component
TN2540N3-G
Public Made by Adomby adom
Microchip Tech MOSFETs, TO-92-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TN2540N3-G
Microchip Tech · MOSFETs · TO-92-3
TN2540N3-G from Microchip Tech, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Source | passive | Source terminal of the N-channel enhancement-mode vertical DMOS FET; the datasheet gives Gate-to-Source voltage limited to ±20V (absolute maximum). |
| 2 | Gate | input | Gate terminal of the TN2540, with Gate-to-Source voltage limited to ±20V (absolute maximum) and Gate Threshold Voltage VGS(th) of 0.6 V minimum to 2 V maximum at VGS = VDS, ID = 1 mA. |
| 3 | Drain | passive | Drain terminal of the N-channel enhancement-mode vertical DMOS FET, with Drain-to-Source Breakdown Voltage BVDSS of 400 V minimum at VGS = 0V, ID = 100 µA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TO-92-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 2 | ||
| Operating Ambient Temperature | TA | -55 | 150 | °C | 2 | ||
| Storage Temperature | TS | -55 | 150 | °C | 2 | ||
| Drain-to-Source Breakdown Voltage | BVDSS | 400 | V | VGS = 0V, ID = 100 µA | 2 | ||
| Gate Threshold Voltage | VGS(th) | 0.6 | 2 | V | VGS = VDS, ID = 1 mA | 2 | |
| Change in VGS(th) with Temperature | ΔVGS(th) | -2.5 | -4 | mV/°C | VGS = VDS, ID = 1 mA (Note 1) | 2 | |
| Gate Body Leakage Current | IGSS | 100 | nA | VGS = ±20V, VDS = 0V | 2 | ||
| Zero-Gate Voltage Drain Current | IDSS | 10 | µA | VGS = 0V, VDS = Maximum rating | 2 | ||
| Zero-Gate Voltage Drain Current at 125°C | IDSS | 1 | mA | VDS = 0.8 Maximum rating, VGS = 0V, TA = 125°C (Note 1) | 2 | ||
| On-State Drain Current | ID(ON) | 0.3 | 0.5 | A | VGS = 4.5V, VDS = 25V | 2 | |
| On-State Drain Current | ID(ON) | 0.75 | 1 | A | VGS = 10V, VDS = 25V | 2 | |
| Static Drain-to-Source On-State Resistance | RDS(ON) | 8 | 12 | Ω | VGS = 4.5V, ID = 150 mA | 2 | |
| Change in RDS(ON) with Temperature | ΔRDS(ON) | 0.75 | %/°C | VGS = 10V, ID = 500 mA (Note 1) | 2 | ||
| Forward Transconductance | GFS | 125 | 200 | mmho | VDS = 25V, ID = 100 mA | 3 | |
| Input Capacitance | CISS | 95 | 125 | pF | VGS = 0V, VDS = 25V, f = 1 MHz | 3 | |
| Common-Source Output Capacitance | COSS | 20 | 70 | pF | 3 | ||
| Reverse Transfer Capacitance | CRSS | 10 | 25 | pF | 3 | ||
| Turn-On Delay Time | td(ON) | 20 | ns | VDD = 25V, ID = 1A, RGEN = 25Ω | 3 | ||
| Rise Time | tr | 15 | ns | 3 | |||
| Turn-Off Delay Time | td(OFF) | 25 | ns | 3 | |||
| Fall Time | tf | 20 | ns | 3 | |||
| Diode Forward Voltage Drop | VSD | 1.8 | V | VGS = 0V, ISD = 200 mA (Note 1) | 3 | ||
| Operating Ambient Temperature | TA | -55 | 150 | °C | 3 | ||
| Storage Temperature | TS | -55 | 150 | °C | 3 | ||
| Continuous Drain Current, 3-lead TO-92 | ID | 175 | mA | Continuous, limited by maximum rated TJ (Note 1) | 3 | ||
| Pulsed Drain Current, 3-lead TO-92 | ID | 2 | A | Pulsed | 3 | ||
| Power Dissipation at TA = 25°C, 3-lead TO-92 | 1 | W | TA = 25°C | 3 | |||
| Reverse Drain Current, 3-lead TO-92 | IDR | 175 | mA | Note 1 | 3 | ||
| Reverse Drain Pulsed Current, 3-lead TO-92 | IDRM | 2 | A | 3 | |||
| Thermal Resistance, Junction-to-Ambient, 3-lead TO-92 | θJA | 132 | °C/W | 3 | |||
| Reverse Recovery Time | trr | 300 | ns | VGS = 0V, ISD = 1A | 3 |
CAD (KiCad official)
- Symbol:
TN2540N3-G - Footprint:
Package_TO_SOT_THT:TO-92_Inline - 3D model: TO-92-3 (KiCad packages3D, STEP)
- 3D model files:
tn2540n3-g-etched.step/tn2540n3-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tn2540n3-g.step/tn2540n3-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (14 pp, sha256
7481d72821d5ce4f, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TN2540N3-G
**Microchip Tech** · MOSFETs · TO-92-3
TN2540N3-G from Microchip Tech, in a TO-92-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Source | passive | Source terminal of the N-channel enhancement-mode vertical DMOS FET; the datasheet gives Gate-to-Source voltage limited to ±20V (absolute maximum). |
| 2 | Gate | input | Gate terminal of the TN2540, with Gate-to-Source voltage limited to ±20V (absolute maximum) and Gate Threshold Voltage VGS(th) of 0.6 V minimum to 2 V maximum at VGS = VDS, ID = 1 mA. |
| 3 | Drain | passive | Drain terminal of the N-channel enhancement-mode vertical DMOS FET, with Drain-to-Source Breakdown Voltage BVDSS of 400 V minimum at VGS = 0V, ID = 100 µA. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | TO-92-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 2 |
| Operating Ambient Temperature | TA | -55 | | 150 | °C | | 2 |
| Storage Temperature | TS | -55 | | 150 | °C | | 2 |
| Drain-to-Source Breakdown Voltage | BVDSS | 400 | | | V | VGS = 0V, ID = 100 µA | 2 |
| Gate Threshold Voltage | VGS(th) | 0.6 | | 2 | V | VGS = VDS, ID = 1 mA | 2 |
| Change in VGS(th) with Temperature | ΔVGS(th) | | -2.5 | -4 | mV/°C | VGS = VDS, ID = 1 mA (Note 1) | 2 |
| Gate Body Leakage Current | IGSS | | | 100 | nA | VGS = ±20V, VDS = 0V | 2 |
| Zero-Gate Voltage Drain Current | IDSS | | | 10 | µA | VGS = 0V, VDS = Maximum rating | 2 |
| Zero-Gate Voltage Drain Current at 125°C | IDSS | | | 1 | mA | VDS = 0.8 Maximum rating, VGS = 0V, TA = 125°C (Note 1) | 2 |
| On-State Drain Current | ID(ON) | 0.3 | 0.5 | | A | VGS = 4.5V, VDS = 25V | 2 |
| On-State Drain Current | ID(ON) | 0.75 | 1 | | A | VGS = 10V, VDS = 25V | 2 |
| Static Drain-to-Source On-State Resistance | RDS(ON) | | 8 | 12 | Ω | VGS = 4.5V, ID = 150 mA | 2 |
| Change in RDS(ON) with Temperature | ΔRDS(ON) | | | 0.75 | %/°C | VGS = 10V, ID = 500 mA (Note 1) | 2 |
| Forward Transconductance | GFS | 125 | 200 | | mmho | VDS = 25V, ID = 100 mA | 3 |
| Input Capacitance | CISS | | 95 | 125 | pF | VGS = 0V, VDS = 25V, f = 1 MHz | 3 |
| Common-Source Output Capacitance | COSS | | 20 | 70 | pF | | 3 |
| Reverse Transfer Capacitance | CRSS | | 10 | 25 | pF | | 3 |
| Turn-On Delay Time | td(ON) | | | 20 | ns | VDD = 25V, ID = 1A, RGEN = 25Ω | 3 |
| Rise Time | tr | | | 15 | ns | | 3 |
| Turn-Off Delay Time | td(OFF) | | | 25 | ns | | 3 |
| Fall Time | tf | | | 20 | ns | | 3 |
| Diode Forward Voltage Drop | VSD | | | 1.8 | V | VGS = 0V, ISD = 200 mA (Note 1) | 3 |
| Operating Ambient Temperature | TA | -55 | | 150 | °C | | 3 |
| Storage Temperature | TS | -55 | | 150 | °C | | 3 |
| Continuous Drain Current, 3-lead TO-92 | ID | | | 175 | mA | Continuous, limited by maximum rated TJ (Note 1) | 3 |
| Pulsed Drain Current, 3-lead TO-92 | ID | | | 2 | A | Pulsed | 3 |
| Power Dissipation at TA = 25°C, 3-lead TO-92 | | | | 1 | W | TA = 25°C | 3 |
| Reverse Drain Current, 3-lead TO-92 | IDR | | | 175 | mA | Note 1 | 3 |
| Reverse Drain Pulsed Current, 3-lead TO-92 | IDRM | | | 2 | A | | 3 |
| Thermal Resistance, Junction-to-Ambient, 3-lead TO-92 | θJA | | 132 | | °C/W | | 3 |
| Reverse Recovery Time | trr | | 300 | | ns | VGS = 0V, ISD = 1A | 3 |
## CAD (KiCad official)
- Symbol: `TN2540N3-G`
- Footprint: `Package_TO_SOT_THT:TO-92_Inline`
- 3D model: TO-92-3 (KiCad packages3D, STEP)
- 3D model files: `tn2540n3-g-etched.step` / `tn2540n3-g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tn2540n3-g.step` / `tn2540n3-g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Microchip Tech datasheet](docs/tn2540n3-g-datasheet.pdf) (14 pp, sha256 `7481d72821d5ce4f`, retrieved 2026-11-02, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tn2540n3-g-datasheet.pdf)