3 ILIM passive External resistor pin that sets the current-limit threshold, with a recommended 1% RILIM between 1kΩ and 30kΩ and ILIM = 6800/RILIM.
4 nEN input Active-low logic enable input that must be driven logic high or logic low and must never be left floating.
5 IN power_in Input supply and drain of the output MOSFET, which also powers the internal circuitry; operates from 2.5V to 5.5V.

Key specifications

Parameter Value
Manufacturer Shenzhen JingYang
Package SOT23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage VIN 2.5 5.5 V 4
Supply current, Enable IIN_ON 30 60 μA VIN=5.5V, No load on OUT 4
Reverse leakage current IREV 2 5 μA VOUT=5.5V, VIN=0V 4
EN input current InEN -0.5 5 10 μA VEN=5.5V or 0V 4
Over Current CC Regulation IOC 0.8 1 1.2 A RILIM=6.8kΩ, VIN=5V, VOUT=3.5V 4
Reverse voltage protection VREVERSE 5 20 50 mV VOUT-VIN 4
Input voltage (absolute maximum) -0.3 7 V Input Supply Voltage 2
All other pins voltages -0.3 V Upper limit printed as VIN+0.3 V 2
Junction temperature (absolute maximum) -40 160 °C Note 2 2
Storage temperature range -65 150 °C 2
Lead temperature (soldering) 260 °C Soldering, 10s 2
ESD Human Body Model VESD -2000 2000 V Human Body Model for all pins, JEDEC JS-001 3
Voltage range IN (recommended) 2.5 5.5 V 3
TJ operating junction temperature range TJ -40 125 °C 3
Junction-to-ambient thermal resistance 260 °C/W Junction-to-ambient; value placed in typ (column unlabeled) 2
Junction-to-case thermal resistance 120 °C/W Junction-to-case; value placed in typ (column unlabeled) 2
Output rise time TRISE 0.1 ms CL=1uF, RL=100ohm 4
Power switch on-resistance RDS_ON 60 mΩ IOUT=1A 4
Thermal shutdown temperature TNORMAL 150 °C 4
Thermal shutdown threshold hysteresis TNORMAL_HY 20 °C 4

CAD (KiCad official)

  • Symbol: TP6033ELX
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT23-5 (KiCad packages3D, STEP)
  • 3D model files: tp6033elx-etched.step / tp6033elx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tp6033elx.step / tp6033elx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JingYang datasheet (11 pp, sha256 897363921f8637be, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF