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Ray Initial commit: component/tmux1309qbqbrq1 feb2453 4d ago

TMUX1309QBQBRQ1

Texas Instruments · Analog Switches, Multiplexers · DHVQFN-16-EP(2.5x3.5)

TMUX1309QBQBRQ1 from Texas Instruments, in a DHVQFN-16-EP(2.5x3.5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S0B bidirectional Multiplexer B source pin 0 supporting bidirectional signal paths (input or output).
2 S2B bidirectional Multiplexer B source pin 2 supporting bidirectional signal paths (input or output).
3 DB bidirectional Multiplexer B common drain pin supporting bidirectional signal paths (input or output).
4 S3B bidirectional Multiplexer B source pin 3 supporting bidirectional signal paths (input or output).
5 S1B bidirectional Multiplexer B source pin 1 supporting bidirectional signal paths (input or output).
6 EN input Low-level valid logic input; all switches disabled when high, A[1:0] address selects active switch when low.
7 N.C. unconnected No internal connection.
8 GND power_in Ground (0V) reference for device operation.
9 A1 input Address line 1 for address selection controlling which switch is active per truth table (Table 8-2).
10 A0 input Address line 0 for address selection controlling which switch is active per truth table (Table 8-2).
11 S3A bidirectional Multiplexer A source pin 3 supporting bidirectional signal paths (input or output).
12 S0A bidirectional Multiplexer A source pin 0 supporting bidirectional signal paths (input or output).
13 DA bidirectional Multiplexer A common drain pin supporting bidirectional signal paths (input or output).
14 S1A bidirectional Multiplexer A source pin 1 supporting bidirectional signal paths (input or output).
15 S2A bidirectional Multiplexer A source pin 2 supporting bidirectional signal paths (input or output).
16 VDD power_in Positive power supply voltage range 1.62V to 5.5V; connect 0.1µF to 10µF bypass capacitor between VDD and GND.
17 Thermal Pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package DHVQFN-16-EP(2.5x3.5)
Category Interface
Pins 17

CAD (KiCad official)

  • Symbol: TMUX1309QBQBRQ1
  • Footprint: Package_DFN_QFN:DHVQFN-16-1EP_2.5x3.5mm_P0.5mm_EP1x2mm
  • 3D model: DHVQFN-16-EP(2.5x3.5), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal VQFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tmux1309qbqbrq1-etched.step / tmux1309qbqbrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tmux1309qbqbrq1.step / tmux1309qbqbrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (51 pp, sha256 eaf141da641fd985, retrieved 2026-10-01, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF