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TMUX7201RQXR

Public Made by Adom

by adom

Texas Instruments , WSON-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TMUX7201RQXR

Texas Instruments · IC · WSON-8

TMUX7201RQXR from Texas Instruments, in a WSON-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source pin, can be an input or output; signal range from VSS to VDD.
2 NC unconnected No connection, not internally connected.
3 GND power_in Ground (0V) reference.
4 VDD power_in Most positive power-supply potential; connect a 0.1 µF to 10 µF decoupling capacitor between VDD and GND.
5 NC unconnected No connection, not internally connected.
6 SEL input Logic control input with internal pull-down resistor; controls the switch connection per the truth table.
7 VSS power_in Most negative power-supply potential, can be connected to ground in single-supply applications; connect a 0.1 µF to 10 µF decoupling capacitor between VSS and GND.
8 D passive Drain pin, can be an input or output; signal range from VSS to VDD.
9 Thermal Pad passive Thermal pad is not connected internally; no need to solder it, and if connected it should be left floating or tied to GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8
Category
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD-VSS VDD, VSS 48 V 4
Positive supply voltage VDD -0.5 48 V 4
Negative supply voltage VSS -48 0.5 V 4
Logic control input pin voltage VSEL -0.5 48 V SELx 4
Logic control input pin current ISEL -30 30 mA SELx 4
Diode clamp current IIK -30 30 mA 4
Ambient temperature TA -55 150 °C 4
Storage temperature Tstg -65 150 °C 4
Junction temperature TJ 150 °C 4
ESD HBM V(ESD) -2000 2000 V Human body model, ANSI/ESDA/JEDEC JS-001, all pins 4
ESD CDM V(ESD) -500 500 V Charged device model, ANSI/ESDA/JEDEC JS-002, all pins 4
Junction-to-ambient thermal resistance RθJA 62.9 °C/W RQX (WQFN) 8 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 54 °C/W RQX (WQFN) 8 pins 5
Junction-to-board thermal resistance RθJB 31 °C/W RQX (WQFN) 8 pins 5
Junction-to-top characterization parameter ΨJT 0.8 °C/W RQX (WQFN) 8 pins 5
Junction-to-board characterization parameter ΨJB 30.9 °C/W RQX (WQFN) 8 pins 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 23.4 °C/W RQX (WQFN) 8 pins 5
Power supply voltage differential VDD, VSS 4.5 44 V 5
Positive power supply voltage VDD 4.5 44 V 5
Address or enable pin voltage VSEL 0 44 V 5
Ambient temperature TA -40 125 °C 5
Continuous current per channel, 44V single supply IDC 650 mA RQX, +44V Single Supply, TA = 25°C 5
Continuous current per channel, ±15V dual supply IDC 600 mA RQX, ±15V Dual Supply, TA = 25°C 5
Continuous current per channel, 44V single supply, 125°C IDC 165 mA RQX, +44V Single Supply, TA = 125°C 5
Logic voltage high VIH 1.3 44 V -40°C to +125°C 6
Logic voltage low VIL 0 0.8 V -40°C to +125°C 6
Input leakage current high (±15V supply) IIH 0.4 2 µA -40°C to +125°C 6
Input leakage current low IIL -0.1 -0.005 µA -40°C to +125°C 6
Logic input capacitance CIN 3.5 pF -40°C to +125°C 6
On-resistance, ±15V, 25°C RON 1.2 1.7 Ω VDD=+15V±10%, VSS=-15V±10%, VS = -10V to +10V, ID = -10mA, 25°C 6
On-resistance, ±15V, -40 to 85°C RON 2 Ω VS = -10V to +10V, ID = -10mA, -40°C to +85°C 6
On-resistance, ±15V, -40 to 125°C RON 2.5 Ω VS = -10V to +10V, ID = -10mA, -40°C to +125°C 6
On-resistance flatness, ±15V, 25°C RON FLAT 0.3 0.5 Ω VS = -10V to +10V, ID = -10mA, 25°C 6
Source off leakage current, ±15V, 25°C IS(OFF) -0.3 0.05 0.3 nA VDD = 16.5V, VSS = -16.5V, switch off, VS = +10V / -10V, VD = -10V / +10V, 25°C 6
Source off leakage current, ±15V, 125°C IS(OFF) -33 33 nA VDD = 16.5V, VSS = -16.5V, switch off, VS = +10V / -10V, VD = -10V / +10V, -40°C to +125°C 6
Channel on leakage current, ±15V, 25°C IS(ON), ID(ON) -0.65 0.05 0.65 nA VDD = 16.5V, VSS = -16.5V, switch on, VS = VD = ±10V, 25°C 6
VDD supply current, ±15V, 25°C IDD 30 45 µA VDD = 16.5V, VSS = -16.5V, Logic inputs = 0V, 5V, or VDD, 25°C 6
VDD supply current, ±15V, 125°C IDD 55 µA VDD = 16.5V, VSS = -16.5V, Logic inputs = 0V, 5V, or VDD, -40°C to +125°C 6
VSS supply current, ±15V, 25°C ISS 7 12 µA VDD = 16.5V, VSS = -16.5V, Logic inputs = 0V, 5V, or VDD, 25°C 6
Turn-on time, ±15V, 25°C tON 120 140 ns VS = 10V, RL = 300Ω, CL = 35pF, 25°C 7
Turn-off time, ±15V, 25°C tOFF 130 150 ns VS = 10V, RL = 300Ω, CL = 35pF, 25°C 7
Charge injection, ±15V QINJ -15 pC VS = 0V, CL = 100pF, 25°C 7
On-resistance, ±20V, 25°C RON 1 1.5 Ω VDD=+20V±10%, VSS=-20V±10%, VS = -15V to +15V, ID = -10mA, 25°C 8
On-resistance, ±20V, -40 to 125°C RON 2.3 Ω VS = -15V to +15V, ID = -10mA, -40°C to +125°C 8
VDD supply current, ±20V, 25°C IDD 38 50 µA VDD = 22V, VSS = -22V, Logic inputs = 0V, 5V, or VDD, 25°C 8
On-resistance, 44V single, 25°C RON 1.2 1.6 Ω VDD = +44V, VSS = 0V, VS = 0V to 40V, ID = -10mA, 25°C 10
On-resistance, 44V single, -40 to 125°C RON 2.4 Ω VS = 0V to 40V, ID = -10mA, -40°C to +125°C 10
Source off leakage current, 44V single, 25°C IS(OFF) -1 0.05 1 nA VDD = 44V, VSS = 0V, switch off, VS = 40V / 1V, VD = 1V / 40V, 25°C 10
VDD supply current, 44V single, 25°C IDD 30 56 µA VDD = 44V, VSS = 0V, Logic inputs = 0V, 5V, or VDD, 25°C 10
VDD supply current, 44V single, 125°C IDD 68 µA VDD = 44V, VSS = 0V, Logic inputs = 0V, 5V, or VDD, -40°C to +125°C 10
On-resistance, 12V single, 25°C RON 2.1 3.2 Ω VDD = +12V±10%, VSS = 0V, VS = 0V to 10V, ID = -10mA, 25°C 12
On-resistance, 12V single, -40 to 125°C RON 4.2 Ω VS = 0V to 10V, ID = -10mA, -40°C to +125°C 12
VDD supply current, 12V single, 25°C IDD 27 35 µA VDD = 13.2V, VSS = 0V, Logic inputs = 0V, 5V, or VDD, 25°C 12
Turn-on time, 12V single, 25°C tON 125 145 ns VS = 8V, RL = 300Ω, CL = 35pF, 25°C 13

CAD (KiCad official)

  • Symbol: TMUX7201RQXR
  • Footprint: Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
  • 3D model: WSON-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal QFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tmux7201rqxr-etched.step / tmux7201rqxr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmux7201rqxr.step / tmux7201rqxr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 9ab141e2ed42ffd8, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF