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TN1605H-6T
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STMicroelectronics Thyristors (SCR)/Modules, TO-220AB-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TN1605H-6T
STMicroelectronics · Thyristors (SCR)/Modules · TO-220AB-3
TN1605H-6T from STMicroelectronics, in a TO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the SCR; RMS on-state current IT(RMS) is 16 A at Tc = 133 °C. |
| 2 | A | passive | Anode of the SCR, also connected to the tab; VDRM/VRRM is 600 V at Tj = 150 °C. |
| 3 | G | input | Gate trigger input; IGT is 6 mA max (VD = 12 V, RL = 33 Ω) and the maximum peak reverse gate voltage VRGM is 5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-220AB-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RMS on-state current | IT(RMS) | 16 | A | 180° conduction angle, Tc = 133 °C | 2 | ||
| Average on-state current | IT(AV) | 10 | A | 180° conduction angle, Tc = 133 °C | 2 | ||
| Average on-state current | IT(AV) | 8 | A | 180° conduction angle, Tc = 138 °C | 2 | ||
| Average on-state current | IT(AV) | 6 | A | 180° conduction angle, Tc = 142 °C | 2 | ||
| Non repetitive surge peak on-state current | ITSM | 153 | A | tp = 8.3 ms, Tj initial = 25 °C | 2 | ||
| Non repetitive surge peak on-state current | ITSM | 140 | A | tp = 10 ms | 2 | ||
| I2t value for fusing | I2t | 98 | A2s | tp = 10 ms | 2 | ||
| Critical rate of rise of on-state current | dI/dt | 100 | A/µs | IG = 2 x IGT, tr ≤ 100 ns, f = 60 Hz | 2 | ||
| Repetitive peak off-state voltage | VDRM/VRRM | 600 | V | Tj = 150 °C | 2 | ||
| Non repetitive surge peak off-state voltage | VDSM/VRSM | 700 | V | tp = 10 ms | 2 | ||
| Average gate power dissipation | PG(AV) | 1 | W | Tj = 150 °C | 2 | ||
| Maximum peak reverse gate voltage | VRGM | 5 | V | 2 | |||
| Peak gate current | IGM | 4 | A | tp = 20 µs, Tj = 150 °C | 2 | ||
| Peak gate power dissipation | PGM | 40 | W | tp = 20 µs, Tj = 150 °C | 2 | ||
| Storage junction temperature range | Tstg | -40 | 150 | °C | 2 | ||
| Operating junction temperature range | Tj | -40 | 150 | °C | 2 | ||
| Maximum lead temperature for soldering | TL | 260 | °C | during 10 s | 2 | ||
| Gate trigger current | IGT | 3.5 | 4.5 | 6 | mA | VD = 12 V, RL = 33 Ω, Tj = 25 °C | 2 |
| Gate trigger voltage | VGT | 1.3 | V | 2 | |||
| Gate non-trigger voltage | VGD | 0.15 | V | VD = 600 V, RL = 3.3 kΩ, Tj = 150 °C | 2 | ||
| Latching current | IL | 40 | mA | IG = 1.2 x IGT, Tj = 25 °C | 2 | ||
| Holding current | IH | 20 | mA | IT = 500 mA, gate open | 2 | ||
| On-state voltage | VTM | 1.6 | V | ITM = 32 A, tp = 380 µs, Tj = 25 °C | 3 | ||
| Threshold on-state voltage | VTO | 0.82 | V | Tj = 150 °C | 3 | ||
| Dynamic resistance | RD | 25 | mΩ | Tj = 150 °C | 3 | ||
| Repetitive peak off-state current | IDRM/IRRM | 5 | µA | VDRM = VRRM, Tj = 25 °C | 3 | ||
| Repetitive peak off-state current | IDRM/IRRM | 1.5 | mA | VDRM = VRRM, Tj = 125 °C | 3 | ||
| Repetitive peak off-state current | IDRM/IRRM | 3.1 | mA | VDRM = VRRM, Tj = 150 °C | 3 | ||
| Junction to case (DC) thermal resistance | Rth(j-c) | 1.1 | °C/W | DC | 3 | ||
| Junction to ambient (DC) thermal resistance | Rth(j-a) | 60 | °C/W | DC | 3 |
CAD (KiCad official)
- Symbol:
TN1605H-6T - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB-3 (KiCad packages3D, STEP)
- 3D model files:
tn1605h-6t-etched.step/tn1605h-6t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tn1605h-6t.step/tn1605h-6t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (9 pp, sha256
6a3f3a0f6fe8b394, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TN1605H-6T
**STMicroelectronics** · Thyristors (SCR)/Modules · TO-220AB-3
TN1605H-6T from STMicroelectronics, in a TO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the SCR; RMS on-state current IT(RMS) is 16 A at Tc = 133 °C. |
| 2 | A | passive | Anode of the SCR, also connected to the tab; VDRM/VRRM is 600 V at Tj = 150 °C. |
| 3 | G | input | Gate trigger input; IGT is 6 mA max (VD = 12 V, RL = 33 Ω) and the maximum peak reverse gate voltage VRGM is 5 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TO-220AB-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| RMS on-state current | IT(RMS) | | | 16 | A | 180° conduction angle, Tc = 133 °C | 2 |
| Average on-state current | IT(AV) | | | 10 | A | 180° conduction angle, Tc = 133 °C | 2 |
| Average on-state current | IT(AV) | | | 8 | A | 180° conduction angle, Tc = 138 °C | 2 |
| Average on-state current | IT(AV) | | | 6 | A | 180° conduction angle, Tc = 142 °C | 2 |
| Non repetitive surge peak on-state current | ITSM | | | 153 | A | tp = 8.3 ms, Tj initial = 25 °C | 2 |
| Non repetitive surge peak on-state current | ITSM | | | 140 | A | tp = 10 ms | 2 |
| I2t value for fusing | I2t | | | 98 | A2s | tp = 10 ms | 2 |
| Critical rate of rise of on-state current | dI/dt | | | 100 | A/µs | IG = 2 x IGT, tr ≤ 100 ns, f = 60 Hz | 2 |
| Repetitive peak off-state voltage | VDRM/VRRM | | | 600 | V | Tj = 150 °C | 2 |
| Non repetitive surge peak off-state voltage | VDSM/VRSM | | | 700 | V | tp = 10 ms | 2 |
| Average gate power dissipation | PG(AV) | | | 1 | W | Tj = 150 °C | 2 |
| Maximum peak reverse gate voltage | VRGM | | | 5 | V | | 2 |
| Peak gate current | IGM | | | 4 | A | tp = 20 µs, Tj = 150 °C | 2 |
| Peak gate power dissipation | PGM | | | 40 | W | tp = 20 µs, Tj = 150 °C | 2 |
| Storage junction temperature range | Tstg | -40 | | 150 | °C | | 2 |
| Operating junction temperature range | Tj | -40 | | 150 | °C | | 2 |
| Maximum lead temperature for soldering | TL | | | 260 | °C | during 10 s | 2 |
| Gate trigger current | IGT | 3.5 | 4.5 | 6 | mA | VD = 12 V, RL = 33 Ω, Tj = 25 °C | 2 |
| Gate trigger voltage | VGT | | | 1.3 | V | | 2 |
| Gate non-trigger voltage | VGD | 0.15 | | | V | VD = 600 V, RL = 3.3 kΩ, Tj = 150 °C | 2 |
| Latching current | IL | | | 40 | mA | IG = 1.2 x IGT, Tj = 25 °C | 2 |
| Holding current | IH | | | 20 | mA | IT = 500 mA, gate open | 2 |
| On-state voltage | VTM | | | 1.6 | V | ITM = 32 A, tp = 380 µs, Tj = 25 °C | 3 |
| Threshold on-state voltage | VTO | | | 0.82 | V | Tj = 150 °C | 3 |
| Dynamic resistance | RD | | | 25 | mΩ | Tj = 150 °C | 3 |
| Repetitive peak off-state current | IDRM/IRRM | | | 5 | µA | VDRM = VRRM, Tj = 25 °C | 3 |
| Repetitive peak off-state current | IDRM/IRRM | | | 1.5 | mA | VDRM = VRRM, Tj = 125 °C | 3 |
| Repetitive peak off-state current | IDRM/IRRM | | | 3.1 | mA | VDRM = VRRM, Tj = 150 °C | 3 |
| Junction to case (DC) thermal resistance | Rth(j-c) | | 1.1 | | °C/W | DC | 3 |
| Junction to ambient (DC) thermal resistance | Rth(j-a) | | 60 | | °C/W | DC | 3 |
## CAD (KiCad official)
- Symbol: `TN1605H-6T`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB-3 (KiCad packages3D, STEP)
- 3D model files: `tn1605h-6t-etched.step` / `tn1605h-6t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tn1605h-6t.step` / `tn1605h-6t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588896822727757824) (9 pp, sha256 `6a3f3a0f6fe8b394`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tn1605h-6t-datasheet.pdf)